Dual-Port SRAM, 64KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFP |
包装说明 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 |
针数 | 100 |
Reach Compliance Code | compliant |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 20 ns |
其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
JESD-30 代码 | S-PQFP-G100 |
JESD-609代码 | e3 |
长度 | 14 mm |
内存密度 | 1179648 bit |
内存集成电路类型 | DUAL-PORT SRAM |
内存宽度 | 18 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64KX18 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 14 mm |
Base Number Matches | 1 |
IDT709389L9PFGI | IDT709389L9PFG | IDT709389L9PF9 | IDT709389L12PFG | IDT709389L12PF9 | IDT709389L7PFG | IDT709389L7PF9 | |
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描述 | Dual-Port SRAM, 64KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | Dual-Port SRAM, 64KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | Dual-Port SRAM, 64KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | Dual-Port SRAM, 64KX18, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | Dual-Port SRAM, 64KX18, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | Dual-Port SRAM, 64KX18, 18ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | Dual-Port SRAM, 64KX18, 18ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 |
是否无铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 |
是否Rohs认证 | 符合 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 |
针数 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | compliant | compliant | not_compliant | compliant | not_compliant | compliant | not_compliant |
ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 20 ns | 20 ns | 20 ns | 25 ns | 25 ns | 18 ns | 18 ns |
其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
JESD-30 代码 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 |
JESD-609代码 | e3 | e3 | e0 | e3 | e0 | e3 | e0 |
长度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
内存密度 | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit |
内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 64KX18 | 64KX18 | 64KX18 | 64KX18 | 64KX18 | 64KX18 | 64KX18 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 260 | 260 | 240 | 260 | 240 | 260 | 240 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | MATTE TIN | MATTE TIN | TIN LEAD | MATTE TIN | TIN LEAD | MATTE TIN | TIN LEAD |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 20 | 30 | 20 | 30 | 20 |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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