MODEL 143
Custom Commercial
Modules
FEATURES
IMPLEMENTATION
• Low cost surface mount assembly
• Chip on board capability
• Reduced board size
• Ceramic board
• Integral thick film resistors
• U.S. design & management
• U.S. or offshore Assembly
• Versatile lead configuration
• Low profile outline
DESCRIPTION
Whether you are upgrading your “through-hole” circuit
board to surface mount or developing a new design, BI
Technologies has the solution for you. BI commercial
hybrids can be used as subassemblies on a
motherboard, or they can encompass your entire
circuit.
Hybrid assemblies are being used in an increasing
number of applications. BI commercial assemblies are
circuit boards based on ceramic material rather than
conventional polymer materials. In small to mid-sized
assemblies, ceramic substrates offer price competitive
solutions and many quality and design advantages.
Resistors are directly screened onto the substrate and
other components are typically surface mounted. Chip
and wire attachment is available for components
where required. A variety of lead frame configurations
are available to create SIP’s, DIP’s, through hole, and
surface mountable assemblies. Polymer encapsulation
can be used to protect components and proprietary
designs.
BI has an experienced design team that provides
customer assistance on new programs from the
proposal/estimate phase through development and
into production.
During the proposal phase, a customer interface will
be set up to develop and price alternate design
approaches. During the development phase, a close
working arrangement will be maintained through
prototype samples and into production.
Simply submit a circuit schematic, dimensional
constraints, critical components and any special
requirements to BI Marketing. BI will produce a sizing
estimate and costing workup to meet your design
goals.
COMMITMENT
BI is committed to servicing your needs. BI has been a
dominant force in the commercial and military hybrid
microelectronics industry since its conception. Our
reputation is built on over 25 years of proven reliability
and quality. Program Management, engineering, and
quality departments are located in Fullerton, California
for ease of contact and interface. BI’s domestic
location is your window to global facilities. BI
Fullerton can draw on multiple factory locations,
including Mexico, Scotland, Asia and Fullerton, to
select the optimum resources for your assembly
needs.
Specifications subject to change without notice.
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Model 143
CERAMIC BOARD (A)
SURFACE MOUNT SEMICONDUCTORS (D)
Our hybrids use ceramic (alumina) substrates to
achieve optimum size reduction and reliability.
Ceramic substrates produce an environmentally
superior product. The advantages of ceramic over
polymer board construction include: better heat
dissipation, elimination of blistering, minimal moisture
absorption, reduced size and improved performance.
For small-sized assemblies (up to approx. 2” x 2”),
ceramic board construction is usually the low cost
choice. Thick film conductors, typically Palladium
silver or gold, as small as 5 mil wide, are screened
onto the substrate. Multilayer construction of up to
five metal layers is standard.
PRECISION SCREENED RESISTORS (B)
BI has experience with a wide range of surface
mountable
semiconductors
in
packaged
configurations, including SOT, SO, SOL and PLCC.
Our commercial hybrids will also accommodate
semiconductor die attached and wire bonded directly
to the substrate. This allows us to utilize ASICs and
other semiconductors not currently offered in a
surface mountable package.
SURFACE MOUNT PASSIVE COMPONENTS (E)
Ceramic and tantalum capacitors, chip inductors and
resistor chips all lend themselves to surface mount
assembly. Axial leaded components can be formed
and mounted as well.
ENCAPSULATION (F)
Thick film resistors are screened directly onto the
substrate utilizing a wide range of resistor inks,
yielding high precision at low cost. Our thick film
resistors can be ratio matched to 0.1% with absolute
tolerances of 0.5%. Thick film resistors can be located
underneath surface mount devices, or screened onto
the back of the substrate for increased circuit
densities.
INTERCONNECT FLEXIBILITY (C)
Surface mount hybrids do not normally require
encapsulation. However, encapsulation may be
applied if desired for rigidity or for protection of
proprietary circuit design. When chip and wire
elements are used, these are generally individually
“glob-topped” to provide protection for the device; the
entire module may then be fully encapsulated.
Lead frames can be attached to accommodate a variety
of interconnection requirements. Leads can be affixed
to any or all edges of the substrate and can be
configured for various mounting styles. Additionally, a
wide variety of standard sockets can be attached to
allow plug-in capability to your next level of assembly.
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Model 143
DSP 与 ARM 处理器
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