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IDT72271LA20PF

产品描述FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64
产品类别存储   
文件大小296KB,共27页
制造商IDT (Integrated Device Technology)
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IDT72271LA20PF概述

FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64

IDT72271LA20PF规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明PLASTIC, TQFP-64
针数64
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间12 ns
其他特性RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
最大时钟频率 (fCLK)50 MHz
周期时间20 ns
JESD-30 代码S-PQFP-G64
JESD-609代码e0
长度14 mm
内存密度294912 bit
内存集成电路类型OTHER FIFO
内存宽度9
湿度敏感等级3
功能数量1
端子数量64
字数32768 words
字数代码32000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX9
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP64,.66SQ,32
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源5 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.017 A
最大压摆率0.075 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.8 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

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CMOS SuperSync FIFO
16,384 x 9
32,768 x 9
FEATURES:
IDT72261LA
IDT72271LA
Choose among the following memory organizations:
IDT72261LA 16,384 x 9
IDT72271LA 32,768 x 9
Pin-compatible with the IDT72281/72291 SuperSync FIFOs
10ns read/write cycle time (8ns access time)
Fixed, low first word data latency time
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Retransmit operation with fixed, low first word data latency time
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag
can default to one of two preselected offsets
Program partial flags by either serial or parallel means
Select IDT Standard timing (using EF and FF flags) or First
Word Fall Through timing (using OR and IR flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
Independent Read and Write clocks (permit reading and writing
simultaneously)
Available in the 64-pin Thin Quad Flat Pack (TQFP) and the 64-
pin Slim Thin Quad Flat Pack (STQFP)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
DESCRIPTION:
The IDT72261LA/72271LA are exceptionally deep, high speed, CMOS
First-In-First-Out (FIFO) memories with clocked read and write controls.
These FIFOs offer numerous improvements over previous SuperSync
FIFOs, including the following:
The limitation of the frequency of one clock input with respect to the other
has been removed. The Frequency Select pin (FS) has been removed,
thus it is no longer necessary to select which of the two clock inputs,
RCLK or WCLK, is running at the higher frequency.
The period required by the retransmit operation is now fixed and short.
The first word data latency period, from the time the first word is written
to an empty FIFO to the time it can be read, is now fixed and short. (The
variable clock cycle counting delay associated with the latency period found
on previous SuperSync devices has been eliminated on this SuperSync
family.)
FUNCTIONAL BLOCK DIAGRAM
WEN
D
0
-D
8
WCLK
LD SEN
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
WRITE CONTROL
LOGIC
RAM ARRAY
16,384 x 9
32,768 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
READ
CONTROL
LOGIC
OUTPUT REGISTER
MRS
PRS
RT
RESET
LOGIC
RCLK
REN
OE
Q
0
-Q
8
4671 drw 01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2002
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
SEPTEMBER 2002
DSC-4671/2

IDT72271LA20PF相似产品对比

IDT72271LA20PF IDT72271LA20TF IDT72271LA15TFI IDT72261LA15PFI IDT72271LA15PF IDT72271LA15PFI IDT72271LA15TF IDT72261LA10PF IDT72261LA20PF
描述 FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 32KX9, 12ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 16KX9, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 32KX9, 10ns, Synchronous, CMOS, PQFP64, STQFP-64 FIFO, 16KX9, 8ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64 FIFO, 16KX9, 12ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 QFP QFP QFP QFP QFP QFP QFP QFP QFP
包装说明 PLASTIC, TQFP-64 STQFP-64 STQFP-64 PLASTIC, TQFP-64 PLASTIC, TQFP-64 PLASTIC, TQFP-64 STQFP-64 PLASTIC, TQFP-64 PLASTIC, TQFP-64
针数 64 64 64 64 64 64 64 64 64
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 12 ns 12 ns 10 ns 10 ns 10 ns 10 ns 10 ns 8 ns 12 ns
其他特性 RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
最大时钟频率 (fCLK) 50 MHz 50 MHz 66.7 MHz 66.7 MHz 66.7 MHz 66.7 MHz 66.7 MHz 100 MHz 50 MHz
周期时间 20 ns 20 ns 15 ns 15 ns 15 ns 15 ns 15 ns 10 ns 20 ns
JESD-30 代码 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64 S-PQFP-G64
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 14 mm 10 mm 10 mm 14 mm 14 mm 14 mm 10 mm 14 mm 14 mm
内存密度 294912 bit 294912 bit 294912 bit 147456 bit 294912 bit 294912 bit 294912 bit 147456 bit 147456 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 9 9 9 9 9 9 9 9 9
湿度敏感等级 3 3 3 3 3 3 3 3 3
功能数量 1 1 1 1 1 1 1 1 1
端子数量 64 64 64 64 64 64 64 64 64
字数 32768 words 32768 words 32768 words 16384 words 32768 words 32768 words 32768 words 16384 words 16384 words
字数代码 32000 32000 32000 16000 32000 32000 32000 16000 16000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C
组织 32KX9 32KX9 32KX9 16KX9 32KX9 32KX9 32KX9 16KX9 16KX9
可输出 YES YES YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LQFP LFQFP LFQFP LQFP LQFP LQFP LFQFP LQFP LQFP
封装等效代码 QFP64,.66SQ,32 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.6SQ,32 QFP64,.66SQ,32 QFP64,.6SQ,32 QFP64,.47SQ,20 QFP64,.66SQ,32 QFP64,.66SQ,32
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 240 240 240 240 240 240 240 240
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大待机电流 0.017 A 0.017 A 0.02 A 0.02 A 0.017 A 0.02 A 0.017 A 0.017 A 0.017 A
最大压摆率 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA 0.075 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm 0.5 mm 0.8 mm 0.8 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 20 20 20 20 20 20 20 20 20
宽度 14 mm 10 mm 10 mm 14 mm 14 mm 14 mm 10 mm 14 mm 14 mm
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Base Number Matches 1 1 1 1 1 1 - - -

 
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