Decoder/Driver, TTL, CDFP16,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 包装说明 | DFP, FL16,.3 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-XDFP-F16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74LS48FCQM | 54LS48DMQB | 74LS48FCQR | 74LS48PCQR | 7448FCQM | 7448PCQM | 7448PCQR | 7448FCQR | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Decoder/Driver, TTL, CDFP16, | Decoder/Driver, TTL, CDIP16, | Decoder/Driver, TTL, CDFP16, | Decoder/Driver, TTL, PDIP16, | Decoder/Driver, TTL, CDFP16, | Decoder/Driver, TTL, PDIP16, | Decoder/Driver, TTL, PDIP16, | Decoder/Driver, TTL, CDFP16, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| Reach Compliance Code | compliant | compliant | compliant | unknown | compliant | compliant | compliant | compli |
| JESD-30 代码 | R-XDFP-F16 | R-XDIP-T16 | R-XDFP-F16 | R-PDIP-T16 | R-XDFP-F16 | R-PDIP-T16 | R-PDIP-T16 | R-XDFP-F16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DFP | DIP | DFP | DIP | DFP | DIP | DIP | DFP |
| 封装等效代码 | FL16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
| 表面贴装 | YES | NO | YES | NO | YES | NO | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved