®
IS-1825ASRH
Data Sheet
June 14, 2005
FN9065.1
Single Event and Total Dose Hardened,
High-Speed, Dual Output PWM
The single event and total dose hardened IS-1825ASRH
pulse width modulator is designed to be used in high
frequency, switching power supplies in either voltage or
current-mode configurations. The design includes a
precision voltage reference, a low power start-up circuit, a
high frequency oscillator, a wide-band error amplifier and a
fast current-limit comparator. The use of proprietary process
capabilities and unique design techniques results in fast
propagation delay times and high output current over a wide
range of output voltages.
Constructed with the Intersil Rad-hard Silicon Gate (RSG)
dielectrically isolated BiCMOS process, these devices are
immune to single event latch-up and have been specifically
designed to provide a high level of immunity to single event
transients. All specified parameters are guaranteed and
tested for 300krad(Si) total dose performance.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-02511. A “hot-link” is provided
on our website for downloading the SMD.
Features
• Electrically Screened to DSCC SMD # 5962-02511
• QML Qualified per MIL-PRF-38535 Requirements
• Radiation Environment
- Total Dose. . . . . . . . . . . . . . . . . . . . . 300krad(SI) (max)
- Latch-up Immune . . . . . . . . . . . . . Dielectrically Isolated
- SEU immune . . . . . . . . . . . LET=35MeV/mg/cm
2
(max)
• Oscillator Frequency . . . . . . . . . . . . . . . . . . . .1MHz(max)
• High Output Drive Current . . . . . . . . . . . . . . .1A peak(typ)
• Low Start-up Current . . . . . . . . . . . . . . . . . . . 300µA(max)
• Undervoltage Lockout
- Start Threshold . . . . . . . . . . . . . . . . . . . . . . . .8.8V(max)
- Stop Threshold . . . . . . . . . . . . . . . . . . . . . . . . 7.6V(min)
- Hysteresis. . . . . . . . . . . . . . . . . . . . . . . . . . 300mV(min)
• Improved Soft-Start Function Compared with Commercial
1825A Types
• Pulse-by-Pulse Current Limiting
• Latched Overcurrent Comparator with Full Cycle Restart
• Programmable Leading Edge Blanking
Pinout
IS1-1825ASRH (CDIP2-T16 SBDIP)
TOP VIEW
INV 1
NON-INV 2
E/A OUT 3
CLK/LEB 4
RT 5
CT 6
RAMP 7
SS 8
16 VREF
15 VCC
14 OUT B
13 VC
12 PGND
11 OUT A
10 GND
9 ILIM/SD
Applications
• Voltage or Current-Mode Switching Power Supplies
• Control of High Current MOSFET Drivers
• Motor Speed and Direction Control
Ordering Information
ORDERING NUMBER
5962F0251101QEC
5962F0251101QXC
5962F0251101VEC
VREF
VCC
OUT B
PGND
VC
VC
PGND
OUT A
GND
ILIM/SD
INTERNAL
MKT. NUMBER
IS1-1825ASRH-8
IS9-1825ASRH-8
IS1-1825ASRH-Q
IS9-1825ASRH-Q
IS1-1825ASRH/Proto
IS9-1825ASRH/Proto
TEMP. RANGE
(°C)
-50 to 125
-50 to 125
-50 to 125
-50 to 125
-50 to 125
-50 to 125
IS9-1825ASRH (CDFP4-F20 FLATPACK)
TOP VIEW
NC
INV
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
5962F0251101VXC
IS1-1825ASRH/Proto
IS9-1825ASRH/Proto
NON-INV
E/A OUT
CLK/LEB
RT
CT
RAMP
SS
NC
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
|
Intersil (and design) is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002, 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
IS-1825ASRH
Die Characteristics
DIE DIMENSIONS:
4310µm x 5840µm (170 mils x 230 mils)
Thickness: 483µm
±
25.4µm (19 mils
±
1 mil)
INTERFACE MATERIALS
Glassivation
Type: Phosphorus Silicon Glass (PSG)
Thickness: 8.0kA +/- 1.0kA
Top Metallization
Type: AlSiCu
Thickness: 16.0kA +/- 2kA
Substrate:
Radiation Hardened Silicon Gate,
Dielectric Isolation
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION
Substrate Potential:
Unbiased (DI)
ADDITIONAL INFORMATION
Worst Case Current Density:
<2.0 x 10
5
A/cm
2
Transistor Count:
585
Metallization Mask Layout
IS-1825ASRH
RT
CT
RAMP
SS
ILIM/SD
OGND
GND
CLK/LEB
E/A OUT
NON-INV
INV
VREF
VCC
OUT A
OUT B
PGND
VC
VC
Notes:
1. Both the OGND (oscillator ground) and the GND (control circuit ground) pads must be bonded to ground.
These pads are both bonded to the GND pin on the packaged devices.
2. All double-sized bond pads must be double bonded for current sharing purposes.
PGND
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
2
FN9065.1
June 14, 2005
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