REVISIONS
LTR
C
D
DESCRIPTION
Added case outline Z. Corrected the true dimensioning table feature
for case outlines U, X, and Y. -sld
Added case outline 9. Added vendor cage 0EU86 for device types 01
through 03 in the Standard Microcircuit Drawing Source Approval
Bulletin. -sld
Added case outline B. Added note to paragraph 1.2.4. -sld
DATE (YR-MO-DA)
98-08-13
00-04-19
APPROVED
K. A. Cottongim
Raymond Monnin
E
03-10-20
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
E
15
E
16
E
17
E
18
REV
SHEET
PREPARED BY
Gary Zahn
CHECKED BY
Michael C. Jones
E
19
E
20
E
21
E
1
E
22
E
2
E
23
E
3
E
24
E
4
E
25
E
5
E
26
E
6
E
27
E
7
E
28
E
8
E
29
E
9
E
10
E
11
E
12
E
13
E
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY,
DIGITAL, 32K x 32-BIT, ELECTRICALLY
ERASABLE AND PROGRAMMABLE READ
ONLY MEMORY
SIZE
A
SHEET
CAGE CODE
DRAWING APPROVAL DATE
94-08-26
AMSC N/A
REVISION LEVEL
E
67268
1 OF
29
5962-94614
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E012-04
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
Federal
stock class
designator
\
-
RHA
designator
(see 1.2.1)
94614
01
Device
type
(see 1.2.2)
/
H
Device
class
designator
(see 1.2.3)
M
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
E32K32-150
E32K32-120
E32K32-90
Circuit function
EEPROM, 32K x 32-bit
EEPROM, 32K x 32-bit
EEPROM, 32K x 32-bit
Access time
150 ns
120 ns
90 ns
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
H
G
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
E
D
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
E
5962-94614
SHEET
2
DSCC FORM 2234
APR 97
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
B
M
U
X
Y 1/
Z
9 2/
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
68
68
66
66
66
68
68
Package style
Co-fired ceramic, single cavity, quad flatpack
Ceramic, dual cavity, quad flatpack
1.075", hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, without standoffs
Co-fired ceramic, single cavity, ultra low profile,
quad flatpack
Co-fired ceramic, single cavity, quad flatpack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 3/
Supply voltage range (V
CC
) .......................................................
Input voltage range....................................................................
Power dissipation (P
D
)...............................................................
Storage temperature range .......................................................
Lead temperature (soldering, 10 seconds)................................
Thermal resistance junction-to-case (θ
JC
):
Case outlines M and Z ...........................................................
Case outlines U, X, and Y ......................................................
Cases outline B and 9............................................................
Data retention............................................................................
Endurance .................................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)........................................................
Input low voltage range (V
IL
)......................................................
Input high voltage range (V
IH
)....................................................
Output voltage, High minimum (V
OH
).........................................
Output voltage, low maximum (V
OL
) ..........................................
Case operating temperature range (T
C
) ....................................
+4.5 V dc to +5.5 V dc
-0.5 V dc to +0.8 V dc
+2.0 V dc to V
CC
+ 0.3 V dc
+2.4 V dc
+0.45 V dc
-55°C to +125°C
-0.6 V dc to +6.25 V dc
-0.6 V dc to +6.25 V dc
1.5 W
-65°C to +150°C
+300°C
11.3°C/W
2.8°C/W
4.57°C/W
10 years minimum
10,000 cycles minimum
1/
2/
3/
The case outline Y is inactive for new design.
Due to the short leads of case outline 9, caution should be taken if the system application is to be used where
extreme thermal transitions can occur.
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at
the maximum levels may degrade performance and affect reliability.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
E
5962-94614
SHEET
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbook are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class.
Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534).
Furthermore, the manufacturer may take exceptions or use alternate methods to the tests and inspections herein and not
perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device
class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figure 4, 5, 6, and 7.
3.2.5 Block diagram. The block diagram shall be as specified on figure 8 .
3.2.6 Output test circuit. The output test circuit shall be as specified on figure 9 .
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
E
5962-94614
SHEET
4
DSCC FORM 2234
APR 97
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available
upon request.
3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked
with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for
those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer
and be made available to the preparing activity (DSCC-VA) upon request.
3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This
reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the
reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of
program/erase cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept
under document control and shall be made available upon request of the acquiring or preparing activity.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
E
5962-94614
SHEET
5
DSCC FORM 2234
APR 97
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