Enhanced Low EMI Half-Duplex RS-485 Transceiver
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SIPEX |
包装说明 | DIP, DIP8,.3 |
Reach Compliance Code | unknow |
差分输出 | YES |
驱动器位数 | 1 |
输入特性 | DIFFERENTIAL |
接口集成电路类型 | LINE TRANSCEIVER |
接口标准 | EIA-422; EIA-485 |
JESD-30 代码 | R-PDIP-T8 |
JESD-609代码 | e0 |
长度 | 9.5885 mm |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
最小输出摆幅 | 1.5 V |
最大输出低电流 | 0.004 A |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT APPLICABLE |
电源 | 5 V |
认证状态 | Not Qualified |
最大接收延迟 | 2000 ns |
接收器位数 | 1 |
座面最大高度 | 5.334 mm |
最大压摆率 | 0.9 mA |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | BICMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT APPLICABLE |
最大传输延迟 | 2000 ns |
宽度 | 7.62 mm |
SP483ECP | SP483ECN | SP483E_05 | SP483E | SP483EEN | SP483EEP | |
---|---|---|---|---|---|---|
描述 | Enhanced Low EMI Half-Duplex RS-485 Transceiver | Enhanced Low EMI Half-Duplex RS-485 Transceiver | Enhanced Low EMI Half-Duplex RS-485 Transceiver | Enhanced Low EMI Half-Duplex RS-485 Transceiver | Enhanced Low EMI Half-Duplex RS-485 Transceiver | Enhanced Low EMI Half-Duplex RS-485 Transceiver |
是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 |
厂商名称 | SIPEX | SIPEX | - | - | SIPEX | SIPEX |
包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | - | - | SOP, SOP8,.25 | DIP, DIP8,.3 |
Reach Compliance Code | unknow | unknow | - | - | unknow | unknow |
差分输出 | YES | YES | - | - | YES | YES |
驱动器位数 | 1 | 1 | - | - | 1 | 1 |
输入特性 | DIFFERENTIAL | DIFFERENTIAL | - | - | DIFFERENTIAL | DIFFERENTIAL |
接口集成电路类型 | LINE TRANSCEIVER | LINE TRANSCEIVER | - | - | LINE TRANSCEIVER | LINE TRANSCEIVER |
接口标准 | EIA-422; EIA-485 | EIA-422; EIA-485 | - | - | EIA-422; EIA-485 | EIA-422; EIA-485 |
JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | - | - | R-PDSO-G8 | R-PDIP-T8 |
JESD-609代码 | e0 | e0 | - | - | e0 | e0 |
长度 | 9.5885 mm | 4.9 mm | - | - | 4.9 mm | 9.5885 mm |
功能数量 | 1 | 1 | - | - | 1 | 1 |
端子数量 | 8 | 8 | - | - | 8 | 8 |
最高工作温度 | 70 °C | 70 °C | - | - | 85 °C | 85 °C |
最小输出摆幅 | 1.5 V | 1.5 V | - | - | 1.5 V | 1.5 V |
最大输出低电流 | 0.004 A | 0.004 A | - | - | 0.004 A | 0.004 A |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | - | - | SOP | DIP |
封装等效代码 | DIP8,.3 | SOP8,.25 | - | - | SOP8,.25 | DIP8,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | - | - | SMALL OUTLINE | IN-LINE |
峰值回流温度(摄氏度) | NOT APPLICABLE | 240 | - | - | 240 | NOT APPLICABLE |
电源 | 5 V | 5 V | - | - | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
最大接收延迟 | 2000 ns | 2000 ns | - | - | 2000 ns | 2000 ns |
接收器位数 | 1 | 1 | - | - | 1 | 1 |
座面最大高度 | 5.334 mm | 1.748 mm | - | - | 1.748 mm | 5.334 mm |
最大压摆率 | 0.9 mA | 0.9 mA | - | - | 0.9 mA | 0.9 mA |
最大供电电压 | 5.25 V | 5.25 V | - | - | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | - | - | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | - | - | 5 V | 5 V |
表面贴装 | NO | YES | - | - | YES | NO |
技术 | BICMOS | BICMOS | - | - | BICMOS | BICMOS |
温度等级 | COMMERCIAL | COMMERCIAL | - | - | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | - | - | Tin/Lead (Sn/Pb) | TIN LEAD |
端子形式 | THROUGH-HOLE | GULL WING | - | - | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | - | - | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | - | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT APPLICABLE | 30 | - | - | 30 | NOT APPLICABLE |
最大传输延迟 | 2000 ns | 2000 ns | - | - | 2000 ns | 2000 ns |
宽度 | 7.62 mm | 3.895 mm | - | - | 3.895 mm | 7.62 mm |
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