MADS-001317-1320AG
GaAs Solder Bump Flip Chip Schottky Diode
Features
•
•
•
•
•
•
Low Series Resistance, 4
Ω
Low Capacitance, 45 fF
High Cutoff Frequency
Silicon Nitride Passivation
Polyimide Scratch Protection
Solderable Bump Die Attach
Mounting Side with Solder Bumps
M/A-COM Products
Rev. V2
Description
M/A-COM’s MADS-001317-1320AG is a Gallium
Arsenide Flip-Chip Schottky diode with solder
bumps. These devices are fabricated on OMCVD
epitaxial wafers using a process designed for high
device uniformity and extremely low parasitics.
This device can be used up to 80 GHz. This diode
is fully passivated with silicon nitride and has an
additional layer of a polymer for scratch protection.
The protective coatings prevent damage to the
junction during handling and circuit attachment.
Applications
The high cutoff frequency of this device allows use
through millimeter wave frequencies. Typical Ap-
plications include single and double balanced mix-
ers in PCN transceivers, radios, police radar detec-
tors and automotive radar detectors.
Electrical Specifications T
A
= 25°C
Parameters and Test Conditions
Junction Capacitance at 0V at 1 MHz
Total Capacitance at 0V at 1 MHz
1
Dynamic Resistance at 9.5 - 10.5 mA
Reverse Breakdown Voltage at 10 µA
Symbol
Ct
Rs
Vf
Vb
Units
pF
Ω
Volts
Volts
Min.
—
.030
—
4.5
Typ.
0.020
0.045
4
7
Max.
0.030
0.060
7
—
1. Total Capacitance is equivalent to the sum of junction capacitance (Cj) and parasitic capacitance (Cp).
1
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MADS-001317-1320AG
GaAs Solder Bump Flip Chip Schottky Diode
M/A-COM Products
Rev. V2
Circuit Mounting Dimensions (Inches)
0.008”
0.013”
(2) PL
0.011”
(2) PL
2
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
MADS-001317-1320AG
GaAs Solder Bump Flip Chip Schottky Diode
Device Installation Procedures
The following guidelines should be observed to avoid damaging GaAs Flip-Chips.
M/A-COM Products
Rev. V2
Cleanliness
These devices should be handled in a clean environment. Do not attempt to clean die after installation.
Static Sensitivity
Gallium Arsenide Schottky diodes are ESD sensitive and can be damaged by static electricity. Since Schottky
diodes are rated as Class 0, proper ESD techniques should be used when handling these devices.
General Handling
These devices have a polymer layer which provides scratch protection for the junction area and the anode air
bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum pen-
cil.
Assembly Requirements using Tin Lead Solder
This Flip Chip Diode employs a 6 µm thick, Sn 63/Pb 37 Solderable interface as part of the 50 µm high solder
bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They
should be mounted onto silkscreened circuits using 60/40 Sn/Pb solder paste. A typical profile for a Sn 63/Pb
37soldering process is provided in Application Note, M538 Surface Mounting Instructions on the M/A-COM web-
site
www.macom.com
Typical Spice Parameters
Is
(A)
1.7 E-14
Rs
(Ω)
4.6
N
1.08
Ct0
(pF)
.047
M
.38
Ik
(A)
.016
Vj
(V)
.86
FC
.99
BV
(V)
7
IBV
(A)
1.0 E-5
Absolute Maximum Ratings @ 25°C
2
Parameter
Operating Temperature
Storage Temperature
Incident LO Power
Incident RF Power
Mounting Temperature
Ordering Information
Part Number
MADS-001317-1320AG
Maximum Ratings
-65°C to +125°C
-65°C to +150°C
+20 dBm
+20 dBm
+300°C for 10 seconds.
Packaging
Gel Pack
2. Exceeding these limits may cause permanent damage.
3
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.
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