NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, PDFP14, DFP-14
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 包装说明 | DFP, FL14,.3 |
| Reach Compliance Code | compliant |
| 系列 | TTL/H/L |
| JESD-30 代码 | R-PDFP-F14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | NAND GATE |
| 最大I（ol） | 0.016 A |
| 湿度敏感等级 | 2A |
| 功能数量 | 3 |
| 输入次数 | 3 |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | OPEN-COLLECTOR |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DFP |
| 封装等效代码 | FL14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 250 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 45 ns |
| 传播延迟（tpd） | 45 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| 7412FCQM | 7412DCQM | 7412DCQR | 7412FCQR | 7412PCQR | 7412PCQM | 5412DMQB | 5412FMQB | |
|---|---|---|---|---|---|---|---|---|
| 描述 | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, PDFP14, DFP-14 | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, PDFP14, DFP-14 | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, PDIP14, PLASTIC, DIP-14 | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, PDIP14, PLASTIC, DIP-14 | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, CDIP14, CERAMIC, DIP-14 | NAND Gate, TTL/H/L Series, 3-Func, 3-Input, TTL, PDFP14, DFP-14 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| 包装说明 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | CERAMIC, DIP-14 | DFP, FL14,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | unknown | compliant |
| 系列 | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L |
| JESD-30 代码 | R-PDFP-F14 | R-CDIP-T14 | R-CDIP-T14 | R-PDFP-F14 | R-PDIP-T14 | R-PDIP-T14 | R-CDIP-T14 | R-PDFP-F14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 最大I（ol） | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
| 湿度敏感等级 | 2A | 2A | 2A | 2A | 2A | 2A | 2A | 2A |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | DFP | DIP | DIP | DFP | DIP | DIP | DIP | DFP |
| 封装等效代码 | FL14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| 峰值回流温度（摄氏度） | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns |
| 传播延迟（tpd） | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | NO | NO | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 认证状态 | Not Qualified | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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