Integrated Device Technology, Inc.
2975 Stender Way, Santa Clara, CA - 95054
PRODUCT/PROCESS CHANGE NOTICE (PCN)
PCN #: L9906-04
DATE: June 28, 1999
Product Affected:
Selected Quality Semiconductor, Inc
Logic Products. See attachment 1
Manufacturing Location Affected:
N/A
Date Effective: September 28,1999
Contact:
Title:
Phone #:
Fax #:
E-mail:
Bimla Paul
Product Assurance Manager
408-654-6419
408-492-8362
bimla.paul@idt.com
MEANS OF DISTINGUISHING CHANGED DEVICES:
Product Mark
Back Mark
Date Code
Other
Additional Data:
Samples:
Available upon request
Available upon request
DESCRIPTION AND PURPOSE OF CHANGE:
Die Technology
Wafer Fabrication Process
As a result of the Integrated Device Technology, Inc. (IDT) acquisition of Quality
Assembly Process
Semiconductor, Inc. (QSI), there will be a consolidation of selected logic products.
Equipment
This will consist of top mark product identification change and wafer fab process
Material
and site change. In addition, this will affect the ordering part numbers. Please see
Testing
the attachment for affected part numbers and detailed description of changes.
Manufacturing Site
Data Sheet
RELIABILITY/QUALIFICATION SUMMARY:
Qualification and reliability data will be available upon request.
CUSTOMER ACKNOWLEDGMENT OF RECEIPT:
IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail
to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice
it will be assumed that this change is acceptable.
Customer:
Name/Date:
Title:
CUSTOMER COMMENTS:
Approval for shipments prior to effective date.
E-Mail Address:
Phone# /Fax# :
RECD. BY:
IDT FRC-1509-01 (Rev. 04) 4/15/99
DATE:
Refer to QCC-1795
PAGE 1 OF 42
DESCRIPTION OF CHANGES
1. Top Mark Change Only (No Silicon Change):
QSI part numbers will be replaced with IDT part number nomenclature. This change does not
involve any wafer fabrication process and site change.
Please see
APPENDIX 1
for affected part numbers.
2. Wafer Fab Process and Site Change:
QSI fabrication process and site will be replaced with IDT fabrication process and site
(ISO 9001/9002 certified) on selected products.
In addtion, the products will be topmarked per IDT part number nomenclature.
Please see
APPENDIX 2
for affected part numbers.
PAGE 2 OF 42
51单片机
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
