D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0122% |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 12/15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大稳定时间 | 1.5 µs |
| 最大压摆率 | 2 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| Base Number Matches | 1 |
| 5962-8776301LA | 5962-8965701LA | 5962-8776303LA | 5962-8965703LA | 5962-87763023C | 5962-87763033C | 5962-87763013C | 5962-8965702LA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, CQCC28, CERAMIC, LCC-28 | D/A Converter, 1 Func, Parallel, Word Input Loading, CQCC28, CERAMIC, LCC-28 | D/A Converter, 1 Func, Parallel, Word Input Loading, CQCC28, CERAMIC, LCC-28 | D/A Converter, 1 Func, Parallel, Word Input Loading, CDIP24, CERAMIC, DIP-24 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | DIP | QLCC | QLCC | QLCC | DIP |
| 包装说明 | DIP, DIP24,.3 | CERAMIC, DIP-24 | CERAMIC, DIP-24 | CERAMIC, DIP-24 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | CERAMIC, DIP-24 |
| 针数 | 24 | 24 | 24 | 24 | 28 | 28 | 28 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-CQCC-N28 | R-CQCC-N28 | R-CQCC-N28 | R-GDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 最大线性误差 (EL) | 0.0122% | 0.0244% | 0.0122% | 0.0244% | 0.0122% | 0.0122% | 0.0122% | 0.0244% |
| 位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 28 | 28 | 28 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | QCCN | QCCN | QCCN | DIP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | LCC28,.45SQ | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| 电源 | 12/15 V | 12/15 V | 12/15 V | 12/15 V | 12/15 V | 12/15 V | 12/15 V | 12/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 最大稳定时间 | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs |
| 最大压摆率 | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | - | - | 1 |
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