REVISIONS
LTR
A
DESCRIPTION
Add three vendors, 18324, 1FN41, and 66579. Add device types 04, 05,
06, and 07. Add margin test method C. Update vendor's PIN. Change
code indent. no. to 67268. Editorial changes throughout.
Add device type 08 with vendors CAGE 1FN41 and CAGE 66579.
Added time temperature regression equation for unbiased bake.
Removed vendor CAGE 66302. Made technical changes to table I, 4.2
back end margin test method step 3, 4.3.1 step C, table II, and table III.
Editorial changes throughout. Added vendor's PIN from XMB/883 to
either LM/883 for appropriate device types. Deleted the top CE waveform
on figure 6. This was incorrect for this device.
Added vendor CAGE 34335 to the drawing as a source of supply for
device types 01 through 07. Add vendor CAGE number 66579 to device
types 01 through 04, also add vendor CAGE number 01295 to devices
04XX and 05XX. Add test condition A to 4.2 and 4.3.2. Add margin test
method E for vendor CAGE number 34335. Change to vendor similar
PIN for vendor CAGE numbers 1FN41 and 66579. Change to figure 3,
margin test method C for vendor CAGE 01295 and change to
programming waveforms. Change to 4.5. Editorial changes throughout.
Add case outline Z for vendor CAGE number 1FN41.
Changes in accordance with NOR 5962-R130-92.
Add case outline U. Add device types 09 and 10. Remove vendor
27014 from drawing. Editorial changes throughout.
Changes in accordance with NOR 5962-R118-94.
Updated boilerplate. Added device types 11-21. Removed vendors
1FN41, 18324, 34335, and 61394 from drawing. Added vendor 65786
to drawing. Removed margin test methods from drawing.
DATE
(YR-MO-DA)
87-12-17
APPROVED
M. A. Frye
B
89-01-01
M. A. Frye
C
90-12-05
M. A. Frye
D
E
F
G
92-01-30
93-10-15
94-02-16
97-06-11
M. A. Frye
M. A. Frye
M. A. Frye
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
G
15
G
16
REV
SHEET
G
1
G
2
G
3
G
4
G
5
G
6
G
7
G
8
G
9
G
10
G
11
G
12
G
13
G
14
PMIC N/A
PREPARED BY
James E. Jamison
CHECKED BY
Charles Reusing
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
87-02-12
REVISION LEVEL
G
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 262,144-BIT
UV ERASABLE PROM, MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
14933
1
OF
16
5962-86063
AMSC N/A
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E112-97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device class M:
5962
-
86063
01
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
For device classes Q and V:
5962
-
86063
01
Q
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01,11
02,12
03,13
04,14
05,15
06,16
07,17
08,18
09,19
10,20
21
Generic number
(see 6.6)
(see 6.6)
(see 6.6)
(see 6.6)
(see 6.6)
(see 6.6)
(see 6.6)
(see 6.6)
(see 6.6)
(see 6.6)
(see 6.6)
Circuit
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
32K x 8-bit UV EPROM
Access time
200 ns
250 ns
300 ns
170 ns
150 ns
120 ns
90 ns
70 ns
55 ns
45 ns
35 ns
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-86063
SHEET
2
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device class M and Q
designators will not be included in the PIN for device types 01 through 10, and will not be marked on the device.
Device class
M
Q or V
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
Descriptive designator
GDIP1-T28 or CDIP2-T28
CQCC1-N32
See figure 1
CDIP3-T28 or GDIP4-T28
Terminals
28
32
32
28
Package style 1/
Dual-in-line
Rectangular leadless chip carrier
J-lead chip carrier
Dual-in-line
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Storage temperature - - - - - - - - - - - - - - - - - - - - - - - -
Input voltages with respect to ground - - - - - - - - - - - - -
Output voltages with respect to ground - - - - - - - - - - -
VPP supply voltage with respect to ground - - - - - - - - -
Power dissipation (PD) 2/ - - - - - - - - - - - - - - - - - - - - -
Lead temperature (soldering, 10 seconds) - - - - - - - -
Thermal resistance, junction-to-case (
JC):
Case outlines X, Y, and U - - - - - - - - - - - - - - - - - - -
Case outline Z - - - - - - - - - - - - - - - - - - - - - - - - - - -
Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - -
1.4 Recommended operating conditions.
Case operating temperature (TC) - - - - - - - - - - - - - - -
Supply voltage (VCC) - - - - - - - - - - - - - - - - - - - - - - -
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . . . . . . . . . . . . . . XX percent 3/
-55
C to +125
C
+4.5 V dc to +5.5 V dc
-65
C to +150
C
+6.5 V dc to -0.3 V dc
VCC +0.3 V dc to GND -0.3 V dc
+14.0 V dc to -0.6 V dc
+500 mW
+300
C
See MIL-STD-1835
13
C/W
+150
C
1/ Lid shall be transparent to permit ultraviolet light erasure.
2/ Must withstand the added PD due to short circuit test; e.g., IOS.
3/ Values will be added when they become available.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-86063
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
MILITARY
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
MILITARY
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Microcircuit Case Outlines.
HANDBOOKS
MILITARY
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device
class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.2 Truth table. The truth table shall be as specified on figure 3.
3.2.2.1 Unprogrammed or erased devices. The truth table for unprogrammed devices shall be as specified on figure 3.
3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-86063
SHEET
4
3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating
temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical test
for each subgroup are described in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked
as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the
manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator
shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M
shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer
prior to delivery.
3.6.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics
specified in 4.5.
3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the procedures
and characteristics specified in 4.6.
3.6.3 Verification of state of EPROMS. When specified, devices shall be verified as either programmed to the specified pattern
or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all bits are in the proper
state. Any bit that does not verify to be in the proper state shall constitute a device failure and shall be removed from the lot.
3.7 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed
manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing
shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or
for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.8 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.9 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein)
involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.
3.10 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available
onshore at the option of the reviewer.
3.11 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit
group number 42 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
DSCC FORM 2234
APR 97
A
REVISION LEVEL
G
5962-86063
SHEET
5
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
