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74AHC241D

产品描述IC AHC/VHC/H/U/V SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20, Bus Driver/Transceiver
产品类别逻辑    逻辑   
文件大小158KB,共15页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

74AHC241D概述

IC AHC/VHC/H/U/V SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20, Bus Driver/Transceiver

74AHC241D规格参数

参数名称属性值
厂商名称NXP(恩智浦)
零件包装代码SOIC
包装说明SOP,
针数20
Reach Compliance Codeunknown
系列AHC/VHC/H/U/V
JESD-30 代码R-PDSO-G20
长度12.8 mm
逻辑集成电路类型BUS DRIVER
位数4
功能数量2
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
传播延迟(tpd)16.9 ns
认证状态Not Qualified
座面最大高度2.65 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
宽度7.5 mm
Base Number Matches1

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74AHC241; 74AHCT241
Octal buffer/line driver; 3-state
Rev. 01 — 11 January 2010
Product data sheet
1. General description
The 74AHC241 and 74AHCT241 are 8-bit buffer/line drivers with 3-state outputs. These
devices can be used as two 4-bit buffers or one 8-bit buffer. They feature two output
enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on 1OE or
LOW on 2OE causes the associated outputs to assume a high-impedance OFF-state.
Inputs are over voltage tolerant. This feature allows the use of these devices as
translators in mixed voltage environments.
2. Features
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accepts voltages higher than V
CC
For 74AHC241 only: operates with CMOS input levels
For 74AHCT241 only: operates with TTL input levels
ESD protection:
HBM JESD22-A114F exceeds 2 000 V
CDM JESD22-C101D exceeds 1 000 V
Multiple package options
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC241D
74AHCT241D
74AHC241PW
74AHCT241PW
74AHC241BQ
74AHCT241BQ
−40 °C
to +125
°C
DHVQFN20
−40 °C
to +125
°C
TSSOP20
−40 °C
to +125
°C
Name
SO20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Version
SOT163-1
SOT360-1
Type number
plastic dual in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm

74AHC241D相似产品对比

74AHC241D 74AHC241PW 74AHCT241BQ 74AHCT241D 74AHC241BQ 74AHCT241PW
描述 IC AHC/VHC/H/U/V SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20, Bus Driver/Transceiver IC AHC/VHC/H/U/V SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20, Bus Driver/Transceiver IC AHCT/VHCT/VT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20, Bus Driver/Transceiver IC AHCT/VHCT/VT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20, Bus Driver/Transceiver IC AHC/VHC/H/U/V SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20, Bus Driver/Transceiver IC AHCT/VHCT/VT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20, Bus Driver/Transceiver
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 SOIC TSSOP QFN SOIC QFN TSSOP
包装说明 SOP, TSSOP, HVQCCN, SOP, HVQCCN, TSSOP,
针数 20 20 20 20 20 20
Reach Compliance Code unknown unknown unknown unknown unknown unknown
系列 AHC/VHC/H/U/V AHC/VHC/H/U/V AHCT/VHCT/VT AHCT/VHCT/VT AHC/VHC/H/U/V AHCT/VHCT/VT
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20
长度 12.8 mm 6.5 mm 4.5 mm 12.8 mm 4.5 mm 6.5 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 4 4 4 4 4 4
功能数量 2 2 2 2 2 2
端口数量 2 2 2 2 2 2
端子数量 20 20 20 20 20 20
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSSOP HVQCCN SOP HVQCCN TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟(tpd) 16.9 ns 16.9 ns 11.2 ns 11.2 ns 16.9 ns 11.2 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.65 mm 1.1 mm 1 mm 2.65 mm 1 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V 2 V 4.5 V 4.5 V 2 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING NO LEAD GULL WING NO LEAD GULL WING
端子节距 1.27 mm 0.65 mm 0.5 mm 1.27 mm 0.5 mm 0.65 mm
端子位置 DUAL DUAL QUAD DUAL QUAD DUAL
宽度 7.5 mm 4.4 mm 2.5 mm 7.5 mm 2.5 mm 4.4 mm
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