19-2977; Rev 1; 1/04
Quad, Low-Power, 500Mbps
ATE Driver/Comparator
General Description
The MAX9963/MAX9964 four-channel, low-power, high-
speed pin electronics driver and comparator ICs
include, for each channel, a three-level pin driver, a dual
comparator, and variable clamps. The driver features a
wide voltage range and high-speed operation, includes
high-Z and active-termination (3rd-level drive) modes,
and is highly linear even at low-voltage swings. The dual
comparator provides low dispersion (timing variation)
over a wide variety of input conditions. The clamps pro-
vide damping of high-speed DUT waveforms when the
device is configured as a high-impedance receiver.
High-speed, differential control inputs compatible with
ECL, LVPECL, LVDS, and GTL levels are provided for
each channel. ECL/LVPECL or flexible open-collector
outputs are available for the comparators.
The A-grade version provides tight matching of gain
and offset for the drivers and comparators, allowing ref-
erence levels to be shared across multiple channels in
cost-sensitive systems. For system designs that incor-
porate independent reference levels for each channel,
the B-grade version is available at reduced cost.
Optional internal resistors at the high-speed inputs pro-
vide differential termination of LVDS inputs, while
optional internal resistors provide the pullup voltage
and source termination for open-collector comparator
outputs. These features significantly reduce the dis-
crete component count on the circuit board.
Low-leakage, slew rate, and tri-state/terminate controls
are operational configurations that are programmed
through a 3-wire, low-voltage, CMOS-compatible serial
interface.
The MAX9963/MAX9964 operating range is -1.5V to
+6.5V, with power dissipation of only 825mW per channel.
These devices are available in a 100-pin, 14mm x
14mm body, 0.5mm pitch TQFP with an exposed 8mm
x 8mm die pad on the top (MAX9963) or bottom
(MAX9964) of the package for efficient heat removal.
The MAX9963/MAX9964 are specified to operate with
an internal die temperature of +70°C to +100°C, and
feature a die temperature monitor output.
♦
♦
♦
♦
♦
♦
♦
♦
♦
♦
Features
Small Footprint—Four Channels in 0.4in
2
Low Power Dissipation: 825mW/Channel (typ)
High Speed: 500Mbps at 3V
P-P
Low Timing Dispersion
Wide -1.5V to +6.5V Operating Range
Active Termination (3rd-Level Drive)
Low-Leakage Mode: 15nA (max)
Integrated Clamps
Interface Easily with Most Logic Families
Digitally Programmable Slew Rate
MAX9963/MAX9964
♦
Internal Logic Termination Resistors
♦
Low Gain and Offset Error
Ordering Information
PART
MAX9963ADCCQ*
MAX9963AKCCQ*
MAX9963AGCCQ*
MAX9963AHCCQ*
MAX9963AJCCQ
MAX9963BDCCQ*
MAX9963BKCCQ*
MAX9963BGCCQ
MAX9963BHCCQ*
MAX9963BJCCQ*
MAX9964ADCCQ*
MAX9964AKCCQ*
MAX9964AGCCQ*
MAX9964AHCCQ*
MAX9964AJCCQ*
MAX9964BDCCQ*
MAX9964BKCCQ*
MAX9964BGCCQ
MAX9964BHCCQ*
MAX9964BJCCQ*
TEMP RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
PIN-PACKAGE
100 TQFP-EPR
100 TQFP-EPR
100 TQFP-EPR
100 TQFP-EPR
100 TQFP-EPR
100 TQFP-EPR
100 TQFP-EPR
100 TQFP-EPR
100 TQFP-EPR
100 TQFP-EPR
100 TQFP-EP**
100 TQFP-EP**
100 TQFP-EP**
100 TQFP-EP**
100 TQFP-EP**
100 TQFP-EP**
100 TQFP-EP**
100 TQFP-EP**
100 TQFP-EP**
100 TQFP-EP**
Applications
Flash Memory Testers
Commodity DRAM Testers
Low-Cost Mixed-Signal/System-on-Chip Testers
Active Burn-In Systems
Structural Testers
*Future
product—contact factory for availability.
**EP
= Exposed pad.
Pin Configurations appear at end of data sheet.
Selector Guide appears at end of data sheet.
