IC,LATCH,SINGLE,8-BIT,ACT-CMOS,SSOP,20PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | SSOP, SSOP20,.25 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D LATCH |
| 最大I（ol） | 0.024 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP20,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 8 ns |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74ACTQ373QSCQR | 54ACTQ373FMQB | 54ACQ373FMQB | 54ACTQ373LMQB | 74ACTQ373PCQR | 74ACQ373PCQR | 74ACQ373SCQR | 74ACTQ373SCQR | 74ACQ373QSCQR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,LATCH,SINGLE,8-BIT,ACT-CMOS,SSOP,20PIN,PLASTIC | IC ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver | IC AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver | IC ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Bus Driver/Transceiver | IC ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, PLASTIC, DIP-20, Bus Driver/Transceiver | IC AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, PLASTIC, DIP-20, Bus Driver/Transceiver | IC AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, SOIC-20, Bus Driver/Transceiver | IC ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, SOIC-20, Bus Driver/Transceiver | IC,LATCH,SINGLE,8-BIT,AC-CMOS,SSOP,20PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | SSOP, SSOP20,.25 | DFP, FL20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | SSOP, SSOP20,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| JESD-30 代码 | R-PDSO-G20 | R-GDFP-F20 | R-GDFP-F20 | S-CQCC-N20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D LATCH | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | D LATCH |
| 最大I（ol） | 0.024 A | 0.024 A | 0.012 A | 0.024 A | 0.024 A | 0.012 A | 0.012 A | 0.024 A | 0.012 A |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | DFP | DFP | QCCN | DIP | DIP | SOP | SOP | SSOP |
| 封装等效代码 | SSOP20,.25 | FL20,.3 | FL20,.3 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | SOP20,.4 | SOP20,.4 | SSOP20,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
| 电源 | 5 V | 5 V | 3.3/5 V | 5 V | 5 V | 3.3/5 V | 3.3/5 V | 5 V | 3.3/5 V |
| 表面贴装 | YES | YES | YES | YES | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | FLAT | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | National Semiconductor（TI ） | - | - | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Prop。Delay @ Nom-Sup | 8 ns | 11.5 ns | 15 ns | 11.5 ns | 8 ns | 12.5 ns | 11 ns | 8 ns | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 3 V | 5 V | 5 V | 3.3 V | 3.3 V | 5 V | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 系列 | - | ACT | AC | ACT | ACT | AC | AC | ACT | - |
| 端口数量 | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - |
| 输出极性 | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 传播延迟（tpd） | - | 11.5 ns | 16 ns | 11.5 ns | 9 ns | 12.5 ns | 12.5 ns | 9 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 2.286 mm | 2.286 mm | 1.905 mm | 5.08 mm | 5.08 mm | 2.65 mm | 2.65 mm | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 6 V | 5.5 V | 5.5 V | 6 V | 6 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 4.5 V | 2 V | 4.5 V | 4.5 V | 2 V | 2 V | 4.5 V | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 6.731 mm | 6.731 mm | 8.89 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | - |
| 长度 | - | - | - | 8.89 mm | 24.892 mm | 24.892 mm | 12.8 mm | 12.8 mm | - |
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