Serial In Parallel Out, TTL/H/L Series, 5-Bit, Right Direction, True Output, TTL, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | DIP |
| 包装说明 | CERAMIC, DIP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 计数方向 | RIGHT |
| 系列 | TTL/H/L |
| JESD-30 代码 | R-CDIP-T16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | SERIAL IN PARALLEL OUT |
| 位数 | 5 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 传播延迟（tpd） | 40 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 最小 fmax | 10 MHz |
| Base Number Matches | 1 |
| 5496DMQB | 5496FMQB | 7496DC | 7496PC | 7496FC | |
|---|---|---|---|---|---|
| 描述 | Serial In Parallel Out, TTL/H/L Series, 5-Bit, Right Direction, True Output, TTL, CDIP16, CERAMIC, DIP-16 | Serial In Parallel Out, TTL/H/L Series, 5-Bit, Right Direction, True Output, TTL, PDFP16, PLASTIC, DFP-16 | Parallel In Parallel Out, 5-Bit, TTL, CDIP16, | Shift Register, 5-Bit, TTL, PDIP16, | Parallel In Parallel Out, 5-Bit, TTL, CDFP16, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | compliant |
| JESD-30 代码 | R-CDIP-T16 | R-PDFP-F16 | R-XDIP-T16 | R-PDIP-T16 | R-XDFP-F16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 位数 | 5 | 5 | 5 | 5 | 5 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | DFP | DIP | DIP | DFP |
| 封装等效代码 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | 250 | 250 | 250 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | 30 |
| 厂商名称 | Fairchild | Fairchild | - | - | Fairchild |
| 包装说明 | CERAMIC, DIP-16 | DFP, FL16,.3 | DIP, DIP16,.3 | - | DFP, FL16,.3 |
| 逻辑集成电路类型 | SERIAL IN PARALLEL OUT | SERIAL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | - | PARALLEL IN PARALLEL OUT |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| 是否无铅 | - | - | 含铅 | 含铅 | 含铅 |
| 湿度敏感等级 | - | - | 2A | 2A | 2A |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
