PLL Based Clock Driver, FCT Series, 7 True Output(s), 1 Inverted Output(s), CMOS, PQCC28, PLASTIC, LCC-28
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QLCC |
包装说明 | QCCJ, LDCC28,.5SQ |
针数 | 28 |
Reach Compliance Code | not_compliant |
其他特性 | OUTPUT FREQUENCY RATIOS ARE 0.5F/1.0F/2.0F; MAX PART TO PART SKEW = 1NS |
系列 | FCT |
输入调节 | SCHMITT TRIGGER MUX |
JESD-30 代码 | S-PQCC-J28 |
JESD-609代码 | e0 |
长度 | 11.5062 mm |
负载电容(CL) | 20 pF |
逻辑集成电路类型 | PLL BASED CLOCK DRIVER |
最大I(ol) | 0.032 A |
湿度敏感等级 | 1 |
功能数量 | 1 |
反相输出次数 | 1 |
端子数量 | 28 |
实输出次数 | 7 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC28,.5SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 225 |
电源 | 3.3 V |
传播延迟(tpd) | 1.3 ns |
认证状态 | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.8 ns |
座面最大高度 | 4.572 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 11.5062 mm |
最小 fmax | 70 MHz |
Base Number Matches | 1 |
IDT74FCT388915T70J8 | IDT74FCT388915T133PY8 | IDT74FCT388915T150J8 | IDT74FCT388915T100PYG | IDT74FCT388915T150PY8 | |
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描述 | PLL Based Clock Driver, FCT Series, 7 True Output(s), 1 Inverted Output(s), CMOS, PQCC28, PLASTIC, LCC-28 | PLL Based Clock Driver, FCT Series, 7 True Output(s), 1 Inverted Output(s), CMOS, PDSO28, SSOP-28 | PLL Based Clock Driver, FCT Series, 7 True Output(s), 1 Inverted Output(s), CMOS, PQCC28, PLASTIC, LCC-28 | PLL Based Clock Driver, FCT Series, 7 True Output(s), 1 Inverted Output(s), CMOS, PDSO28, SSOP-28 | PLL Based Clock Driver, FCT Series, 7 True Output(s), 1 Inverted Output(s), CMOS, PDSO28, SSOP-28 |
是否无铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QLCC | SSOP | QLCC | SSOP | SSOP |
包装说明 | QCCJ, LDCC28,.5SQ | SSOP-28 | QCCJ, LDCC28,.5SQ | SSOP-28 | SSOP-28 |
针数 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | compliant | not_compliant |
其他特性 | OUTPUT FREQUENCY RATIOS ARE 0.5F/1.0F/2.0F; MAX PART TO PART SKEW = 1NS | OUTPUT FREQUENCY RATIOS ARE 0.5F/1.0F/2.0F; MAX PART TO PART SKEW = 1NS | OUTPUT FREQUENCY RATIOS ARE 0.5F/1.0F/2.0F; MAX PART TO PART SKEW = 1NS | OUTPUT FREQUENCY RATIOS ARE 0.5F/1.0F/2.0F; MAX PART TO PART SKEW = 1NS | OUTPUT FREQUENCY RATIOS ARE 0.5F/1.0F/2.0F; MAX PART TO PART SKEW = 1NS |
系列 | FCT | FCT | FCT | FCT | FCT |
输入调节 | SCHMITT TRIGGER MUX | SCHMITT TRIGGER MUX | SCHMITT TRIGGER MUX | SCHMITT TRIGGER MUX | SCHMITT TRIGGER MUX |
JESD-30 代码 | S-PQCC-J28 | R-PDSO-G28 | S-PQCC-J28 | R-PDSO-G28 | R-PDSO-G28 |
JESD-609代码 | e0 | e0 | e0 | e3 | e0 |
长度 | 11.5062 mm | 10.2 mm | 11.5062 mm | 10.2 mm | 10.2 mm |
负载电容(CL) | 20 pF | 20 pF | 20 pF | 20 pF | 20 pF |
逻辑集成电路类型 | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER |
最大I(ol) | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
反相输出次数 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 |
实输出次数 | 7 | 7 | 7 | 7 | 7 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | SSOP | QCCJ | SSOP | SSOP |
封装等效代码 | LDCC28,.5SQ | SSOP28,.3 | LDCC28,.5SQ | SSOP28,.3 | SSOP28,.3 |
封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 225 | 240 | 225 | 260 | 240 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
传播延迟(tpd) | 1.3 ns | 1.3 ns | 1.3 ns | 1.3 ns | 1.3 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.8 ns | 0.8 ns | 0.8 ns | 0.8 ns | 0.8 ns |
座面最大高度 | 4.572 mm | 1.99 mm | 4.572 mm | 1.99 mm | 1.99 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND | GULL WING | J BEND | GULL WING | GULL WING |
端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm |
端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 20 | 30 | 30 | 20 |
宽度 | 11.5062 mm | 5.3 mm | 11.5062 mm | 5.3 mm | 5.3 mm |
最小 fmax | 70 MHz | 133 MHz | 150 MHz | 100 MHz | 150 MHz |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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