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74AHCT125D-Q100

产品描述AHCT/VHCT/VT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
产品类别逻辑    逻辑   
文件大小239KB,共17页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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74AHCT125D-Q100概述

AHCT/VHCT/VT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14

74AHCT125D-Q100规格参数

参数名称属性值
是否Rohs认证符合
厂商名称NXP(恩智浦)
包装说明3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Reach Compliance Codeunknown
系列AHCT/VHCT/VT
JESD-30 代码R-PDSO-G14
长度8.65 mm
逻辑集成电路类型BUS DRIVER
湿度敏感等级1
位数1
功能数量4
端口数量2
端子数量14
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
传播延迟(tpd)9.5 ns
筛选级别AEC-Q100
座面最大高度1.75 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度3.9 mm
Base Number Matches1

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74AHC125-Q100;
74AHCT125-Q100
Quad buffer/line driver; 3-state
Rev. 1 — 5 June 2012
Product data sheet
1. General description
The 74AHC125-Q100; 74AHCT125-Q100 is a high-speed Si-gate CMOS device and is
pin compatible with Low-power Schottky TTL (LSTTL). They are specified in compliance
with JEDEC standard JESD7-A.
The 74AHC125-Q100; 74AHCT125-Q100 provides four non-inverting buffer/line drivers
with 3-state outputs. The 3-state outputs (nY) are controlled by the output enable input
(nOE). A HIGH at nOE causes the outputs to assume a high-impedance OFF-state.
The 74AHC125-Q100; 74AHCT125-Q100 is identical to the 74AHC126-Q100;
74AHCT126-Q100 but has active LOW enable inputs.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from
40 C
to +85
C
and from
40 C
to +125
C
Balanced propagation delays
All inputs have a Schmitt trigger action
Inputs accept voltages higher than V
CC
For 74AHC125-Q100: CMOS input levels
For 74AHCT125-Q100: TTL input levels
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pf, R = 0
)
Multiple package options

74AHCT125D-Q100相似产品对比

74AHCT125D-Q100 74AHCT125PW-Q100 74AHC125PW-Q100 74AHCT125BQ-Q100 74AHC125D-Q100 74AHC125BQ-Q100
描述 AHCT/VHCT/VT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 AHCT/VHCT/VT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 AHCT/VHCT/VT SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 AHC/VHC/H/U/V SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
包装说明 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 TSSOP, TSSOP, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Reach Compliance Code unknown unknown unknown unknown unknown unknown
系列 AHCT/VHCT/VT AHCT/VHCT/VT AHC/VHC/H/U/V AHCT/VHCT/VT AHC/VHC/H/U/V AHC/VHC/H/U/V
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PQCC-N14 R-PDSO-G14 R-PQCC-N14
长度 8.65 mm 5 mm 5 mm 3 mm 8.65 mm 3 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
湿度敏感等级 1 1 1 1 1 1
位数 1 1 1 1 1 1
功能数量 4 4 4 4 4 4
端口数量 2 2 2 2 2 2
端子数量 14 14 14 14 14 14
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSSOP TSSOP HVQCCN SOP HVQCCN
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度) 260 260 260 260 260 260
传播延迟(tpd) 9.5 ns 9.5 ns 14.5 ns 9.5 ns 14.5 ns 14.5 ns
筛选级别 AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100
座面最大高度 1.75 mm 1.1 mm 1.1 mm 1 mm 1.75 mm 1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 2 V 4.5 V 2 V 2 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING GULL WING NO LEAD GULL WING NO LEAD
端子节距 1.27 mm 0.65 mm 0.65 mm 0.5 mm 1.27 mm 0.5 mm
端子位置 DUAL DUAL DUAL QUAD DUAL QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 3.9 mm 4.4 mm 4.4 mm 2.5 mm 3.9 mm 2.5 mm
Base Number Matches 1 1 1 1 1 1
JESD-609代码 - e4 e4 e4 e4 e4
端子面层 - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD

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