1
________________________________________________________________
Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Quad, Low-Power, 500Mbps
ATE Driver/Comparator
MAX9963/MAX9964
ABSOLUTE MAXIMUM RATINGS
V
CC
to GND .........................................................-0.3V to +11.5V
V
EE
to GND............................................................-7.0V to +0.3V
All Other Pins ....................................(V
EE
- 0.3V) to (V
CC
+ 0.3V)
V
CC
- V
EE
................................................................-0.3V to +18V
DUT_ to GND.........................................................-2.5V to +7.5V
DATA_, NDATA_, RCV_, NRCV_ to GND ..............-2.5V to +5.0V
DATA_ to NDATA_ ..............................................................±1.5V
RCV_ to NRCV_ ..................................................................±1.5V
V
CCO_ _
to GND ........................................................-0.3V to +5V
SCLK, DIN,
CS, RST
to GND ...................................-1.0V to +5V
DHV_, DLV_, DTV_, CHV_, CLV_ to GND .............-2.5V to +7.5V
CPHV_ to GND ......................................................-2.5V to +8.5V
CPLV_ to GND.......................................................-3.5V to +7.5V
DHV_ to DLV_ ......................................................................±10V
DHV_ to DTV_ ......................................................................±10V
DLV_ to DTV_.......................................................................±10V
CHV_ or CLV_ to DUT_ ........................................................±10V
CH_, NCH_, CL_, NCL_ to GND...............................-2.5V to +5V
Current into DHV_, DLV_, DTV_, CHV_,
CLV_, CPHV_, CPLV_ ...................................................±10mA
Current into TEMP ............................................-0.5mA to +20mA
DUT_ Short Circuit to -1.5V to +6.5V..........................Continuous
Power Dissipation (T
A
= +70°C)
MAX9963_ _CCQ (derate 167mW/°C above
T
A
= +70°C) ..................................................................13.3W*
MAX9964_ _CCQ (derate 47.6mW/°C above
T
A
= +70°C) ....................................................................3.8W*
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature .....................................................+125°C
Lead Temperature (soldering, 10s) .................................+300°C
*Dissipation
wattage values are based on still air with no heat sink for the MAX9963 and slug soldered to board copper for the
MAX9964. Actual maximum power dissipation is a function of the user’s heat-extraction technique and will vary.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= +9.75V, V
EE
= -5.25V, V
CCO_ _
= 2.5V, SC1 = SC0 = 0, V
CPHV_
= 7.2V, V
CPLV_
= -2.2V, T
J
= +85°C, unless otherwise noted. All tem-
perature coefficients are measured at T
J
= +70°C to +100°C, unless otherwise noted.) (Note 1)
PARAMETER
POWER SUPPLIES
Positive Supply
Negative Supply
Positive Supply
Negative Supply
Power Dissipation
DUT_ CHARACTERISTICS
Operating Voltage Range
Maximum
Leakage Current in High-Z Mode
V
DUT
I
DUT
(Note 4)
LLEAK = 0, 0V
≤
V
DUT_
≤
3V
LLEAK = 0, V
DUT_
= -1.5V, 6.5V
LLEAK = 1, 0
≤
V
DUT_
≤
3V, T
J
