UVPROM, 16KX8, 55ns, CMOS, CDFP28
| 参数名称 | 属性值 |
| 厂商名称 | Cypress(赛普拉斯) |
| 包装说明 | DFP, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 55 ns |
| JESD-30 代码 | R-GDFP-F28 |
| JESD-609代码 | e0 |
| 内存密度 | 131072 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 16KX8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-8953702ZA | 5962-8953802ZA | CY7C251-45DI | CY7C251-65DI | CY7C254-55DI | CY7C254-65DI | CY7C254-45DI | CY7C251-55DI | 5962-8953801ZA | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | UVPROM, 16KX8, 55ns, CMOS, CDFP28 | UVPROM, 16KX8, 55ns, CMOS, CDFP28, CERAMIC, FP-28 | OTP ROM, 16KX8, 45ns, CMOS, CDIP28, 0.300 INCH, SLIM, CERDIP-28 | OTP ROM, 16KX8, 65ns, CMOS, CDIP28, 0.300 INCH, SLIM, CERDIP-28 | OTP ROM, 16KX8, 55ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | OTP ROM, 16KX8, 65ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | OTP ROM, 16KX8, 45ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | OTP ROM, 16KX8, 55ns, CMOS, CDIP28, 0.300 INCH, SLIM, CERDIP-28 | UVPROM, 16KX8, 65ns, CMOS, CDFP28, CERAMIC, FP-28 |
| 包装说明 | DFP, | DFP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 55 ns | 55 ns | 45 ns | 65 ns | 55 ns | 65 ns | 45 ns | 55 ns | 65 ns |
| JESD-30 代码 | R-GDFP-F28 | R-GDFP-F28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDFP-F28 |
| 内存密度 | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit |
| 内存集成电路类型 | UVPROM | UVPROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | UVPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| 字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C |
| 组织 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DFP | DIP | DIP | DIP | DIP | DIP | DIP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Cypress(赛普拉斯) | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
| 零件包装代码 | - | DFP | DIP | DIP | DIP | DIP | DIP | DIP | DFP |
| 针数 | - | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
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