HLMP-NS31 and HLMP-NM31
T- (3mm) InGaN LED Lamps
Data Sheet
Description
These InGaN lamps are designed in industry standard
package with clear and non-diffused optics. These lamps
are ideal for use as indicator and for general purpose
lighting.
Features
•
General purpose LED
•
Reliable and rugged
•
Binned for color and intensity
•
Bright InGaN dice
Package Dimensions
4.40 ± 0.30
3.10 ± 0.20
Applications
•
Status indicator
•
Small message panel
•
Running and decorative lights for commercial use
•
Back lighting
•
Consumer audio
3.50 ± 0.30
2.00
5.85 ± 0.50
0.65 MAX.
23.0 MIN.
+ 0.10
0.45 - 0.04
1.0 MIN.
2.54 ± 0.30
0.44
± 0.20
3.40 ± 0.20
+ 0.10
0.40 - 0
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040”) DOWN THE
LEADS.
CATHODE
MARKS
Caution: DeviCes are Class 1 esD sensitive. Please observe aPProPriate PreCautions During
hanDling anD ProCessing. refer to aPPliCation note an-1142 for aDDitional Details
Selection Guide
Part Number
HLMP-NS3-J00xx
HLMP-NM3-R00xx
Color and Dominant
Wavelength λd (nm) Typ.
Blue 470
Green 59
Luminous Intensity, Iv (mcd) at 20 mA
Min.
40
500
Typ.
600
800
Viewing Angle,
2Θ½ (degree)
30
Tinting Type
Un-tinted; non-diffused
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package
2. The tolerance for intensity limit is ± 15%
3. The optical axis is closely aligned with the package mechanical axis
4. The dominant wavelength,
ld,
is derived from the Chromaticity Diagram and represents the color of the lamp.
Absolute Maximum Ratings, T
A
=25°C
Parameter
DC Forward Current
[]
Peak Forward Current
Reverse Voltage (I
R
= 0μA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Notes:
1. Derate linearly as shown in Figure 5
Blue /Green
30
00
5
5
-40 to +85
-40 to +85
Unit
mA
mA
V
°C
°C
°C
Electrical/Optical Characteristics
Parameter
Forward Voltage
Reverse Voltage
Dominant wavelength
Peak wavelength
Thermal Resistance
Symbol
V
F
V
R
λ
d
λ
peak
RΘ
J-PIN
NS3
NM3
NS3
NM3
Min.
3.0
5
460
50
470
59
464
59
90
480
540
Typ.
3.3
Max.
4.0
Units
V
V
nm
nm
°C/W
Test Condition
I
F
= 0 mA
I
R
= 0 μA
I
F
= 0 mA
Peak of wavelength of spectral
distribution at I
F
= 0 mA
Notes:
1. The dominant wavelength λd is derived from the Chromaticity Diagram and represents the color of the lamp.
2. Tolerance for each color bin limit is ± 0.5 nm
1.0
0.9
0.8
1.0
0.9
0.8
RELATIVE INTENSITY
430
480
WAVELENGTH - nm
530
580
RELATIVE INTENSITY
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
400
450
500
550
WAVELENGTH - nm
600
650
Figure 1. Relative Intensity vs wavelength for HLMP-NS31
Figure 2. Relative Intensity vs wavelength for HLMP-NM31
30
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
25
FORWARD CURRENT - mA
20
15
10
5
0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
10
15
20
25
DC FORWARD CURRENT - mA
30
35
0
1
2
FORWARD VOLTAGE - V
3
4
Figure 3. Forward Current vs Forward Voltage
Figure 4. Relative Intensity vs Forward Current
40
1
0.9
0.8
IF - FORWARD CURRENT - mA
30
NORMALIZED INTENSITY
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
20
RJ-A=780°C/W
10
0
0
20
40
60
80
VF - FORWARD VOLTAGE - VOLTS
100
-60
-30
0
30
ANGULAR DISPLACEMENT - DEGREES
60
90
Figure 5. Maximum Forward current vs Ambient temperature based on TJ=110°C
Figure 6. Radiation pattern
3
Precautions:
Lead Forming:
•
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
•
If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attached and wirebond.
•
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
•
Wave soldering parameter must be set and maintain
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
•
If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
•
Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25 ºC before handling.
•
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
•
Recommended PC board plated through hole size for
LED component leads:
LED component
lead size
0.457 x 0.457 mm
(0.05 inch)
0.508 x 0.508 mm
(0.08 inch)
Diagonal
(0.08 x 0.08 inch)
0.976 to .078 mm
(0.00 x 0.00 inch)
.049 to .50 mm
Plated through
hole diameter
0.646 mm
(0.038 to 0.04 inch)
0.78 mm
(0.04 to 0.045 inch)
Soldering Condition:
•
Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
•
The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for those
parts without standoffs.
•
Recommended soldering condition:
Wave Soldering
Pre-heat temperature
Pre-heat time
Peak temperature
Dwell time
05 ºC Max.
30 sec Max.
50 ºC Max.
3 sec Max.
Manual Solder
Dipping
-
-
60 ºC Max.
5 sec Max.
Note: Refer to application note AN1027 for more information on
soldering LED components.
TURBULENT WAVE
250
LAMINAR WAVE
HOT AIR KNIFE
200
TEMPERATURE - °C
BOTTOM SIDE
OF PC BOARD
150
FLUXING
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40 °
SOLDER: SN63; FLUX: RMA
PREHEAT
10
20
304
0
50
607
0
809
0
100
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
TIME - SECONDS
TOP SIDE OF
PC BOARD
50
30
0
5
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