< +90°C
Leakage Current in Low-Leakage
Mode
LLEAK = 1, V
DUT_
= -1.5V,T
J
< +90°C
LLEAK = 1, V
DUT_
= 6.5V, V
CHV_
= V
CLV_
=
-1.5V, T
J
< +90°C
C
DUT
Driver in term mode (DUT_ = DTV_)
Driver in high-Z mode
3
5
-1.5
+6.5
±1.5
±3
±10
±15
±15
pF
nA
V
µA
V
CC
V
EE
I
CC
I
EE
P
D
(Note 2)
(Note 2)
Calculated at typical V
CC
and V
EE
(Notes 2, 3)
9.5
-6.5
9.75
-5.25
165
-320
3.3
10.5
-4.5
200
-380
4.0
V
V
mA
mA
W
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Combined Capacitance
2
_______________________________________________________________________________________
Quad, Low-Power, 500Mbps
ATE Driver/Comparator
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +9.75V, V
EE
= -5.25V, V
CCO_ _
= 2.5V, SC1 = SC0 = 0, V
CPHV_
= 7.2V, V
CPLV_
= -2.2V, T
J
= +85°C, unless otherwise noted. All tem-
perature coefficients are measured at T
J
= +70°C to +100°C, unless otherwise noted.) (Note 1)
PARAMETER
Low-Leakage Enable Time
Low-Leakage Disable Time
Low-Leakage Recovery
SYMBOL
(Notes 5, 7)
(Notes 6, 7)
Time to return to the specified maximum
leakage after a 3V, 4V/ns step at DUT_
(Note 7)
CONDITIONS
MIN
TYP
20
20
10
MAX
UNITS
µs
µs
µs
MAX9963/MAX9964
LEVEL PROGRAMMING INPUTS
(DHV_, DLV_, DTV_, CHV_, CLV_, CPHV_, CPLV_)
Input Bias Current
Settling Time
Input High Voltage
Input Low Voltage
Differential Input Voltage
Input Bias Current
Input Termination Resistor
V
IH
V
IL
V
DIFF
I
BIAS
MAX996_ _DCCQ, MAX996_ _HCCQ
MAX996_ _KCCQ, MAX996_ _GCCQ,
and MAX996_ _JCCQ, between signal and
complement
96
I
BIAS
To 5mV
-1.6
-2.0
±0.15
1
+3.5
+3.1
±1.00
±25
104
±25
µA
µs
V
V
V
µA
Ω
DIFFERENTIAL CONTROL INPUTS
(DATA_, NDATA_, RCV_, NRCV_)
SINGLE-ENDED CONTROL INPUTS
(CS,
RST,
SCLK, DIN)
Input High
Input Low
SCLK Frequency
SCLK Pulse Width High
SCLK Pulse Width Low
CS
Low to SCLK High Setup
CS
High to SCLK High Setup
SCLK High to
CS
High Hold
DIN to SCLK High Setup
DIN to SCLK High Hold
CS
Pulse Width High
TEMPERATURE MONITOR
(TEMP)
Nominal Voltage
Temperature Coefficient
Output Resistance
T
J
= +70°C, R
L
≥
10MΩ
3.43
+10
15
V
mV/°C
kΩ
V
IH
V
IL
f
SCLK
t
CH
t
CL
t
CSS0
t
CSS1
t
CSH1
t
DS
t
DH
t
CSWH
8
8
3.5
3.5
3.5
3.5
3.5
20
1.6
-0.1
3.5
+0.9
50
V
V
MHz
ns
ns
ns
ns
ns
ns
ns
ns
SERIAL INTERFACE TIMING
(Figure 5)
_______________________________________________________________________________________
3
Quad, Low-Power, 500Mbps
ATE Driver/Comparator
MAX9963/MAX9964
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +9.75V, V
EE
= -5.25V, V
CCO_ _
= 2.5V, SC1 = SC0 = 0, V
CPHV_
= 7.2V, V
CPLV_
= -2.2V, T
J
= +85°C, unless otherwise noted. All tem-
perature coefficients are measured at T
J
= +70°C to +100°C, unless otherwise noted.) (Note 1)
PARAMETER
DRIVERS
(Note 8)
DC OUTPUT CHARACTERISTICS
(R
L
≥
10MΩ )
DHV_, DLV_, DTV_, Output Offset
Voltage
DHV_, DLV_, DTV_, Output Offset
Temperature Coefficient
DHV_, DLV_, DTV_, Gain
DHV_, DLV_, DTV_, Gain
Temperature Coefficient
Linearity Error
DHV_ to DLV_ Crosstalk
DLV_ to DHV_ Crosstalk
DTV_ to DLV_ and DHV_
Crosstalk
DHV_ to DTV_ Crosstalk
DLV_ to DTV_ Crosstalk
0
≤
V
DUT_
≤
3V (Note 9)
Full range (Notes 9, 10)
V
DLV_
= 0, V
DHV_
= 200mV, 6.5V
V
DHV_
= 5V, V
DLV_
= -1.5V, 4.8V
V
DHV_
= 3V, V
DLV_
= 0,
V
DTV_
= -1.5V, 6.5V
V
DTV_
= 1.5V, V
DLV_
= 0, V
