Burr Brown Products
from Texas Instruments
TS
C2
®
00
4
TSC2004
SBAS408A – JUNE 2007 – REVISED AUGUST 2007
1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire
TOUCH SCREEN CONTROLLER with I
2
C™ Interface
FEATURES
•
•
•
•
•
•
•
4-Wire Touch Screen Interface
Ratiometric Conversion
Single 1.2V to 3.6V Supply
Preprocessing to Reduce Bus Activity
High-Speed I
2
C-Compatible Interface
Internal Detection of Screen Touch
Register-Based Programmable:
– 10-Bit or 12-Bit Resolution
– Sampling Rates
– System Timing
On-Chip Temperature Measurement
Touch Pressure Measurement
Auto Power-Down Control
Low Power:
– 760μW at 1.8V, 50SSPS
– 580μW at 1.6V, 50SSPS
– 285μW at 1.2V, 50SSPS
– 74μW at 1.6V, 8.2kSPS Eq. Rate
– 47μW at 1.2V, 8.2kSPS Eq. Rate
Enhanced ESD Protection:
–
±6kV
HBM
–
±1kV
CDM
– Target
±18kV
Air Gap Discharge
– Target
±12kV
Contact Discharge
2.5 x 2.5 WCSP-18 and 4 x 4 QFN-20 Packages
APPLICATIONS
•
•
•
•
Cellular Phones
Portable Instruments
MP3 Players, Pagers
Multiscreen Touch Control
DESCRIPTION
The TSC2004 is a very low-power touch screen
controller designed to work with power-sensitive,
handheld applications that are based on an
advanced low-voltage processor. It works with a
supply voltage as low as 1.2V, which can be
supplied by a single-cell battery. It contains a
complete, ultra-low power, 12-bit, analog-to-digital
(A/D) resistive touch screen converter, including
drivers and the control logic to measure touch
pressure.
In addition to these standard features, the TSC2004
offers preprocessing of the touch screen
measurements to reduce bus loading, thus reducing
the consumption of host processor resources that
can then be redirected to more critical functions.
The TSC2004 supports an I
2
C serial bus and data
transmission protocol in all three defined modes:
standard,
fast,
and
high-speed.
It
offers
programmable resolution of 10 or 12 bits to
accommodate
different
screen
sizes
and
performance needs.
The TSC2004 is available in a miniature, 18-lead,
5 x 5 array, (2.554
±0.54)mm
x (2.554
±0.54)mm
wafer chip-scale package (WCSP), and a 20-pin, 4 x
4 QFN package. Both packages are characterized
for the –40°C to +85°C industrial temperature range.
PENIRQ
•
•
•
•
•
•
U.S. Patent NO. 6246394; other patents pending.
VREF
X+
X-
Y+
Y-
Touch
Screen
Drivers
Interface
TEMP
AUX
Internal
Clock
DAV
PINTDAV
Pre-Processing
SCL
I C
Serial
Interface
and
Control
2
Mux
SAR
ADC
SDA
AD0
AD1
RESET
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
I2C is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TSC2004
www.ti.com
SBAS408A – JUNE 2007 – REVISED AUGUST 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
(1)
TYPICAL
INTEGRAL
LINEARITY
(LSB)
TYPICAL
GAIN
ERROR
(LSB)
NO MISSING
CODES
RESOLUTION
(BITS)
PACKAGE
TYPE
20-Pin,
0.8 x 4 x 4
Thin QFN
TSC2004
–0.8 to +1.4
+0.1
11
18-Pin,
5 x 5 Matrix,
2.5 x 2.5
WCSP
TSC2004IYZKT
YZK
–40°C to +85°C
TSC2004I
TSC2004IYZKR
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TSC2004IRTJT
RTJ
–40°C to +85°C
