电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

74LVTH162245MTDX

产品描述Bus Transceiver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, PDSO48, 6.10 MM, MO-153, TSSOP-48
产品类别逻辑    逻辑   
文件大小96KB,共9页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
下载文档 详细参数 选型对比 全文预览

74LVTH162245MTDX概述

Bus Transceiver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, PDSO48, 6.10 MM, MO-153, TSSOP-48

74LVTH162245MTDX规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Fairchild
零件包装代码TSSOP
包装说明TSSOP, TSSOP48,.3,20
针数48
Reach Compliance Codeunknown
其他特性WITH DIRECTION CONTROL
控制类型COMMON CONTROL
计数方向BIDIRECTIONAL
系列LVT
JESD-30 代码R-PDSO-G48
JESD-609代码e0
长度12.5 mm
逻辑集成电路类型BUS TRANSCEIVER
最大I(ol)0.064 A
位数8
功能数量2
端口数量2
端子数量48
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE WITH SERIES RESISTOR
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP48,.3,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法TAPE AND REEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3 V
Prop。Delay @ Nom-Sup4 ns
传播延迟(tpd)4.6 ns
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
翻译N/A
宽度6.1 mm
Base Number Matches1

文档预览

下载PDF文档
74LVT162245 • 74LVTH162245 Low Voltage 16-Bit Transceiver with 3-STATE Outputs and 25: Series Resistors in
A Port Outputs
January 1999
Revised June 2005
74LVT162245 • 74LVTH162245
Low Voltage 16-Bit Transceiver with 3-STATE Outputs
and 25: Series Resistors in A Port Outputs
General Description
The LVT162245 and LVTH162245 contains sixteen non-
inverting bidirectional buffers with 3-STATE outputs and is
intended for bus oriented applications. The device is byte
controlled. Each byte has separate control inputs which
can be shorted together for full 16-bit operation. The T/R
inputs determine the direction of data flow through the
device. The OE inputs disable both the A and B ports by
placing them in a high impedance state.
The LVT162245 and LVTH162245 are designed with
equivalent 25
:
series resistance in both the HIGH and
LOW states on the A Port outputs. This design reduces line
noise in applications such as memory address drivers,
clock drivers, and bus transceivers/transmitters.
The LVTH162245 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These non-inverting transceivers are designed for low volt-
age (3.3V) V
CC
applications, but with the capability to pro-
vide a TTL interface to a 5V environment. The LVT162245
and LVTH162245 are fabricated with an advanced
BiCMOS technology to achieve high speed operation simi-
lar to 5V ABT while maintaining a low power dissipation.
Features
s
Input and output interface capability to systems at
5V V
CC
s
Bushold data inputs eliminate the need for external pull-
up resistors to hold unused inputs (74LVTH162245),
also available without bushold feature (74LVT162245).
s
Live insertion/extraction permitted
s
Power Up/Down high impedance provides glitch-free
bus loading
s
A Port outputs include equivalent series resistance of
25
:
making external termination resistors unnecessary
and reducing overshoot and undershoot
s
A Port outputs source/sink
r
12 mA.
B Port outputs source/sink

32 mA/

64 mA
s
Functionally compatible with the 74 series 162245
s
Latch-up performance exceeds 500 mA
s
ESD performance:
Human-body model
!
2000V
Machine model
!
200V
Charged-device model
!
1000V
s
Also packaged in plastic Fine Pitch Ball Grid Array
(FBGA)
Ordering Code:
Order Number
74LVT162245G
(Note 1)(Note 2)
74LVT162245MEA
(Note 2)
74LVT162245MTD
(Note 2)
74LVTH162245G
(Note 1)(Note 2)
74LVTH162245MEA
74LVTH162245MEX
74LVTH162245MTD
74LVTH162245MTX
Package Number
BGA54A
(Preliminary)
MS48A
MTD48
BGA54A
MS48A
MS48A
MTD48
MTD48
Package Description
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TUBE]
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TUBE]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
Note 1:
Ordering code “G” indicates Trays.
Note 2:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
© 2005 Fairchild Semiconductor Corporation
DS012446
www.fairchildsemi.com

