HSDL-3203
Small Profile Package IrDA® Data Compliant
Low Power 115.2 kbit/s Infrared Transceiver
Data Sheet
Description
The HSDL-3203 is a miniature low cost infrared trans-
ceiver module that provides the interface between
logic and infrared (IR) signals for through air, serial,
half-duplex IR data link. The module is compliant to
IrDA Physical Layer Specifications version 1.4 Low
Powerfrom 9.6 kbit/s to 115.2 kbit/s with
extended link distance and it is IEC 825-Class 1 eye
safe.
The HSDL-3203 can be shutdown completely to
achieve very low power consumption. In the shutdown
mode, the PIN diode will be inactive and thus produc-
ing very little photocurrent even under very bright
ambient light. Such features are ideal for battery
operated handheld products.
Features
• Fully compliant to IrDA 1.4 low power specification
from 9.6 kbit/s to 115.2 kbit/s
• Low power operation at extended link distance of 50 cm
• Miniature package
— Height: 1.95 mm
— Width: 8.00 mm
— Depth: 3.10 mm
• Guaranteed temperature performance, –20 to +70˚C
— Critical parameters are guaranteed over
temperature and supply voltage
• Low power consumption
— Low shutdown current (10 nA typical)
— Complete shutdown of TXD, RXD, and PIN diode
• Withstands > 100 mV
p-p
power supply ripple typically
• V
CC
supply 2.7 to 3.6 volts
• Integrated EMI shield
• LED stuck-high protection
• Designed to accommodate light loss with cosmetic
windows
• IEC 825-Class 1 Eye Safe
• Lead-free and RoHS Compliant
Applications
• Mobile telecom
— Mobile phones
— Pagers
— Smart phone
• Data communication
— PDAs
— Portable printers
• Digital imaging
— Digital cameras
— Photo-imaging printers
• Electronic wallet, IrFM
Application Support
Information
The Application Engineering
group in Avago Technologies is
available to assist you with the
technical understanding associ-
ated with HSDL-3203 infrared
transceiver module. You can con-
tact them through your local
Avago sales representative for
additional details.
Ordering Information
Part Number
HSDL-3203-021
Packaging Type
Tape and Reel
Package
Front View
Quantity
2500
V
CC
R1
LED A 8
LED
DRIVER
TXD 7
V
CC
C1
6.8 µF
V
CC
6
RXD 5
SHIELD
GND 4
AGND 3
V
CC
SD 2
RX PULSE
SHAPER
CX 1
C2
100 nF
8
7
6
5
4
3
2
1
Figure 1. Functional block diagram of HSDL-3203.
Figure 2. Rear view diagram with pin-out.
2
I/O Pin Configuration Table
Pin
1
2
3
4
5
6
7
8
–
Symbol
CX
SD
AGND
GND
RXD
V
CC
TXD
LED A
Shield
I/O
I
I
I
I
O
I
I
I
–
Description
Pin bypass capacitor
Shutdown. Active high
Analog ground
Ground
Receiver data output. Active low
Supply voltage
Transmitter data input. Active high
LED anode
EMI shield
Note
1
2
2
3
4
5
6
7
Notes:
1. Complete shutdown TXD, RXD, and PIN diode.
2. Connect to system ground.
3. Output is active low pulse response when light pulse is seen.
4. Regulated, 2.7 to 3.6 volt.
5. Logic high turns on the LED. If held high longer than
∼50 µs,
the LED is turned off
automatically. TXD must be driven either high or low. DO NOT leave the pin floating.
6. Tied through external resistor, R1, to regulate V
CC
from 2.7 to 3.6 volt.
7. Connect to system ground via a low inductance trace. For best performance, do not connect
to GND directly at the part.
Recommended Application Circuit Components
Component
R1
R1
C1
C2
Recommended Value
30
Ω, ±
1%, 0.125 Watt
5.6
Ω, ±
1%, 0.125 Watt
6.8
µF, ±
20%, Tantalum
100 nF,
±
20%, X7R Ceramic
Note
8
9
10
Marking Information
The unit is marked with the
letters "A" and the datacode
"YWW" on the shield for front
options where Y is the last digit
of the year, and WW is the
workweek.
Notes:
8. To obtain I
LED
of 50 mA for V
LED
of 3 V.
9. To obtain I
LED
of 250 mA for V
LED
of 3 V.
10. C1 must be placed within 0.7 cm of the HSDL-3203 to obtain optimum noise immunity.
Transceiver I/O Truth Table
Inputs
TXD
High
Low
Low
Don't Care
Light Input to Receiver
Don't Care
High
Low
Don't Care
SD
Low
Low
Low
High
Outputs
LED
On
Off
Off
Off
RXD
Not Valid
Low
High
High
Note
11, 12
Notes:
11. In-band IrDA signals and data rates
≤
115.2 kbit/s.
12. RXD logic low is a pulsed response. The condition is maintained for a duration independent of pattern and strength of the incident intensity.
Caution:
The BiCMOS inherent to the design of this component increases the component's susceptibility
to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in
handling and assembly of this component to prevent damage and/or degradation, which may be
induced by ESD.
3
Absolute Maximum Ratings
For implementation where case to ambient thermal resistance is
≤
50˚C/W.
Parameter
Symbol
Min.
Max.
Storage Temperature
T
S
–40
100
Operating Temperature
T
A
–25
85
DC LED Current
I
LED
(DC)
20
Peak LED Current
LED Anode Voltage
Supply Voltage
Input Voltage TXD, SD
Output Voltage RXD
I
LED
(PK)
V
LEDA
V
CC
V
I
V
O
–0.5
0
0
–0.5
250
7
7
V
CC
+ 0.5
V
CC
+ 0.5
Units
˚C
˚C
mA
mA
V
V
V
V
Conditions
≤
90
µs
Pulse Width
≤
25% Duty Cycle
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Logic High Voltage TXD, SD
Logic Low Voltage TXD, SD
Logic High Receiver Input Irradiance
Logic Low Receiver Input Irradiance
LED Current Pulse Amplitude
Receiver Signal Rate
Symbol
T
A
V
CC
V
IH
V
IL
EI
H
EI
L
I
LEDA
Min.
–25
2.7
2/3 V
CC
0
0.0081
50
9.6
Max.
85
3.6
V
CC
1/3 V
CC
500
0.3
250
115.2
Units
˚C
V
V
V
mW/cm
2
µW/cm
2
mA
kbit/s
Conditions
Note
For in-band signals
For in-band signals
Guaranteed at 25˚C
13
13
Note:
13. An in-band optical signal is a pulse/sequence where the peak wavelength,
λp,
is defined as 850 nm
≤ λp ≤
900 nm, and the pulse characteristics
are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
4
Electrical and Optical Specifications
Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions
can be anywhere in their operating range. All typical values are at 25˚C and 3.0 V unless otherwise noted.
Parameter
Symbol Min.
Typ. Max. Units
Conditions
Note
Receiver
RXD Output Voltage Logic Low V
OL
0
0.4
V
I
OL
= 200
µA,
for in-band EI
14
Logic High V
OH
V
CC
V
CC
V
I
OH
= 200
µA,
for in-band
–0.2
EI
≤
0.3
µW/cm
2
Viewing Angle
2φ
1/2
30
˚
Logic High Receiver Input
EI
H
0.0081
500
mW/cm
2
For in-band signals
≤
115.2 kbit/s 13
Irradiance
Logic Low Receiver Input
EI
L
0.3
µW/cm
2
For in-band signals
13
Irradiance
Peak Sensitivity Wavelength
λp
880
nm
RXD Pulse Width
RXD Rise and Fall Times
Receiver Latency Time
Receiver Wake Up Time
Transmitter
Radiant Intensity
tpw
t
r
, t
f
t
L
t
W
EI
H
4
22.5
Peak Wavelength
Spectral Line Half Width
Viewing Angle
Optical Pulse Width
Optical Rise and Fall Times
Maximum Optical Pulse Width
LED Anode ON State Voltage
LED Anode OFF State Leakage
Transceiver
TXD and SD Input
Currents
Supply Current
λp
∆λ
1/2
2θ
1/2
tpw
tr (EI)
tf (EI)
tpw
(max)
V
ON
(LEDA)
I
LK
(LEDA)
I
L
I
H
I
CCI
I
CC2
I
CC3
875
35
30
1.5
1.6
60
2
600
50
1.5
0.01
1.0
1.5
2.5
25
25
50
8
4.0
100
50
100
28.8
µs
ns
µs
µs
mW/sr
mW/sr
nm
nm
˚
µs
ns
µs
V
µA
I
LEDA
= 50 mA, T
A
= 25˚C,
θ
1/2
≤
15˚
I
LEDA
= 250 mA, T
A
= 25˚C,
θ
1/2
≤
15˚
14
tpw(EI) = 1.6
µs,
C
L
= 10 pF
14
15
tpw(TXD) = 1.6
µs
tpw(TXD) = 1.6
µs
TXD pin stuck high
I
LEDA
= 50 mA,
V
IH
(TXD) = 2.7 V
V
LEDA
= V
CC
= 3.6 V,
V
I
(TXD)
≤
1/3 V
CC
0
≤
V
I
≤
1/3 V
CC
V
I
≥
2/3 V
CC
V
CC
= 3.6 V, V
SD
≥
V
CC
–0.5
V
CC
= 3.6 V, V
I
(TXD)
≤
1/3 V
CC
,
EI = 0
V
CC
= 3.6 V, V
I
(TXD)≤ 1/3 V
CC
20
Logic Low
Logic High
Shutdown
Idle
Active
Receiver
–1
–0.01
0.01
10
2.5
2.6
1
1
200
4
5
µA
µA
nA
mA
mA
16
Notes:
14. For in-band signals
≤
115.2 kbit/s where 8.1
µW/cm
2
≤
EI
≤
500 mW/cm
2
.
15. Wake up time is measured from SD pin HIGH to LOW transition or V
CC
power ON to valid RXD output.
16. Typical value is at EI = 10 mW/cm
2
, maximum value is at EI = 500 mW/cm
2
.
5
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