1.6x0.8mm SMD CHIP LED LAMP
KP-1608SEC
SUPER BRIGHT ORANGE
Features
!
1.6mmx0.8mm SMT LED, 1.1mm THICKNESS.
!
LOW
Description
The Super Bright Orange source color devices
are made with DH InGaAlP on GaAs substrate
Light Emitting Diode.
POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACKLIGHT AND INDICATOR.
!
VARIOUS
!
PACKAGE
COLORS AND LENS TYPES AVAILABLE.
: 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
±0.1(0.004")
unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
SPEC NO: KDA0021
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 1 OF 4
Selection Guide
Par t No .
Di c e
L en s Ty p e
Iv (mc d )
@ 20 mA
Min .
KP-1608SEC
SUPER BRIGHT ORANGE( InGaAlP )
WATER CLEAR
80
Ty p .
200
View in g
An g l e
2θ1/2
120°
Note:
1.
θ1/2
is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
°
Electrical / Optical Characteristics at T
)
=25°C
Sy m b o l
λ
peak
λ
D
∆λ
1/2
C
V
F
I
R
Par ameter
Peak Wavelength
Dominate Wavelength
Spectral Line Halfwidth
Capacitance
Forward Voltage
Reverse Current
Dev ic e
Super Bright Orange
Super Bright Orange
Super Bright Orange
Super Bright Orange
Super Bright Orange
Super Bright Orange
Ty p .
610
601
29
30
2.0
2.5
10
Max .
Un i t s
nm
nm
nm
pF
V
uA
Tes t Co n d itio n s
IF=20mA
IF=20mA
IF=20mA
VF=0V;f=1MHz
IF=20mA
VR = 5V
°
Absolute Maximum Ratings at T
)
=25°C
Par ameter
Power dissipation
DC Forward Current
Peak Forward Current [1]
Reverse Voltage
Operating Temperature
Storage Temperature
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Su p er B r ig h t Or an g e
75
30
195
5
-40
°
C To +85
°C
-40
°
C To +85
°C
Un i t s
mW
mA
mA
V
SPEC NO: KDA0021
APPROVED: J. LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 2 OF 4
Super Bright Orange KP-1608SEC
SPEC NO: KDA0021
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 3 OF 4
KP-1608SEC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: KDA0021
APPROVED: J. LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 4 OF 4
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
