电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MAX2307EBC

产品描述Low-Power Cellular Upconverter-Driver
产品类别无线/射频/通信    电信电路   
文件大小158KB,共8页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 全文预览

MAX2307EBC概述

Low-Power Cellular Upconverter-Driver

MAX2307EBC规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码BGA
包装说明ULTRA SMALL, UCSP-12
针数12
Reach Compliance Code_compli
Is SamacsysN
JESD-30 代码R-PBGA-B12
JESD-609代码e0
长度2.02 mm
湿度敏感等级1
功能数量1
端子数量12
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)240
认证状态Not Qualified
座面最大高度0.67 mm
标称供电电压3 V
表面贴装YES
技术BIPOLAR
电信集成电路类型RF AND BASEBAND CIRCUIT
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度1.54 mm
Base Number Matches1

文档预览

下载PDF文档
19-1897 Rev 0; 1/01
NUAL
KIT MA
ATION
ET
EVALU
TA SHE
WS DA
FOLLO
Low-Power Cellular Upconverter-Driver
Features
o
Ultra-Small Implementation Size
o
Low Off-Chip Component Count
o
15mA at -15dBm P
OUT
o
34mA at +6.5dBm P
OUT
and -53dBc ACPR
o
<1µA Shutdown Mode
o
Separate Shutdown for LO Buffer
o
No External Logic Interface Circuitry Required
General Description
The MAX2307 is an integrated RF upconverter-driver
optimized for the Japanese cellular frequency band. It
can also be used for applications in the US cellular and
ISM bands. Its low current consumption (15mA at
-15dBm output) extends the average talk time.
The image rejection is done using only two external
inductors at the upconverter output because the image
frequency in Japanese cellular phones is typically
330MHz away. This realizes the image rejection with no
current consumption penalty and only two inexpensive
off-chip components, saving cost and valuable board
space.
The MAX2307 has a separate shutdown control for the
LO buffer to minimize VCO pulling. It comes in an ultra-
small 3
4 ultra-chipscale package (UCSP).
MAX2307
Applications
Cellular Handsets
cdmaOne™ Handsets
ISM Band
PART
MAX2307EBC
Ordering Information
TEMP. RANGE
-40°C to +85°C
PIN-PACKAGE
3
×
4 UCSP
Pin Configuration
TOP VIEW (BUMPS ON BOTTOM)
V
CC
Block Diagram
V
CC
A
VCC
VCC
MIXP
VCC
MIXM
GND
VCCMIXP A2
A3 VCCMIXM
IFINM
C3
C2
IFINP
B
LOIN/
SHDNLO
B4
GC
RFOUT
RFOUT
B3
GC
C
GND
IFINP
IFINM
SHDN
C4
SHDN
BIAS
CTRL
BIAS
CTRL2
1
2
3
4
B1 LOIN/SHDNLO
SHDNLO
LOIN
cdmaOne is a trademark of CDMA Development Group.
________________________________________________________________
Maxim Integrated Products
1
For price, delivery, and to place orders, please contact Maxim Distribution at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1971  2154  1799  689  1208  39  40  47  6  5 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved