Parallel In Parallel Out, FCT Series, 8-Bit, Bidirectional, True Output, CMOS, CQCC20, LCC-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| 其他特性 | HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| 系列 | FCT |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | PARALLEL IN PARALLEL OUT |
| 最大频率@ Nom-Sup | 71400000 Hz |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| 传播延迟（tpd） | 12 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| IDT54FCT299TLB | IDT74FCT299ATQ | IDT74FCT299ATSO | IDT74FCT299CTQ | IDT54FCT299TDB | |
|---|---|---|---|---|---|
| 描述 | Parallel In Parallel Out, FCT Series, 8-Bit, Bidirectional, True Output, CMOS, CQCC20, LCC-20 | Parallel In Parallel Out, FCT Series, 8-Bit, Bidirectional, True Output, CMOS, PDSO20, QSOP-20 | Parallel In Parallel Out, FCT Series, 8-Bit, Bidirectional, True Output, CMOS, PDSO20, SOIC-20 | Parallel In Parallel Out, FCT Series, 8-Bit, Bidirectional, True Output, CMOS, PDSO20, QSOP-20 | Parallel In Parallel Out, FCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20, CERAMIC, DIP-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QLCC | QSOP | SOIC | QSOP | DIP |
| 包装说明 | QCCN, LCC20,.35SQ | QSOP-20 | SOP, SOP20,.4 | QSOP-20 | DIP, DIP20,.3 |
| 针数 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 其他特性 | HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL | HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL | HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL | HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL | HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| 系列 | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | S-CQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-GDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 8.89 mm | 8.6868 mm | 12.8 mm | 8.6868 mm | 25.3365 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT |
| 最大频率@ Nom-Sup | 71400000 Hz | 71400000 Hz | 71400000 Hz | 100000000 Hz | 71400000 Hz |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | SSOP | SOP | SSOP | DIP |
| 封装等效代码 | LCC20,.35SQ | SSOP20,.25 | SOP20,.4 | SSOP20,.25 | DIP20,.3 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | NOT SPECIFIED | 225 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 传播延迟（tpd） | 12 ns | 7.2 ns | 7.2 ns | 6.5 ns | 12 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 1.7272 mm | 2.65 mm | 1.7272 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 0.635 mm | 1.27 mm | 0.635 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED | 20 |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 8.89 mm | 3.9116 mm | 7.5 mm | 3.9116 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| 湿度敏感等级 | - | 1 | 1 | 1 | - |
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