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108-40005
3.2.
Material
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
3.3.
Ratings
Voltage: 250 volts AC
Current: Fully loaded and energized connectors, see Figure 4
•
•
•
18 AWG: 3.1 amperes
22 AWG: 2.0 amperes
28 AWG: 1.2 amperes
Temperature: -55 to 105°C
3.4.
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance
requirements specified in Figure 1. Unless otherwise specified, all tests are performed at ambient
temperature. 3.5.
Test Requirements and Procedures Summary
Test Description
Examination of product.
Requirement
Meets requirements of product
drawing and Application
Specification 114-40030.
Procedure
EIA-364-18.
Visual and dimensional (C of C)
inspection per product drawing.
EIA-364-18. Visual inspection.
Final examination of product.
Meets visual requirements.
ELECTRICAL
Low level contact resistance.
15 milliohms maximum.
EIA-364-23.
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage.
See Figure 3.
EIA-364-6.
Measure potential drop of mated
contacts assembled in housing.
Calculate resistance.
See Figure 3.
Contact resistance, specified
current.
Wire
Test
Resistance
Size
Current
Maximum
(AWG) (amperes) (milliohms)
18
3.1
15
20
2.4
15
22
2.0
15
24
1.6
15
26
1.3
15
28
1.2
15
5000 megohms minimum initial.
500 megohms minimum final.
One minute hold with no
breakdown or flashover. 0.5
milliampere maximum leakage
current.
Figure 1 (continued)
Insulation resistance.
EIA-364-21.
Test between adjacent contacts of
unmated specimens.
EIA-364-20, Condition I.
1000 volts AC at sea level.
Test between adjacent contacts of
unmated specimens.
Withstanding voltage.
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108-40005
Test Description
Temperature rise vs current.
Requirement
Procedure
30°C maximum temperature rise at EIA-364-70, Method 1.
specified current.
Stabilize at a single current level
until 3 readings at 5 minute
intervals are within 1°C.
See Figure 4.
MECHANICAL
No discontinuities of 1 microsecond EIA-364-28, Test Condition V,
or longer duration.
Condition F.
See Note.
Subject mated specimens to 20.71
G's rms between 50 to 2000 Hz.
Fifteen minutes in each of 3
mutually perpendicular planes.
See Figure 5.
No discontinuities of 1 microsecond EIA-364-27, Method A.
or longer duration.
Subject mated specimens to 50 G's
See Note.
half-sine shock pulses of 11
milliseconds duration. Three
shocks in each direction applied
along 3 mutually perpendicular
planes, 18 total shocks.
See Figure 5.
See Note.
EIA-364-9.
Mate and unmate gold flash
specimens for 100 cycles, and 30
µin gold specimens for 500 cycles
at a maximum rate of 200 cycles
per hour.
EIA-364-13.
Measure force necessary to mate
specimens at a maximum rate of
25.4 mm [1 in] per minute.
Vibration, random.
Mechanical shock.
Durability.
Mating force.
Size
1
2
3
4
5
Without
With
Ground
Indents
Posn (N [lbf] maximum)
9
12.5 [2.8] 133.4 [30]
15 20.9 [4.7] 146.8 [33]
25 34.7 [7.8] 164.6 [37]
37 51.6 [11.6] 177.9[40]
50 69.4 [15.6] 195.7[44]
Without
With
Ground
Indents
Posn
(N [lbf] maximum)
9
12.5 [2.8] 133.4 [30]
15 20.9 [4.7] 146.8 [33]
25 34.7 [7.8] 164.6 [37]
37 51.6 [11.6] 177.9 [40]
50 69.4 [15.6] 195.7 [44]
Unmating force.
Size
1
2
3
EIA-364-13.
Measure force necessary to
unmate specimens at a maximum
rate of
25.4 mm [1 in] per minute.
4
5
Contact insertion force.
13.3 N [3 lbf] maximum per
contact.
Figure 1 (continued)
EIA-364-5.
Measure force necessary to insert
contact into housing.
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108-40005
Test Description
Contact retention force.
Requirement
Contacts shall nor dislodge from
housing when subjected to a
minimum force of 22.2 N [5 lbf].
Procedure
EIA-364-29.
Apply specified to contacts in an
axial direction and hold for 6
seconds.
Measure force necessary to insert
gage A to a depth of 5.6 mm [.220
in].
See Figure 6.
Contact engaging force.
2.2 N [8 ozf] maximum per contact.
EIA-364-37.
Contact separating force.
0.208 N [.75 ozf] minimum per
contact.
EIA-364-37.
Size 2 times using gage A. Insert
gage B to a depth of 5.6 mm [.220
in] and measure force necessary to
separate gage B.
See Figure 6.
EIA-364-8.
Determine crimp tensile at a
maximum rate of 25.4 mm [1 in]
per minute.
Crimp tensile.
Wire Size
Crimp Tensile
(AWG)
(N [lbf] minimum)
18
120.1 [27]
20
89.0 [20]
22
53.4 [12]
24
35.6 [8]
26
20.0 [4.5]
28
12.0 [2.7]
ENVIRONMENTAL
Thermal shock.
See Note.
EIA-364-32, Test Condition VII.
Subject unmated specimens to 5
cycles between -55 and 105°C.
EIA-364-31, Method III with cold
shock.
Subject mated specimens to 10
cycles (10 days) between 25 and
65°C at 80 to 100% RH.
EIA-364-17, Method A, Test
Condition 4, Test Time Condition
C. Subject mated specimens to
105°C for 500 hours.
EIA-364-65, Class IIIA (4 gas).
Subject mated specimens to
environmental Class IIIA for 20
days.
Humidity/temperature cycling.
See Note.
Temperature life.
See Note.
Mixed flowing gas.
See Note.
NOTE
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure 2.
Figure 1 (end)
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108-40005
3.6.
Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Examination
1
2
3
4
5
Test Sequence
(b)
Initial examination of product
Low level contact resistance
Contact resistance, specified current
Insulation resistance
Withstanding voltage
Temperature rise vs current
Vibration, random
Mechanical shock
Durability
Mating force
Unmating force
Contact insertion force
Contact retention force
Contact engaging force
Contact separating force
Crimp tensile
Thermal shock
Humidity/temperature cycling
Temperature life
Mixed flowing gas
Final examination of product
NOTE
(a)
(b)
(c)
1
3,7
8
1
2,8
1
1
1
3,7
4,8
3,9
5
6
4
2
9
2
9
2
3
4
5
6
6
5
10
10
10
5
1,7
4
4
2,5
3,6
7(c)
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Discontinuities shall not be measured. Energize at 18°C level for 100% loadings per
卡巴斯基的安全研究人员称其发现了如何攻击Intel微处理器的远程攻击代码，据传，这一代码可以通过TCP/IP包和JavaScript代码到达用户系统。 目前受影响的系统包括Windows XP，Vista，Windows Server 2003，Windows Server 2008，Linux甚至是BSD和Mac。但所幸大多数错误可以由Intel和BIOS厂商联合进行修复。 卡...[详细]
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