电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDT74SSTU32864DBFG

产品描述D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, GREEN, LFBGA-96
产品类别逻辑   
文件大小181KB,共12页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

IDT74SSTU32864DBFG概述

D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, GREEN, LFBGA-96

IDT74SSTU32864DBFG规格参数

参数名称属性值
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明LFBGA, BGA96,6X16,32
针数96
Reach Compliance Codeunknown
其他特性14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
系列SSTU
JESD-30 代码R-PBGA-B96
JESD-609代码e1
长度13.5 mm
逻辑集成电路类型D FLIP-FLOP
湿度敏感等级3
位数25
功能数量1
端子数量96
最高工作温度70 °C
最低工作温度
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码LFBGA
封装等效代码BGA96,6X16,32
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度)260
电源1.8 V
传播延迟(tpd)2.35 ns
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
触发器类型POSITIVE EDGE
宽度5.5 mm
最小 fmax340 MHz
Base Number Matches1

文档预览

下载PDF文档
IDT74SSTU32864/A/C/D/G
1:1 AND 1:2 REGISTERED BUFFER WITH 1.8V SSTL I/O
COMMERCIAL TEMPERATURE RANGE
1:1 AND 1:2 REGISTERED
BUFFER WITH 1.8V SSTL I/O
IDT74SSTU32864/
A/C/D/G
FEATURES:
1:1 and 1:2 registered buffer
1.8V Operation
SSTL_18 style clock and data inputs
Differential CLK input
Control inputs compatible with LVCMOS levels
Flow-through architecture for optimum PCB design
Latch-up performance exceeds 100mA
ESD >2000V per MIL-STD-883, Method 3015; >200V using
machine model (C = 200pF, R = 0)
• Maximum operating frequency: 340MHz
• Available in 96-pin LFBGA package
APPLICATIONS:
• Ideally suited for DDR2-400/533 (PC2 - 3200/ 4200) registered
DIMM applications
• Along with CSPU877/A/D, zero delay PLL clock buffer, provides
complete solution for DDR2-400/533 DIMMs
• SSTU32864 is optimized for DDR2 Raw cards B and C
• SSTU32864A is optimized for DDR2 Raw card A
• SSTU32864C/D/G are optimized for DDR2 Raw cards A, B, and C
• SSTU32864G has control pins for output slew rate control
The SSTU32864 is a 25-bit 1:1 / 14-bit 1:2 configurable registered buffer
designed for 1.7V to 1.9V V
DD
operation. All clock and data inputs are
compatible with the JEDEC standard for SSTL_18. The control inputs are
LVCMOS. All outputs are 1.8V CMOS drivers that have been optimized
to drive the DDR2 DIMM load.
The SSTU32864 operates from a differential clock (CLK and
CLK).
Data
are registered at the crossing of CLK going high and
CLK
going low.
The C0 input controls the pinout configuration of the 1:2 pinout from the
A configuration (when low) to B configuration (when high). The C1 input
controls the configuration from the 25-bit 1:1 (when low) to 14-bit 1:2 (when
high).
This device supports low-power standby operation. When the reset input
(RESET) is low, the differential input receivers are disabled, and undriven
(floating) data, clock, and reference voltage (V
REF
) inputs are allowed. In
addition, when
RESET
is low all registers are reset, and all outputs are
forced low. The LVCMOS
RESET
and Cx inputs must always be held at
a valid logic high or low level.
To ensure defined outputs from the register before a stable clock has
been supplied,
RESET
must be held in the low state during power up.
In the DDR2 DIMM application,
RESET
is specified to be completely
asynchronous with respect to CLK and
CLK.
Therefore, no timing
relationship can be guaranteed between the two. When entering reset, the
register will be cleared and the outputs will be driven low quickly, relative
to the time to disable the differential input receivers. However, when coming
out of a reset, the register will become active quickly, relative to the time to
enable the differential input receivers. As long as the data inputs are low,
and the clock is stable during the time from the low-to-high transition of
RESET
until the input receivers are fully enabled, the design of the
SSTU32864 must ensure that the outputs will remain low, thus ensuring no
glitches on the outputs.
The device monitors both DCS and
CSR
inputs and will gate the outputs
from changing states when both DCS and
CSR
inputs are high. If either
DCS or
CSR
input is low, the device will function normally. The
RESET
input has priority over the DCS control and will force the inputs low. If the
DCS control functionality is not desired, then the
CSR
input can be hard-
wired to ground, in which case the set-up time requirement for DCS would
be the same as for the other D data inputs.
The SSTU32864G has two slew control pins (Z
OH
and Z
OL
) used to
optimize the signal integrity on the DIMM.
DESCRIPTION:
COMMERCIAL TEMPERATURE RANGE
1
c
2006 Integrated Device Technology, Inc.
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
APRIL 2006
DSC-5980/27

IDT74SSTU32864DBFG相似产品对比

IDT74SSTU32864DBFG IDT74SSTU32864DBFG8 IDT74SSTU32864ABFG8 IDT74SSTU32864ABFG
描述 D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, GREEN, LFBGA-96 D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, GREEN, LFBGA-96 D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, GREEN, LFBGA-96 D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, GREEN, LFBGA-96
是否Rohs认证 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA BGA BGA
包装说明 LFBGA, BGA96,6X16,32 LFBGA, BGA96,6X16,32 LFBGA, BGA96,6X16,32 LFBGA, BGA96,6X16,32
针数 96 96 96 96
Reach Compliance Code unknown unknown unknown unknown
其他特性 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
系列 SSTU SSTU SSTU SSTU
JESD-30 代码 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96
JESD-609代码 e1 e1 e1 e1
长度 13.5 mm 13.5 mm 13.5 mm 13.5 mm
逻辑集成电路类型 D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
湿度敏感等级 3 3 3 3
位数 25 25 25 25
功能数量 1 1 1 1
端子数量 96 96 96 96
最高工作温度 70 °C 70 °C 70 °C 70 °C
输出极性 TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFBGA LFBGA LFBGA LFBGA
封装等效代码 BGA96,6X16,32 BGA96,6X16,32 BGA96,6X16,32 BGA96,6X16,32
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度) 260 260 260 260
电源 1.8 V 1.8 V 1.8 V 1.8 V
传播延迟(tpd) 2.35 ns 2.35 ns 2.35 ns 2.35 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.5 mm 1.5 mm 1.5 mm 1.5 mm
最大供电电压 (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL BALL
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
宽度 5.5 mm 5.5 mm 5.5 mm 5.5 mm
最小 fmax 340 MHz 340 MHz 340 MHz 340 MHz
Base Number Matches 1 1 1 1

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 623  1291  2312  2580  1014  16  57  6  38  7 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved