74VHC132MTC在线购买

供应商	器件名称	价格	最低购买	库存
	74VHC132MTC	-	-	点击查看	点击购买

74VHC132MTC概述

AHC/VHC SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, TSSOP-14

74VHC132MTC规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
零件包装代码	TSSOP
包装说明	TSSOP,
针数	14
Reach Compliance Code	unknown
系列	AHC/VHC
JESD-30 代码	R-PDSO-G14
长度	5 mm
负载电容（CL）	50 pF
逻辑集成电路类型	NAND GATE
功能数量	4
输入次数	2
端子数量	14
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟（tpd）	11 ns
认证状态	Not Qualified
座面最大高度	1.1 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
宽度	4.4 mm
Base Number Matches	1

74VHC132MTC相似产品对比

	74VHC132MTC	74VHC132MTCX	74VHC132M	74VHC132MX	74VHC132SJX	74VHC132SJ	74VHC132N
描述	AHC/VHC SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, TSSOP-14	IC AHC/VHC SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, TSSOP-14, Gate	IC AHC/VHC SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, SOIC-14, Gate	AHC/VHC SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, SOIC-14	IC AHC/VHC SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, EIAJ, SOIC-14, Gate	IC AHC/VHC SERIES, QUAD 2-INPUT NAND GATE, PDSO14, PLASTIC, EIAJ, SOIC-14, Gate	IC AHC/VHC SERIES, QUAD 2-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14, Gate
厂商名称	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
零件包装代码	TSSOP	TSSOP	SOIC	SOIC	SOIC	SOIC	DIP
包装说明	TSSOP,	TSSOP,	SOP,	SOP,	SOP,	SOP,	DIP,
针数	14	14	14	14	14	14	14
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
系列	AHC/VHC	AHC/VHC	AHC/VHC	AHC/VHC	AHC/VHC	AHC/VHC	AHC/VHC
JESD-30 代码	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDIP-T14
长度	5 mm	5 mm	8.65 mm	8.65 mm	10.11 mm	10.11 mm	19.18 mm
负载电容（CL）	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
逻辑集成电路类型	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
功能数量	4	4	4	4	4	4	4
输入次数	2	2	2	2	2	2	2
端子数量	14	14	14	14	14	14	14
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	TSSOP	SOP	SOP	SOP	SOP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
传播延迟（tpd）	11 ns	11 ns	11 ns	11 ns	11 ns	11 ns	11 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.1 mm	1.1 mm	1.75 mm	1.75 mm	2.108 mm	2.108 mm	5.08 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
端子节距	0.65 mm	0.65 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	4.4 mm	4.4 mm	3.9 mm	3.9 mm	5.3 mm	5.3 mm	7.62 mm
Base Number Matches	1	1	1	1	1	1	-

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