Multiplexer, ACT Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 系列 | ACT |
| JESD-30 代码 | R-GDIP-T16 |
| 长度 | 19.43 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 11 ns |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 74ACT258DC | 74ACT258DCQR | 54ACT258FM | 54ACT258DM | 54ACT258LM | |
|---|---|---|---|---|---|
| 描述 | Multiplexer, ACT Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 | Multiplexer, ACT Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 | Multiplexer, ACT Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, CDFP16, CERAMIC, FP-16 | Multiplexer, ACT Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, CDIP16, CERAMIC, DIP-16 | Multiplexer, ACT Series, 4-Func, 2 Line Input, 1 Line Output, Inverted Output, CMOS, CQCC20, CERAMIC, LCC-20 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | DIP, | DIP, | DFP, | DIP, | QCCN, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 系列 | ACT | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-CDFP-F16 | R-GDIP-T16 | S-CQCC-N20 |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DFP | DIP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.159 mm | 5.08 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 7.62 mm | 7.62 mm | 6.731 mm | 7.62 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 长度 | 19.43 mm | 19.43 mm | - | 19.43 mm | 8.89 mm |
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