ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP24, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 其他特性 | SCANNABLE |
| 系列 | ACT |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 9.5 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| 74ACT818PC | 74ACT818SCX | 74ACT818SPC | 74ACT818SC | 74ACT818QC | |
|---|---|---|---|---|---|
| 描述 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP24, PLASTIC, DIP-24 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO24, SOIC-24 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PQCC28, PLASTIC, LCC-28 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, | SOP, | DIP, | SOP, | QCCJ, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | SCANNABLE | SCANNABLE | SCANNABLE | SCANNABLE | SCANNABLE |
| 系列 | ACT | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 | S-PQCC-J28 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 24 | 28 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | SOP | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER |
| 传播延迟（tpd） | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns | 9.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | J BEND |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | SOIC | DIP | - | QLCC |
| 针数 | 24 | 24 | 24 | - | 28 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 长度 | - | 15.4 mm | 31.915 mm | 15.4 mm | 11.48 mm |
| 座面最大高度 | - | 2.65 mm | 5.08 mm | 2.65 mm | 4.57 mm |
| 端子节距 | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 宽度 | - | 7.5 mm | 7.62 mm | 7.5 mm | 11.48 mm |
| Is Samacsys | - | - | N | N | N |
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