74LVTH162245MTDX相似产品对比

74LVTH162245MTDX 74LVTH162245MEAX
描述 Bus Transceiver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, PDSO48, 6.10 MM, MO-153, TSSOP-48 Bus Transceiver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, PDSO48, 0.300 INCH, MO-118, SSOP-48
是否Rohs认证 不符合 不符合
厂商名称 Fairchild Fairchild
零件包装代码 TSSOP SSOP
包装说明 TSSOP, TSSOP48,.3,20 SSOP, SSOP48,.4
针数 48 48
Reach Compliance Code unknown compliant
其他特性 WITH DIRECTION CONTROL WITH DIRECTION CONTROL
控制类型 COMMON CONTROL COMMON CONTROL
计数方向 BIDIRECTIONAL BIDIRECTIONAL
系列 LVT LVT
JESD-30 代码 R-PDSO-G48 R-PDSO-G48
JESD-609代码 e0 e0
长度 12.5 mm 15.875 mm
逻辑集成电路类型 BUS TRANSCEIVER BUS TRANSCEIVER
最大I(ol) 0.064 A 0.064 A
位数 8 8
功能数量 2 2
端口数量 2 2
端子数量 48 48
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
输出特性 3-STATE WITH SERIES RESISTOR 3-STATE WITH SERIES RESISTOR
输出极性 TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SSOP
封装等效代码 TSSOP48,.3,20 SSOP48,.4
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
包装方法 TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 4 ns 4 ns
传播延迟(tpd) 4.6 ns 4.6 ns
认证状态 Not Qualified Not Qualified
座面最大高度 1.2 mm 2.74 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V
表面贴装 YES YES
技术 BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING
端子节距 0.5 mm 0.635 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
翻译 N/A N/A
宽度 6.1 mm 7.495 mm
Base Number Matches 1 1
如何确保高速DSP的PCB设计质量
  随着芯片集成度的越来越高,芯片的引脚也越来越多,器件的封装也在不断地发生变化,从DIP至OSOP,从SOP到PQFP,从PQFP到BGA。TMS320C6000系列器件采用BGA封装,在电路应用方面,BGA封装具有 ......
mwkjhl PCB设计
逻辑器件的使用整理
1:多余不用输入管脚的处理 在多数情况下,集成电路芯片的管脚不会全部被使用。例如74ABT16244系列器件最多可以使用16路I/O管脚,但实际上通常不会全部使 用,这样就会存在悬空端子。所有数 ......
小丸子 汽车电子
单片机IO能不能直接接NPN基极,使用推挽高电平驱动三极管?
IO口直接接到NPN三极管基极(没有在接基极串接电阻)试了下,推挽输出驱动三极管工作在开关状态,电路工作不正常然后找了半天原因,想着可能是推挽电流太大,换成用IO的上拉输入去驱动三极管工 ......
飞鸿浩劫 stm32/stm8
TI Stellaris采用RAM仿真教程
教程在下面,大家看看,有问题多交流,我的QQ:872969952...
iwqtthf 微控制器 MCU
GD32307E-START IO模拟IIC点亮0.96‘’OLED(04)
本帖最后由 trucy 于 2020-10-12 15:46 编辑 j接续https://bbs.eeworld.com.cn/thread-1144022-1-1.html 这两天利用空闲时间摆弄了下IO模拟IIC 首先我们要熟悉下OLED屏幕控制IC的相关 ......
trucy GD32 MCU
“POS机设计方案样片套装” 是不是放那里吃灰的啊!
以前论坛里有次活动 发了好多“POS机设计方案样片套装” ,哎! 应该很多人都放那边吃灰,没好好用起来吧! ...
蓝雨夜 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1373  226  635  1388  2180  58  17  52  50  10 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved