Si3066
V.3 2 F C C + E
M B E D D E D
D
I R E C T
A
C C E S S
A
R R A N G E M E N T
Features
Supports up to V.32 modem
speeds
Compliant with 49 PTTs,
including FCC, JATE, China, and
Korea
Integrated analog front end
(AFE) and 2- to 4-wire hybrid
Integrated ring detector
Pulse dialing support
Patented >6000 V isolation
technology
Proprietary isolation capacitor
interface to integrated DAA module
Line voltage monitor
Loop current monitor
Caller ID support
Lead-free and RoHS-compliant
8-pin ESOIC package
Ordering Information
See page 36.
Applications
V.32 modems
Digital televisions
Set-top boxes
Fax machines
ePOS terminals
Multi-function
printers
Vending machines
Pin Assignments
Si3066
Si3066
C1B
C2B
VREG
CID
1
2
3
4
9
Description
The Si3066 is an integrated direct access arrangement (DAA) for use with
an integrated DAA system-side module. It includes a V.32 quality codec, dc
termination, ac termination, and an integrated hybrid, eliminating the need
for an analog front end (AFE), isolation transformer, relays, optoisolator,
and a 2- to 4-wire hybrid. It interfaces directly to the integrated system-side
module and features Silicon Laboratories’ patented isolation technology.
The Si3066 dramatically reduces the board space, component count, and
cost required to implement a DAA compliant with the regulatory
requirements of 49 different PTTs including FCC, JATE, China, and Korea.
IGND
8
7
6
5
RX
DCT
QB
QE
US Patent # 5,870,046
US Patent # 6,061,009
Other Patents Pending
Functional Block Diagram
Si3066
RX
Silicon
Laboratories
Embedded
System-side
DAA Module
C1B
Hybrid and
dc
Termination
Isolation
Interface
DCT
TIP
BOM
RING
VREG
IGND
C2B
Ring Detect
Off-Hook
CID
QB
QE
Rev. 1.0 9/05
Copyright © 2005 by Silicon Laboratories
Si3066
Si3066
T
A B L E O F
C
O N T E N TS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4. Telephone Line Interface Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1. Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
4.2. Isolation Barrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.3. Parallel Handset Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.4. Loop Current Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.5. Line Voltage Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.6. Off-Hook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.7. DC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.8. Transhybrid Balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4.9. Ring Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4.10. Ring Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
4.11. Ringer Impedance and Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.12. DTMF Dialing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.13. Pulse Dialing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4.14. Receive Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.15. On-Hook Line Monitor Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
4.16. Caller ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.17. Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.18. Sample Rate Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.19. Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.20. Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.21. Revision Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5. Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8. Package Outline: 8-Pin Exposed Pad SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Rev. 1.0
3
Si3066
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
*
Ambient Temperature
Symbol
T
A
Test Condition
F-Grade
Min
0
Typ
25
Max
70
Unit
°C
*Note:
All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise stated.
Table 2. DAA Loop Characteristics
(V
D
= 3.0 to 3.6 V, T
A
= 0 to 70 °C, see Figure 1)
Parameter
DC Termination Voltage
DC Termination Voltage
On-Hook Leakage Current
Operating Loop Current
DC Ring Current
Ring Detect Voltage
*
Ring Frequency
Ringer Equivalence Number
Symbol
V
TR
V
TR
I
LK
I
LP
Test Condition
I
L
= 20 mA
I
L
= 120 mA
V
TR
= –100 V
Min
—
9
—
15
Typ
—
—
—
—
1.5
15
—
—
Max
7.5
—
12
120
3
35
68
0.2
Unit
V
V
µA
mA
µA
V
rms
Hz
dc current flowing through
ring detection circuitry
V
RD
F
R
REN
—
10
15
—
*Note:
The ring signal is guaranteed to not be detected below the minimum. The ring signal is guaranteed to be detected
above the maximum.
TIP
+
600
Ω
Si3066
V
TR
10
µF
–
I
L
RING
Figure 1. Test Circuit for Loop Characteristics
4
Rev. 1.0
Si3066
Table 3. DAA AC Characteristics
(T
A
= 0 to 70 °C, Fs = 8 kHz)
Parameter
Sample Rate
Receive Frequency Response
Transmit Full Scale Level
1
Receive Full Scale Level
1,2
Dynamic Range
3,4,5
Dynamic Range
3,4,5
Transmit Total Harmonic Distortion
5,6
Receive Total Harmonic Distortion
5,6
Dynamic Range (caller ID
Caller ID Full Scale Level
mode)
7
Symbol
Fs
Test Condition
Low –3 dBFS Corner
Min Typ Max
7.2
—
—
—
—
—
—
—
—
—
—
5
0.98
0.98
70
70
65
68
50
6
16
—
—
—
—
—
—
—
—
—
Unit
kHz
Hz
V
PEAK
V
PEAK
dB
dB
dB
dB
dB
V
PP
V
FS
V
FS
DR
DR
THD
THD
DR
CID
V
CID
–1 dBm
–1 dBm
I
L
= 100 mA
I
L
= 20 mA
I
L
= 20 mA
I
L
= 20 mA
V
IN
= 1 kHz, –13 dBm
Notes:
1.
Measured at TIP and RING with 600
Ω.
termination at 1 kHz, as shown in Figure 1.
2.
Receive full scale level produces –0.9 dBFS.
3.
DR = 20 x log (rms V
FS
/rms
V
IN
)+ 20 x log (rms
V
IN
/rms noise, excluding harmonics). V
FS
is the –1 dBm full-scale
level.
4.
Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths.
5.
V
IN
= 1 kHz, –3 dBFS
6.
THD = 20 x log (rms distortion / rms signal).
7.
DR
CID
= 20 x log (rms V
CID
/rms V
IN
)+ 20 x log (rms V
IN
/rms noise). V
CID
is the 6 V full-scale level.
Rev. 1.0
5
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