IC HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, Multiplexer/Demultiplexer
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | TSSOP, |
| Reach Compliance Code | unknown |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G16 |
| 长度 | 5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 42 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| 74HC258PW-T | 74HC258PW | 74HCT258PW | 74HCT258PW-T | 74HC258NB | 74HCT258DB | 74HCT258DB-T | 74HCT258NB | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, Multiplexer/Demultiplexer | IC HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, Multiplexer/Demultiplexer | IC HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, Multiplexer/Demultiplexer | IC HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, Multiplexer/Demultiplexer | IC HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP16, Multiplexer/Demultiplexer | IC HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, Multiplexer/Demultiplexer | IC HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, Multiplexer/Demultiplexer | IC HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP16, Multiplexer/Demultiplexer |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | HC/UH | HC/UH | HCT | HCT | HC/UH | HCT | HCT | HCT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 |
| 长度 | 5 mm | 5 mm | 5 mm | 5 mm | 19.025 mm | 6.2 mm | 6.2 mm | 19.025 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | DIP | SSOP | SSOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE |
| 传播延迟（tpd） | 42 ns | 42 ns | 51 ns | 51 ns | 42 ns | 51 ns | 51 ns | 51 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 4.2 mm | 2 mm | 2 mm | 4.2 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 5.5 V | 5.5 V | 6 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 4.5 V | 4.5 V | 2 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 7.62 mm | 5.3 mm | 5.3 mm | 7.62 mm |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | TSSOP, | - | TSSOP, | TSSOP, | DIP, | SSOP, | SSOP, | DIP, |
工作这点儿事
嵌入式系统
无线连接
stm32/stm8
嵌入式系统
聊聊、笑笑、闹闹
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
