SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | QCCJ, |
| Reach Compliance Code | unknown |
| JESD-30 代码 | S-PQCC-J28 |
| JESD-609代码 | e0 |
| 长度 | 11.43 mm |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.43 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 |
| 74F407QC | 54F407SDM | 54F407SDMQB | 74F407DC | 54F407FM | |
|---|---|---|---|---|---|
| 描述 | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC28, PLASTIC, CC-28 | SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24, CERAMIC, DIP-24 | SPECIALTY MICROPROCESSOR CIRCUIT, CDFP24, CERPACK-24 |
| 包装说明 | QCCJ, | DIP, | DIP, | DIP, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-PQCC-J28 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDFP-F24 |
| 端子数量 | 28 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | - | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCJ | DIP | DIP | DIP | DFP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 5.715 mm | 5.715 mm | 4.572 mm | 2.286 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY |
| 端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| JESD-609代码 | e0 | e0 | - | e0 | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 宽度 | 11.43 mm | 7.62 mm | 7.62 mm | 15.24 mm | - |
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