Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14
| 参数名称 | 属性值 |
| 厂商名称 | Micrel ( Microchip ) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 高边驱动器 | YES |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | R-GDIP-T14 |
| JESD-609代码 | e0 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 最大供电电压 | 32 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 断开时间 | 10 µs |
| 接通时间 | 200 µs |
| Base Number Matches | 1 |
| 5962-9313902MCA | MIC5012AJ | MIC5012AJB | MIC5012BJ | |
|---|---|---|---|---|
| 描述 | Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14 | Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14, CERAMIC, DIP-14 | Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14, CERAMIC, DIP-14 | Buffer/Inverter Based MOSFET Driver, CMOS, CDIP14, CERAMIC, DIP-14 |
| 包装说明 | DIP, | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 高边驱动器 | YES | YES | YES | YES |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 功能数量 | 1 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 32 V | 32 V | 32 V | 32 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 断开时间 | 10 µs | 10 µs | 10 µs | 10 µs |
| 接通时间 | 200 µs | 200 µs | 200 µs | 200 µs |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | - | DIP | DIP | DIP |
| 针数 | - | 14 | 14 | 14 |
| 输入特性 | - | STANDARD | STANDARD | STANDARD |
| 长度 | - | 19.304 mm | 19.304 mm | 19.304 mm |
| 输出特性 | - | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE |
| 输出极性 | - | TRUE | TRUE | TRUE |
| 封装等效代码 | - | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 15 V | 15 V | 15 V |
| 座面最大高度 | - | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大压摆率 | - | 40 mA | 40 mA | 40 mA |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 7.62 mm | 7.62 mm | 7.62 mm |
无线连接
嵌入式系统
PCB设计
嵌入式系统
Microchip MCU
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