DHV_
= 1.6V, 3V
V
DTV_
= 1.5V, V
DHV
= 3V, V
DLV_
= 0, 1.4V
40
±60
49
50
1
30
40
50
0
10
20
mV
ns
ns
mV
±120
51
A
V
Measured with
MAX996_A
V
DHV_
, V
DLV_,
V
DTV_
MAX996_B
at 0 and 4.5V
0.999
0.960
-35
±5
±15
±7
±8
±2
±3
±3
At DUT_ with V
DHV_
, MAX996_A
V
DLV_,
V
DTV_
independently
MAX996_B
tested at +1.5V
±65
1.00
1.001
1.001
ppm/°C
mV
mV
mV
mV
mV
mV
dB
mA
Ω
Ω
±15
mV
±100
µV/°C
V/V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
V
OS
DHV_, DLV_, DTV_ DC Power-
V
CC
and V
EE
independently set to their
PSRR
Supply Rejection Ratio
minimum and maximum values
Maximum DC Drive Current
I
DUT
_
DC Output Resistance
R
DUT
_
I
DUT
=
±30mA
(Note 11)
DC Output Resistance Variation
∆R
DUT
_
I
DUT
=
±1mA
to
±40mA
DYNAMIC OUTPUT CHARACTERISTICS
(Z
L
= 50Ω )
V
DLV_
= 0V, V
DHV_
= 0.1V
Drive Mode Overshoot
Term Mode Overshoot
Settling Time to Within 25mV
Settling Time to Within 5mV
V
DLV_
= 0V, V
DHV_
= 1V
V
DLV_
= 0V, V
DHV_
= 3V
(Note 12)
3V step (Note 13)
3V step (Note 13)
4
_______________________________________________________________________________________
Quad, Low-Power, 500Mbps
ATE Driver/Comparator
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +9.75V, V
EE
= -5.25V, V
CCO_ _
= 2.5V, SC1 = SC0 = 0, V
CPHV_
= 7.2V, V
CPLV_
= -2.2V, T
J
= +85°C, unless otherwise noted. All tem-
perature coefficients are measured at T
J
= +70°C to +100°C, unless otherwise noted.) (Note 1)
PARAMETER
Prop Delay, Data to Output
Prop Delay Match, t
LH
vs. t
HL
Prop Delay Match, Drivers Within
Package
Prop Delay Temperature
Coefficient
Prop Delay Change vs. Pulse
Width
Prop Delay Change vs. Common-
Mode Voltage
Prop Delay, Drive to High-Z
Prop Delay, High-Z to Drive
Prop Delay, Drive to Term
Prop Delay, Term to Drive
t
PDDZ
t
PDZD
t
PDDT
t
PDTD
3V
P-P
, 40MHz, 2.5ns to 22.5ns pulse width,
relative to 12.5ns pulse width
V
DHV_
- V
DLV_
= 1V, V
DHV_
= 0 to 6V
V
DHV_
= 1.0V, V
DLV_
= -1.0V, V
DTV_
= 0
V
DHV_
= 1.0V, V
DLV_
= -1.0V, V
DTV_
= 0
V
DHV_
= 3V, V
DLV_
= 0, V
DTV_
= 1.5V
V
DHV_
= 3V, V
DLV_
= 0, V
DTV_
= 1.5V
0.2V
P-P,
20% to 80%
Rise and Fall Time
t
R
, t
F
1V
P-P,
10% to 90%
3V
P-P,
10% to 90%
5V
P-P,
10% to 90%
SC1 = 0, SC0 = 1 Slew Rate
SC1 = 1, SC0 = 0 Slew Rate
SC1 = 1, SC0 = 1 Slew Rate
Percent of full speed (SC0 = SC1 = 0),
3V
P-P
, 20% to 80%
Percent of full speed (SC0 = SC1 = 0),
3V
P-P
, 20% to 80%
Percent of full speed (SC0 = SC1 = 0),
3V
P-P
, 20% to 80%
0.2V
P-P
Minimum Pulse Width (Note 16)
1V
P-P
3V
P-P
5V
P-P
0.2V
P-P
Data Rate (Note 17)
1V
P-P
3V
P-P
5V
P-P
Dynamic Crosstalk
Rise and Fall Time, Drive to Term
Rise and Fall Time, Term to Drive
t
DTR
, t
DTF
t
TDR
, t
TDF
(Note 18)
V
DHV_
= 3V, V
DLV_
= 0, V
DTV_
= 1.5V, 10%
to 90% (Note 19)
V
DHV_
= 3V, V
DLV_
= 0, V
DTV_
= 1.5V, 10%
to 90% (Note 19)
1.1
SYMBOL
t
PDD
3V
P-P
(Note 15)
CONDITIONS
MIN
TYP
2
±50
40
+3
±60
85
2.9
2.9
2.2
1.8
330
670
1.3
2.0
75
50
25
650
1.0
2.0
2.9
1700
1000
500
350
20
1.6
0.7
mV
P-P
ns
ns
Mbps
ns
1.6
MAX
UNITS
ns
ps
ps
ps/°C
ps
ps
ns
ns
ns
ns
TIMING CHARACTERISTICS
(Note 14) (Z
L_
= 50Ω )
MAX9963/MAX9964
DYNAMIC PERFORMANCE
(Z
L
= 50Ω)
ps
ns
%
%
%
ps
_______________________________________________________________________________________
5
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