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PF808-AG12D28

产品描述IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Press Fit
产品类别插座   
文件大小57KB,共3页
制造商Thomas & Betts Corporation
官网地址http://www.tnb.com/
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PF808-AG12D28概述

IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Press Fit

PF808-AG12D28规格参数

参数名称属性值
厂商名称Thomas & Betts Corporation
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性COMPLIANT FIT HOLE SIZE=.028\"
主体宽度0.4 inch
主体深度0.18 inch
主体长度0.4 inch
联系完成配合SN-PB
联系完成终止TIN OVER NICKEL
触点材料BE-CU
触点样式RND PIN-SKT
目前评级3 A
设备插槽类型IC SOCKET
使用的设备类型DIP8
介电耐压1000VAC V
外壳材料POLYESTER
绝缘电阻5000000000 Ω
制造商序列号PF800
插接触点节距0.1 inch
安装方式STRAIGHT
触点数8
最高工作温度105 °C
最低工作温度-55 °C
PCB接触模式RECTANGULAR
PCB触点行间距0.3 mm
端子节距2.54 mm
端接类型PRESS FIT
Base Number Matches1

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PF510 & PF800 Series
Pressfit SIP & DIP Sockets
PF510-AG95D-14
PF828-AG95D-28
E
FEATURES:
• Press fit design does not require soldering
• Available in two sizes to fit .028” (0,71) or .040” (1,02) finished hole
• Available in 8 through 64 pin DIP or 1 to 20 pin SIP packages
• Precision four-finger inner contact provides concentric funnel entry for
easy lead insertion
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005,
Condition II
Shock .............................. Passed MIL-STD-1344, Method 2004,
Condition C, 100 G's
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 200 Grams (7.1 oz.) average with .018" (0,46) dia.
polished steel pin (typ.)
Inner Contact
Retention .................... 7.5 Lbs. per line average
Sleeve Retention
in Plastic .................... 3.0 Lbs. per line minimum
Pin Retention in Board .. 5.0 Lbs. min. per MIL-STD 2166
Insertion Force .............. 179 Grams (6.3 oz.) average with a .018" (0,46)
dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD 202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. per MIL-STD-1344,
Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Operation Temperature .. Gold inner contact -55° C to +125° C,
Tin/lead inner contact -55° C to +105° C
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Gas Tight ........................ Passed EIA-364-36
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .093" (2,36) minimum
• IC Pin Dimension Range: .016"(0,41) thru .021" (0,53) dia.,
.105" (2,67) min. length
• PCB Hole Size Range: .028"
±
.002" (0,71
±
0,05) and .040
±
.003"
(1,02
±
0,13)
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL 94V-0
Inner Contact .................. Beryllium copper, gold or tin/lead plated
Sleeve ............................ Brass, tin/lead plated
Quality & Innovation From The
Product Group
E4
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805

 
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