IC HC/UH SERIES, DUAL 4-INPUT AND GATE, PDIP14, Gate
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDIP-T14 |
| 长度 | 19.025 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | AND GATE |
| 功能数量 | 2 |
| 输入次数 | 4 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 33 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 74HC21NB | 74HCT21D | 74HCT21DB | 74HCT21DB-T | 74HCT21N | 74HCT21NB | |
|---|---|---|---|---|---|---|
| 描述 | IC HC/UH SERIES, DUAL 4-INPUT AND GATE, PDIP14, Gate | IC HCT SERIES, DUAL 4-INPUT AND GATE, PDSO14, SO-14, Gate | IC HCT SERIES, DUAL 4-INPUT AND GATE, PDSO14, SSOP-14, Gate | IC HCT SERIES, DUAL 4-INPUT AND GATE, PDSO14, SSOP-14, Gate | IC HCT SERIES, DUAL 4-INPUT AND GATE, PDIP14, DIP-14, Gate | IC HCT SERIES, DUAL 4-INPUT AND GATE, PDIP14, Gate |
| 包装说明 | DIP, | SOP, | SSOP, | SSOP, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | HC/UH | HCT | HCT | HCT | HCT | HCT |
| JESD-30 代码 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDIP-T14 |
| 长度 | 19.025 mm | 8.65 mm | 6.2 mm | 6.2 mm | 19.025 mm | 19.025 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 输入次数 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SSOP | SSOP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE |
| 传播延迟（tpd） | 33 ns | 41 ns | 41 ns | 41 ns | 41 ns | 41 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.2 mm | 1.75 mm | 2 mm | 2 mm | 4.2 mm | 4.2 mm |
| 最大供电电压 (Vsup) | 6 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 0.65 mm | 0.65 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.9 mm | 5.3 mm | 5.3 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
| 零件包装代码 | - | SOIC | SSOP | SSOP | DIP | - |
| 针数 | - | 14 | 14 | 14 | 14 | - |
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