Agilent HLMA-SH05
2 mm x 5 mm Rectangular
AlInGaP Lamps
Data Sheet
Features
• Rectangular light emitting surface
• Excellent for flush mounting on
panels
• Long life: solid state reliability
• Excellent uniformity of light output
Description
The HLMA-SH05 is an epoxy
encapsulated lamp in rectangular
package which are easily stacked
in arrays or used for discrete
front panel indicators. Contrast
and light uniformity are enhanced
by a special epoxy diffusion and
tinting process.
Technology
This 2x5 rectangular solid state
lamp utilizes the newly developed
Aluminum Indium Gallium
Phosphide (AlInGaP) LED
technology. This material has a
very high luminous efficiency,
capable of producing high light
output over a wide range of drive
currents.
Package Dimensions
5.18 (0.204)
4.93 (0.194)
5.46 (0.215)
4.95 (0.195)
CATHODE
LEAD
26.40 (1.00)
MIN.
1.27 (0.060)
NOMINAL
8.00 (0.315)
7.37 (0.290)
Device Selection Guide
Package Description
Rectangular, 2mm x 5 mm,
Tinted, Diffused
Viewing Angle
2q
1/2
110
Dominant
Wavelength
615 nm
2.23 (0.088)
1.98 (0.078)
SIDE VIEW
0.46 (0.018) SQ.
NOMINAL
2.54 (0.100)
NOMINAL
BOTTOM VIEW
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. AN EPOXY MENISCUS MAY EXTEND ABOUT
1 mm (0.040") DOWN THE LEADS.
3. THERE IS A MAXIMUM 1° TAPER FROM
BASE TO THE TOP OF LAMP.
2.41 (0.095)
2.03 (0.085)
Absolute Maximum Ratings
DC Forward Current
[1]
Peak Forward Current
[2]
Average Forward Current
(at I
PEAK
= 200 mA, f
≥
1 KHz)
[2]
Transient Forward Current
[3]
(10
µs
Pulse)
Reverse Voltage (I
R
= 100
µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
50 mA
200 mA
45 mA
500 mA
5V
110°C
-40 to +100°C
-55 to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Refer to Figure 5 to establish pulsed operating conditions.
3. The transient peak current is the maximum non-recurring peak current the device can withstand
without damaging the LED die and wire bonds.
1.0
I
F
– FORWARD CURRENT – mA
200
AMBER
RELATIVE INTENSITY
REDDISH
ORANGE
100
50
20
10
5
2
1
0.5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.5
0
550
594
600
621
630
650
700
WAVELENGTH – nm
V
F
– FORWARD VOLTAGE – V
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
2.5
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
60
I
F
– FORWARD CURRENT – mA
50
45
40
35
30
25
20
15
10
5
0
Rθ
JA
= 412 °C/W
Rθ
JA
= 618 °C/W
I
AVG
– AVERAGE CURRENT – mA
f > 1 KHz
50
40
30
f > 100 Hz
20
10
0
50
f > 300 Hz
2.0
1.5
1.0
0.5
0
0
10
20
30
40
50
0 10 20 30 40 50 60 70 80 90 100
T
A
– AMBIENT TEMPERATURE – °C
100
150
200
I
F
– DC FORWARD CURRENT – mA
I
PEAK
– PEAK FORWARD CURRENT – mA
Figure 3. Relative luminous intensity vs.
foward current.
Figure 4. Maximum forward current vs.
ambient temperature. Derating based on
T Max = 110°C.
Figure 5. Maximum average current vs. peak
foward current.
2
Optical Characteristics at T
A
= 25°C
Luminous Intensity
I
V
(mcd) @ 20 mA
Min.
Typ.
8
20
Peak Wavelength
l
peak
(nm)
Typ.
621
Color, Dominant
Wavelength
l
d[1]
(nm)
Typ.
615
Viewing Angle
2q
1/2
Degrees
[2]
Typ.
110
Luminous
Efficacy
h
v
(lm/w)
263
Part Number
HLMA-
SH05
Notes:
1. The dominant wavelength,
l
d
, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2.
q
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at T
A
= 25°C
Forward Voltage
V
F
(Volts)
@ I
F
= 20 mA
Min.
Typ.
1.9
2.4
Reverse
Breakdown
V
R
(Volts)
@ I
R
= 100
µA
Min.
Typ.
5
20
Capacitance
C (pF)
V
F
= 0,
f = 1 MHz
Typ.
40
Speed of Response
ts
(ns)
Time Constant
e-
t/ts
Typ.
13
Part
Number
HLMA-
SH05
Thermal
Resistance
Rq
J-PIN
(°C/W)
260
1.0
0.9
NORMALIZED INTENSITY
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
100°90° 80° 70° 60° 50° 40° 30° 20° 10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
ANGULAR DISPLACEMENT – DEGREES
Figure 6.
3
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering conditions:
Wave Soldering
105
°C
Max.
30 sec Max.
250
°C
Max.
3 sec Max.
Manual Solder
Dipping
–
–
260
°C
Max.
5 sec Max.
• Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
Note:
Refer to application note AN1027 for more
information on soldering LED components.
TURBULENT WAVE
250
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
TEMPERATURE –
°C
200
150
FLUXING
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
100
50
30
0
10
PREHEAT
20
30
40
50
60
70
80
90
100
TIME – SECONDS
Figure 7. Recommended wave soldering profile.
4
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/Interna-
tional), or 0120-61-1280(Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2002-2005 Agilent Technologies, Inc.
Obsoletes 5989-3269EN
November 14, 2005
5989-4267EN
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