TSC2004I
TSC2004IRTJR
TRANSPORT
MEDIA,
QUANTITY
Small Tape
and Reel, 250
Tape and
Reel, 2500
Small Tape
and Reel, 250
Tape and
Reel, 2500
PRODUCT
(1)
For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted)
TSC2004
Analog input X+, Y+, AUX to SNSGND
Analog input X–, Y– to SNSGND
Voltage range
SNSVDD to SNSGND
SNSVDD to AGND
I/OVDD to DGND
SNSVDD to I/OVDD
Digital input voltage to DGND
Digital output voltage to DGND
Power dissipation
Thermal impedance,
θ
JA
Operating free-air temperature range, T
A
Storage temperature range, T
STG
Junction temperature, T
J
Max
Lead temperature
IEC contact discharge
(2)
IEC air discharge
(1)
(2)
(2)
UNIT
V
V
V
V
V
V
V
V
°C/W
°C/W
°C/W
°C
°C
°C
°C
°C
kV
kV
–0.4 to SNSVDD + 0.1
–0.4 to SNSVDD + 0.1
–0.3 to 5
–0.3 to 5
–0.3 to 5
–2.40 to +0.3
–0.3 to I/OVDD + 0.3
–0.3 to I/OVDD + 0.3
(T
J
Max - T
A
)/θ
JA
WCSP package
QFN package
Low-K
High-K
113
62
39.97
–40 to +85
–65 to +150
+150
Vapor phase (60 sec)
Infrared (15 sec)
X+, X–, Y+, Y–
X+, X–, Y+, Y–
+215
+220
±12
±25
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.
2
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TSC2004
www.ti.com
SBAS408A – JUNE 2007 – REVISED AUGUST 2007
ELECTRICAL CHARACTERISTICS
At T
A
= –40°C to +85°C, SNSVDD = V
REF
= +1.2V to +3.6V, I/OVDD
(1)
= +1.2V to +3.6V, unless otherwise noted.
TSC2004
PARAMETER
AUXILIARY ANALOG INPUT
Input voltage range
Input capacitance
Input leakage current
A/D CONVERTER
Resolution
No missing codes
Integral linearity
Differential linearity
Offset error
SNSVDD = 1.6V, V
REF
= 1.6V,
High-Speed mode, filter off
SNSVDD = 1.6V, V
REF
= 1.6V,
High-Speed mode, filter off
TSC2004IRTJ
TSC2004IYZK
TSC2004IRTJ
TSC2004IYZK
–3
Programmable: 10 or 12 bits
12-bit resolution
11
–4
–2
0
–0.8 to +1.4
–0.6 to +0.7
2.2
2.2
0.1
0.1
+3
+4
+4
5
12
Bits
Bits
LSB
(2)
LSB
LSB
LSB
LSB
–1
0
12
+1
VREF
V
pF
μA
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Gain error
REFERENCE INPUT
V
REF
range
VREF input current drain
Input impedance
TOUCH SENSORS
PENIRQ Pull-Up Resistor,
R
IRQ
Switch
On-
Resistance
Y+, X+
Y–, X–
1.2
Non-cont. AUX mode, SNSVDD = V
REF
= 1.6V,
T
A
= +25°C, f
ADC
= 2MHz, High-Speed mode
A/D converter not converting
1.2
1
SNSVDD
V
μA
GΩ
T
A
= +25°C, SNSVDD = V
REF
= 1.6V
T
A
= +25°C, SNSVDD = V
REF
= 1.6V
T
A
= +25°C, SNSVDD = V
REF
= 1.6V
100ms duration
47
6
5
50
kΩ
Ω
Ω
mA
°C
°C/LSB
°C/LSB
°C/LSB
°C/LSB
°C/LSB
°C/LSB
°C/LSB
°C/LSB
MHz
4.3
MHz
MHz
%/°C
%/°C
%/°C
Switch drivers drive current
(3)
INTERNAL TEMPERATURE SENSOR
Temperature range
Differential method
(4)
Resolution
TEMP1
(5)
Differential method
(4)
Accuracy
TEMP1
(5)
INTERNAL OSCILLATOR
SNSVDD = 1.2V, T
A
= +25°C
Clock frequency, f
OSC
SNSVDD = 1.6V
SNSVDD = 3.0V, T
A
= +25°C
SNSVDD = 1.2V
Frequency drift
SNSVDD = 1.6V
SNSVDD = 3.0V
3.6
3.3
3.9
4.1
0.118
–0.018
–0.032
SNSVDD = 1.6V
SNSVDD = 3V
SNSVDD = 1.6V
SNSVDD = 3V
SNSVDD = 1.6V
SNSVDD = 3V
SNSVDD = 1.6V
SNSVDD = 3V
–40
0.3
1.6
0.3
1.6
±3
±2
±3
±2
+85
(1)
(2)
(3)
(4)
(5)
I/OVDD must be
≤
SNSVDD.
LSB means Least Significant Bit. With V
REF
= +2.5V, one LSB is 610μV.
Assured by design, but not tested. Exceeding 50mA source current may result in device degradation.
Difference between TEMP1 and TEMP2 measurement; no calibration necessary.
Temperature drift is –2.1mV/°C.
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3
TSC2004
www.ti.com
SBAS408A – JUNE 2007 – REVISED AUGUST 2007
ELECTRICAL CHARACTERISTICS (continued)
At T
A
= –40°C to +85°C, SNSVDD = V
REF
= +1.2V to +3.6V, I/OVDD = +1.2V to +3.6V, unless otherwise noted.
TSC2004
PARAMETER
DIGITAL INPUT/OUTPUT
Logic family
V
IH
V
IL
Logic level
I
IL
C
IN
V
OH
V
OL
I
LEAK
C
OUT
Data format
POWER-SUPPLY REQUIREMENTS
Power-supply voltage
SNSVDD
I/OVDD
(6)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CMOS
1.2V
≤
I/OVDD < 1.6V
1.6V
≤
I/OVDD
≤
3.6V
1.2V
≤
I/OVDD < 1.6V
1.6V
≤
I/OVDD
≤
3.6V
SCL and SDA pins
SCL and SDA pins
I
OH
= 2 TTL loads
I
OL
= 2 TTL loads
Floating output
Floating output
Straight Binary
I/OVDD – 0.2
0
–1
0.7
×
I/OVDD
0.7
×
I/OVDD
–0.3
–0.3
–1
I/OVDD + 0.3
I/OVDD + 0.3
0.2
×
I/OVDD
0.3
×
I/OVDD
1
10
I/OVDD
0.2
1
10
V
V
V
V
μA
pF
V
V
μA
pF
Specified performance
1.2
1.2
3.6
SNSVDD
237
364
V
V
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
T
A
= +25°C, filter on, M = 15,
W = 7, PSM = 1, C[3:0] =
(0,0,0,0), RM = 1, CL[1:0] =
(0,1), BTD[2:0] = (1,0,1),
50SSPS, MAVEX = MAVEY =
MAVEZ = 1, f
ADC
= 2MHz,
High-Speed mode, sensor
drivers supply included
SNSVDD = I/OVDD = V
REF
= 1.2V
x
SNSVDD = I/OVDD = V
REF
= 1.6V
x
SNSVDD = I/OVDD = V
REF
= 3.0V
797
T
A
= +25°C, filter off, M = W = SNSVDD = I/OVDD = V
REF
= 1.2V
1, PSM = 1, C[3:0] = (0,0,0,0),
x
RM = 1, CL[1:0] = (0,1),
SNSVDD = I/OVDD = V
REF
= 1.6V
BTD[2:0] = (1,0,1), 50SSPS,
x
MAVEX = MAVEY = MAVEZ =
1, f
ADC
= 2MHz, High-Speed
mode, sensor drivers supply
SNSVDD = I/OVDD = V
REF
= 3.0V
included
Quiescent supply current
(7) (8)
T
A
= +25°C, filter off, M = W =
1, C[3:0] = (0,1,0,1), RM = 1,
CL[1:0] = (0,1), non-cont AUX
mode, f
ADC
= 2MHz,
High-Speed mode
T
A
= +25°C, filter on, M = 7, W
= 3, C[3:0] = (0,1,0,1), RM = 1,
CL[1:0] = (0,1), MAVEAUX =
1, non-cont AUX mode, f
ADC
=
2MHz, High-Speed mode, full
speed
T
A
= +25°C, filter on, M = 7, W
= 3, C[3:0] = (0,1,0,1), RM = 1,
CL[1:0] = (0,1), MAVEAUX =
1, non-cont AUX mode, f
ADC
=
2MHz, High-Speed mode,
reduced speed (8.2kSPS
equivalent rate)
Power down supply current
Not addressed, SCL =SDA = 1
SNSVDD = I/OVDD = V
REF
= 1.2V
SNSVDD = I/OVDD = V
REF
= 1.6V
SNSVDD = I/OVDD = V
REF
= 3.0V
SNSVDD = I/OVDD = V
REF
= 1.2V,
~10.3kSPS effective rate
SNSVDD = I/OVDD = V
REF
= 1.6V,
~11.8kSPS effective rate
SNSVDD = I/OVDD = V
REF
= 3.0V,
~12.3kSPS effective rate
SNSVDD = I/OVDD = V
REF
= 1.2V,
~1.17kSPS effective rate
SNSVDD = I/OVDD = V
REF
= 1.6V,
~1.17kSPS effective rate
SNSVDD = I/OVDD = V
REF
= 3.0V,
~1.17kSPS effective rate
237
342
757
176
268
526
347
468
897
39.4
46.4
85.3
0
0.8
μA
(6)
(7)
(8)
I/OVDD must be
≤
SNSVDD.
Supply current from SNSVDD.
For detailed information on test condition parameter and bit settings, see the
Digital Interface
section.
4
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TSC2004
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SBAS408A – JUNE 2007 – REVISED AUGUST 2007
PIN CONFIGURATION
RTJ PACKAGE
(1)
QFN-20
(TOP VIEW)
SUBGND
SNSVDD
VREF
YZK PACKAGE
WCSP-18
(TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE)
AGND
5
VREF
SNSVDD
X+
Y+
Y+
X+
15
X
-
Y
-
SNSGND
NC
AD0
16
17
18
19
20
1
14
13
12
11
4
10
9
AGND
AUX
NC
I/OVDD
DGND
1
2
AUX
NC
SUBGND
X-
Rows
I/OVDD
3
DGND
NC
NC
NC
Y-
TSC2004
8
7
AD1
NC
NC
SNSGND
Thermal Pad
2
3
4
5
6
PINTDAV RESET
SCL
SDA
AD0
SDA
PINTDAV
RESET
SCL
AD1
A
B
C
Columns
(FRONT
VIEW)
D
E
(1)
The thermal pad is internally connected to
SUBGND. The thermal pad can be
connected to the analog ground or left
floating. Keep the thermal pad separate
from the digital ground, if possible.
PIN ASSIGNMENTS
PIN NO.
QFN
1
2
3
4
5
6
7
8, 19
9
10
11
12
13
14
15
16
17
18
20
—
WCSP
D1
C1
B2
A1
B1
A2
A3
B3, B4,
C2, C3,
D2, D3
A4
A5
B5
C5
D5
E5
D4
E4
E3
E2
E1
C4
PIN
NAME
SDA
SCL
AD1
PINTDAV
RESET
DGND
I/OVDD
NC
AUX
AGND
VREF
SNSVDD
X+
Y+
SUBGND
X–
Y–
SNSGND
AD0
NC
I
D
I
I
A
A
I
I
A
A
I
A
I
A
I/O
I/O
I
I
O
I
A/D
D
D
D
D
D
DESCRIPTION
Serial data I/O
Serial clock.
Address input bit 1
Interrupt output. Data available or PENIRQ, depending on setting. Pin polarity with active low.
System reset. All register values reset to default values.
Digital ground
Digital I/O interface voltage
No internal connection, but solder bumps are populated. These pins may be connected to analog ground
for mechanical stability.
Auxiliary channel input
Analog ground
External reference input
Power supply for sensor drivers and other analog blocks.
X+ channel input
Y+ channel input
Substrate ground (for ESD current). Connection to AGND (on the PCB) is recommended.
X– channel input
Y– channel input
Sensor driver return
Address input bit 0
No solder bump for this location. Sensitive area. Avoid trtace beneath.
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