Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> 88AP270MA2-BHE1E416

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88AP270MA2-BHE1E416: 产品描述RISC Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-360; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共131页; 制造商Marvell(美满科技); 官网地址http://www.marvell.com; 标准

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88AP270MA2-BHE1E416概述

RISC Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-360

88AP270MA2-BHE1E416规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Marvell(美满科技)
零件包装代码	BGA
包装说明	BGA, BGA360,22X22,40
针数	360
Reach Compliance Code	compliant
ECCN代码	3A991.A.2
地址总线宽度	26
边界扫描	YES
最大时钟频率	13 MHz
外部数据总线宽度	32
格式	FIXED POINT
集成缓存	NO
JESD-30 代码	S-PBGA-B360
JESD-609代码	e1
长度	23 mm
低功率模式	YES
端子数量	360
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA360,22X22,40
封装形状	SQUARE
封装形式	GRID ARRAY
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	1.8/3.3 V
认证状态	Not Qualified
座面最大高度	2.59 mm
速度	416 MHz
最大供电电压	1.705 V
最小供电电压	1.2825 V
标称供电电压	1.35 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	23 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC
Base Number Matches	1

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Cover

Marvell

PXA270

Processor

Electrical, Mechanical, Thermal Specification

Doc. No. MV-S104690-00 , Rev. D

April 2009

Marvell.

Moving Forward Faster

Released

1.1

Introduction..................................................................................................................................11

About This Document......................................................................................................................................11

1.1.1

Number Representation....................................................................................................................11

1.1.2

Typographical Conventions ..............................................................................................................11

1.1.3

Applicable Documents ......................................................................................................................11

3.1

3.2

3.3

3.4

3.5

Functional Overview ...................................................................................................................13

Package Information ...................................................................................................................15

Package Information .......................................................................................................................................16

Processor Materials ........................................................................................................................................24

Junction To Case Temperature Thermal Resistance......................................................................................25

Processor Markings ........................................................................................................................................25

Tray Drawing ...................................................................................................................................................25

4.1

Pin Listing and Signal Definitions .............................................................................................27

Ball Map View .................................................................................................................................................27

4.1.1

13x13 mm VF-BGA Ball map............................................................................................................27

4.1.2

23x23 mm PBGA Ball map ...............................................................................................................32

Pin Use............................................................................................................................................................35

Signal Types ...................................................................................................................................................58

Memory Controller Reset and Initialization......................................................................................................59

Power-Supply Pins ..........................................................................................................................................60

4.2

4.3

4.4

4.5

5.1

5.2

5.3

5.4

5.5

Electrical Specifications .............................................................................................................63

Absolute Maximum Ratings ............................................................................................................................63

Operating Conditions ......................................................................................................................................64

5.2.1

Internal Power Domains ...................................................................................................................68

Power-Consumption Specifications.................................................................................................................69

DC Specification..............................................................................................................................................74

Oscillator Electrical Specifications...................................................................................................................75

5.5.1

32.768-kHz Oscillator Specifications ................................................................................................75

5.5.2

13.000-MHz Oscillator Specifications ...............................................................................................77

CLK_PIO and CLK_TOUT Specifications .......................................................................................................78

48 MHz Output Specifications .........................................................................................................................79

5.6

5.7

6.1

AC Timing Specifications ...........................................................................................................81

AC Test Load Specifications ...........................................................................................................................81

April 2009 Released

Doc. No. MV-S104690-00 Rev. D

Page 3

PXA270 Processor

Electrical, Mechanical, and Thermal Specification

6.2

Reset and Power Manager Timing Specifications...........................................................................................82

6.2.1

Power-On Timing Specifications.......................................................................................................82

6.2.2

Hardware Reset Timing ....................................................................................................................84

6.2.3

Watchdog Reset Timing ...................................................................................................................84

6.2.4

GPIO Reset Timing...........................................................................................................................84

6.2.5

Sleep Mode Timing ...........................................................................................................................86

6.2.6

Deep-Sleep Mode Timing .................................................................................................................87

6.2.7

GPIO states in Deep-Sleep mode ....................................................................................................88

6.2.8

Standby-Mode Timing.......................................................................................................................90

6.2.9

Idle-Mode Timing ..............................................................................................................................90

6.2.10 Frequency-Change Timing ...............................................................................................................90

6.2.11 Voltage-Change Timing ....................................................................................................................90

GPIO Timing Specifications ............................................................................................................................91

Memory and Expansion-Card Timing Specifications.......................................................................................91

6.4.1

Internal SRAM Read/Write Timing Specifications.............................................................................92

6.4.2

SDRAM Parameters and Timing Diagrams ......................................................................................92

6.4.3

ROM Parameters and Timing Diagrams...........................................................................................98

6.4.4

Flash Memory Parameters and Timing Diagrams ..........................................................................103

6.4.5

SRAM Parameters and Timing Diagrams.......................................................................................113

6.4.6

Variable-Latency I/O Parameters and Timing Diagrams ................................................................116

6.4.7

Expansion-Card Interface Parameters and Timing Diagrams ........................................................119

LCD Timing Specifications ............................................................................................................................122

SSP Timing Specifications ............................................................................................................................123

JTAG Boundary Scan Timing Specifications.................................................................................................126

Marvell® Quick Capture Technology AC Timing...........................................................................................127

MultiMediaCard Timing Specifications ..........................................................................................................129

Secure Digital (SD/SDIO) Timing ..................................................................................................................129

