AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, MO-153AB, TSSOP-14
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | TSSOP |
包装说明 | TSSOP, |
针数 | 14 |
Reach Compliance Code | unknown |
系列 | AHCT/VHCT/VT |
JESD-30 代码 | R-PDSO-G14 |
JESD-609代码 | e4 |
长度 | 5 mm |
逻辑集成电路类型 | AND GATE |
湿度敏感等级 | 1 |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 9 ns |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 4.4 mm |
Base Number Matches | 1 |
74VHCT08AMTC | 74VHCT08AMTCX | 74VHCT08AM | 74VHCT08AMX | 74VHCT08AN | 74VHCT08ASJX | |
---|---|---|---|---|---|---|
描述 | AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, MO-153AB, TSSOP-14 | AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, MO-153AB, TSSOP-14 | AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 0.150 INCH, MS-012, SOIC-14 | AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 0.150 INCH, MS-012, SOIC-14 | AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDIP14, 0.300 INCH, PLASTIC, MS-001, DIP-14 | AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 5.30 MM, EIAJ TYPE2, SOP-14 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | TSSOP | TSSOP | SOIC | SOIC | DIP | SOIC |
包装说明 | TSSOP, | TSSOP, | SOP, | SOP, | DIP, | SOP, |
针数 | 14 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT/VT |
JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDSO-G14 |
JESD-609代码 | e4 | e4 | e3 | e3 | e3 | e3 |
长度 | 5 mm | 5 mm | 8.6235 mm | 8.6235 mm | 19.18 mm | 10.2 mm |
逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
湿度敏感等级 | 1 | 1 | 1 | 1 | NOT APPLICABLE | 1 |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | SOP | SOP | DIP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | NOT APPLICABLE | 260 |
传播延迟(tpd) | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns |
座面最大高度 | 1.2 mm | 1.2 mm | 1.753 mm | 1.753 mm | 5.08 mm | 2.1 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | NOT APPLICABLE | 30 |
宽度 | 4.4 mm | 4.4 mm | 3.9 mm | 3.9 mm | 7.62 mm | 5.3 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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