CDIP-24, Tube
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | CDIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| 制造商包装代码 | SD24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ |
| 边界扫描 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 32.004 mm |
| 低功率模式 | NO |
| 湿度敏感等级 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出数据总线宽度 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 21.8 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 |
| 5962-8873601LA | 5962-8873603LA | 5962-88736033A | 5962-88736013A | 5962-8873603KA | 5962-8873601KA | |
|---|---|---|---|---|---|---|
| 描述 | CDIP-24, Tube | CDIP-24, Tube | LCC-28, Tube | LCC-28, Tube | Pipeline Register, 8-Bit, CMOS, CDFP24, CERPACK-24 | Pipeline Register, 8-Bit, CMOS, CDFP24, CERPACK-24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | CDIP | CDIP | LCC | LCC | DFP | DFP |
| 包装说明 | DIP, DIP24,.3 | 0.300 INCH, CERDIP-24 | LCC-28 | LCC-28 | DFP, FL24,.4 | DFP, FL24,.4 |
| 针数 | 24 | 24 | 28 | 28 | 24 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ |
| 边界扫描 | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | R-GDFP-F24 | R-GDFP-F24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 低功率模式 | NO | NO | NO | NO | NO | NO |
| 端子数量 | 24 | 24 | 28 | 28 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | QCCN | QCCN | DFP | DFP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | FL24,.4 | FL24,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK |
| 峰值回流温度（摄氏度） | 240 | 240 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | 2.286 mm | 2.286 mm |
| 最大压摆率 | 21.8 mA | 21.8 mA | 21.8 mA | 21.8 mA | 21.8 mA | 21.8 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | FLAT | FLAT |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 11.4554 mm | 11.4554 mm | 9.144 mm | 9.144 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | - | - |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | - |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 制造商包装代码 | SD24 | SD24 | LC28 | LC28 | - | - |
| 长度 | 32.004 mm | 32.004 mm | 11.4554 mm | 11.4554 mm | - | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | - |
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