F-210
(1,27mm) .050"
SEAF-RA SERIES
SEAF–20–01–L–04–2–RA–TR
SEAF–30–01–L–06–2–RA–GP–TR
HI-DENSITY RIGHT ANGLE OPEN PIN FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF-RA
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
2.1 A with 4 adjacent
contacts powered
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Contact Resistance:
17.1 mΩ max
Working Voltage:
280 VAC
Mated Cycles:
100
RoHS Compliant:
Yes
Mates with:
SEAM, SADL,
SEAC (Requires –LP)
Up to
300 Pins
Low Insertion/
Extraction Forces
Lead-Free Solder
Charge Terminations
(Tin/Lead also available)
Optional
Guide Post holes
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead-Free Solderable:
Yes
SEAF
NO. PINS
PER ROW
01
PLATING
OPTION
NO. OF
ROWS
2
RA
OPTION
TR
– 20, – 30,
–40, –50
NO. OF
ROWS
–04
–06
–08
–10
A
(13,26)
.522
(15,80)
.622
(18,34)
.722
(20,88)
.822
–L
C
(7,91)
.312
(10,45)
.412
(12,99)
.512
(15,53)
.612
– 04
=Four Rows
–2
= Lead-Free
Tin Alloy
95.5%Sn/
3.8% Ag/
0.7% Cu
Solder
Charge
B
(13,77)
.542
(16,31)
.642
(18,85)
.742
(21,39)
.842
= 10µ" (0,25µm)
Gold on contact area,
Matte Tin on solder tail
– GP
= Guide
Post Hole
– TR
=Tape &
Reel
(Not
available
with –LP
option)
– 06
=Six Rows
– LP
= Latch Post
(06 row 30
positions only)
(Mates to
SEAC Series)
– 08
=Eight Rows
– 10
=Ten Rows
(27,25) 1.073
A
B
(3,56)
.140
–GP= No. of positions x (1,27) .050 + (19,56) 0.77
Without –GP= No. of positions x (1,27) .050 + (9,40) 0.37
–LP (6 ROW) SHOWN
Note:
Other Gold plating
options available.
Contact Samtec.
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
–GP (6 ROW) SHOWN
(1,27)
.050
(0,64)
.025
C
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