6.3

6.4

6.5

6.6

6.7

6.8

6.9

6.10

Doc. No. MV-S104690-00 Rev. D

Page 4

April 2009 Released

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Figure 44:

Marvell® PXA270 Processor Block Diagram, Typical System .........................................................14

Marvell® PXA270M Processor Part Numbers ..................................................................................15

13x13mm VF-BGA Marvell® PXA270 Processor Package, top view...............................................16

13x13mm VF-BGA Marvell® PXA270 Processor Package, bottom view.........................................17

13x13mm VF-BGA Marvell® PXA270 Processor Package, side view .............................................18

Marvell® PXA270M 13mm x 13mm Package Mark Diagram ...........................................................19

Marvell® PXA270M 23mm x 23mm Package Mark Diagram ...........................................................20

23x23 mm PBGA Marvell® PXA270 Processor Package (Top View) ..............................................21

23x23 mm PBGA Marvell® PXA270 Processor Package (Bottom View).........................................22

23x23 mm PBGA Marvell® PXA270 Processor Package (Side View) .............................................22

Package Compliance Criteria ...........................................................................................................23

13x13mm VF-BGA Marvell® PXA270 Processor Package, bottom view.........................................24

Marvell® PXA270 Processor Production Markings, (Laser Mark on Top Side)................................25

13x13 mm VF-BGA Ball Map, Top View (upper left quarter) ............................................................28

13x13 mm VF-BGA Ball Map, Top View (upper right quarter)..........................................................29

13x13 mm VF-BGA Ball Map, Top View (bottom left quarter) ..........................................................30

13x13 mm VF-BGA Ball Map, Top View (bottom right quarter) .......................................................31

23x23 mm PBGA Ball Map, Top View (Upper Left Quarter).............................................................32

23x23 mm PBGA Ball Map, Top View (Upper Right Quarter) ..........................................................33

23x23 mm PBGA Ball Map, Top View (Lower Left Quarter).............................................................34

23x23 mm PBGA Ball Map, Top View (Lower Right Quarter) ..........................................................35

AC Test Load ....................................................................................................................................81

Power On Reset Timing....................................................................................................................83

Hardware Reset Timing ....................................................................................................................84

GPIO Reset Timing...........................................................................................................................85

Sleep Mode Timing ...........................................................................................................................86

Deep-Sleep-Mode Timing .................................................................................................................87

SDRAM Timing .................................................................................................................................95

SDRAM 4-Beat Read/4-Beat Write, Different Banks Timing ............................................................96

SDRAM 4-Beat Write/4-Beat Write, Same Bank-Same Row Timing................................................97

SDRAM Fly-by DMA Timing .............................................................................................................98

32-Bit Non-burst ROM, SRAM, or Flash Read Timing....................................................................100

32-Bit Burst-of-Eight ROM or Flash Read Timing...........................................................................101

Eight-Beat Burst Read from 16-Bit Burst-of-Four ROM or Flash Timing ........................................102

16-bit ROM/Flash/SRAM Read for 4/2/1 Bytes Timing...................................................................103

Synchronous Flash Burst-of-Eight Read Timing.............................................................................106

Synchronous Flash Stacked Burst-of-Eight Read Timing...............................................................107

First-Access Latency Configuration Timing ....................................................................................108

Synchronous Flash Burst Read Example .......................................................................................110

32-Bit Flash Write Timing ...............................................................................................................111

32-Bit Stacked Flash Write Timing .................................................................................................112

16-Bit Flash Write Timing ...............................................................................................................113

32-Bit SRAM Write Timing ..............................................................................................................115

16-bit SRAM Write for 4/2/1 Byte(s) Timing....................................................................................116

April 2009 Released

Doc. No. MV-S104690-00 Rev. D

Page 5

88AP270MA2-BHE1E416相似产品对比

	88AP270MA2-BHE1E416	88AP270MA2-BHE1E312
描述	RISC Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-360	RISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-360
是否无铅	不含铅	不含铅
是否Rohs认证	符合	符合
厂商名称	Marvell(美满科技)	Marvell(美满科技)
零件包装代码	BGA	BGA
包装说明	BGA, BGA360,22X22,40	BGA, BGA360,22X22,40
针数	360	360
Reach Compliance Code	compliant	compliant
地址总线宽度	26	26
边界扫描	YES	YES
最大时钟频率	13 MHz	13 MHz
外部数据总线宽度	32	32
格式	FIXED POINT	FIXED POINT
集成缓存	NO	NO
JESD-30 代码	S-PBGA-B360	S-PBGA-B360
JESD-609代码	e1	e1
长度	23 mm	23 mm
低功率模式	YES	YES
端子数量	360	360
最高工作温度	85 °C	85 °C
最低工作温度	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA
封装等效代码	BGA360,22X22,40	BGA360,22X22,40
封装形状	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED
电源	1.8/3.3 V	1.8/3.3 V
认证状态	Not Qualified	Not Qualified
座面最大高度	2.59 mm	2.59 mm
速度	416 MHz	312 MHz
最大供电电压	1.705 V	1.705 V
最小供电电压	1.2825 V	1.1875 V
标称供电电压	1.35 V	1.25 V
表面贴装	YES	YES
技术	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL	BALL
端子节距	1 mm	1 mm
端子位置	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED
宽度	23 mm	23 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1

88AP270MA2-BHE1E416

88AP270MA2-BHE1E416概述

88AP270MA2-BHE1E416规格参数

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