SEG and SEGDIO, Configured as Digital Inputs......-0.3V to +3.6V
Digital Pins, Configured as Inputs .......................... -0.5V to V
DD
ESD Stress on All Pins .............................................. ±2kV, HBM
Operating Temperature Range ......................... -40°C to +85°C
Storage Temperature Range ........................... -65°C to +150°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
LQFP
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........45°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............16°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(Limits are 100% production tested at T
A
= +22°C. Limits over the operating temperature range and relevant supply voltage range
are guaranteed by design and characterization. Typical values are not guaranteed. V
DD
= V
AVDD
= V
IO
= 3.0V to 3.6V, T
A
= -40°C to
+85°C, unless otherwise specified.)
PARAMETER
POWER
Digital Supply Voltage
Analog Supply Voltage
Supply Voltage, Remote Interfaces
Supply Voltage, Backup Battery
Supply Voltage, RTC Battery
Reset Threshold
Power Fail Warning Threshold
Supply Current, Digital
Supply Current, Analog
Stop Mode Current, Digital
Stop Mode Current, Analog
Dynamic Current
V
DD
V
AVDD
V
RVDD
V
BAT
V
RTC
V
RST
V
PFW
I
DD1
I
DD2
I
DD1
I
DD2
I
STOP
I
STOP
(Note 2)
(Note 3)
(Note 2)
(Note 3)
V
DD
= V
AVDD
= 3.3V
V
DD
= V
AVDD
= 3.3V
(Note 4)
MSN mode (Note 5)
V
BAT
Current
I
VBAT
BRN mode (Note 6)
LCD_ONLY mode (Note 7)
SLP mode, V
BAT
= 3.3V, V
RTC
= 0V
V
RTC
Current
I
VRTC
MSN mode (Note 5)
SLP mode, V
BAT
= 0V, V
RTC
= 3.3V
V
RST
2.7
2.7
2.0
2.0
1.95
±0.05
2.07
±0.05
55
24
19
19
3
210
0.98
±25
7
6
2
±25
1.6
3.6
3.6
3.6
3.8
3.8
V
V
V
V
V
V
V
mA
mA
mA
mA
mA
µA
mA/MHz
nA
mA
µA
µA
nA
µA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
www.maximintegrated.com
Maxim Integrated
│
2
MAX71617/MAX71637
Energy Measurement SoCs
Electrical Characteristics (continued)
(Limits are 100% production tested at T
A
= +22°C. Limits over the operating temperature range and relevant supply voltage range
are guaranteed by design and characterization. Typical values are not guaranteed. V
DD
= V
AVDD
= V
IO
= 3.0V to 3.6V, T
A
= -40°C to
+85°C, unless otherwise specified.)
PARAMETER
CRYSTAL OSCILLATOR
Oscillator Frequency
Nominal Operating Frequency,
Application Core
Nominal Operating Frequency,
DSP Core
Nominal Operating Frequency,
Compute Engine
Frequency Variation with Voltage
Startup Time
LOGIC LEVELS
Digital High Level
Digital Low Level
Digital High Level, RSTN
Digital Low Level, RSTN
Input Hysteresis, All GPIO Pins
Input Leakage
Input Pullup Current
Digital High-Level Output Voltage
Digital Low-Level Output Voltage
LCD
V
LCD
Current
V
REF
Nominal Reference Voltage
Variation with Power Supply
Deviation from Predicted Variation
with Temperature
ADC
Usable Input Range
Input Impedance
LSB Size
Digital Full Scale
Input Offset
www.maximintegrated.com
SYMBOL
f
RTC
CONDITIONS
MIN
TYP
32768
108
36
36
MAX
UNITS
Hz
MHz
MHz
MHz
ppm
ms
V
T
A
= +25°C, V
DD
= 0V,
V
RTC
= 2.0V to 3.8V
±1
900
V
IH
V
IL
At temp corners
At temp corners
2.0
0.8
0.8V
IO
0.3V
IO
50
V
V
V
mV
µA
µA
V
V
V
IN
= V
IO
Pullup enabled, V
IN
= 0V
V
OH
V
OL
6mA
6mA
V
LCD
= 3.3V,
any multiplex mode,
no output loading, LCD pins open
V
REF
T
A
= +22°C
V
AVDD
= 3.0V to 3.6V
-1
-30.0
V
IO
- 0.4
+1
-1.5
0.4
7
µA
1.195
±1.5
±40
V
mV/V
ppm/°C
-250
30
FIR_LEN = 11, 5.46kHz sample rate
FIR_LEN = 15
FIR_LEN = 11, 5.46kHz sample rate
FIR_LEN = 15
-10
92
118
±3375000
±2621440
+250
50
mV
peak
kΩ
nV/LSB
LSB
+10
mV
Maxim Integrated
│
3
MAX71617/MAX71637
Energy Measurement SoCs
Electrical Characteristics (continued)
(Limits are 100% production tested at T
A
= +22°C. Limits over the operating temperature range and relevant supply voltage range
are guaranteed by design and characterization. Typical values are not guaranteed. V
DD
= V
AVDD
= V
IO
= 3.0V to 3.6V, T
A
= -40°C to
+85°C, unless otherwise specified.)
PARAMETER
THD, Voltage Channel
(Note 8)
THD, Current Channel
(Note 8)
Current Channel 0 Preamp Gain
Gain Variation with Supply Voltage
Gain Variation with Temperature
Current Channel Phase Shift
Phase Shift Variation
Input Noise
Crosstalk
FLASH MEMORY (Note 9)
Flash Erase Time
Flash Programming Time
Endurance
Data Retention
t
ME
t
PE
t
PROG
Mass erase
Page erase
Per long word
Number of write/erase cycles
T
A
= +85°C
20
20
20
10,000
10
ms
ms
µs
Cycles
Years
All channels, preamp off
ADC0, preamp on
T
A
= +22°C, guaranteed by design,
not production tested
-100
900
100
-108
-97
Preamp on
Preamp on
-180
0.03
+100
SYMBOL
250mV
P-P
20mV
P-P
Preamp off, 250mV
P-P
Preamp off, 20mV
P-P
Preamp on, 20mV
P-P
-86
-102
-87
-84
8.90
±0.18
+180
V/V
%
ppm/°C
m°
m°
nV/√Hz
dB
-90
dB
CONDITIONS
MIN
TYP
MAX
-75
UNITS
dB
Note 2:
Application core operating at 108MHz, metering core operating at 36MHz, instruction cache on, AES operating in 128 bit
mode, one DMA channel actively copying data from application core code RAM to application core system RAM, all timers
active and running (timer 0/1, timer 1/2, timer 2/4, timer 3/8, timer 4/16, timer 5/32, timer 6/64), random number generator
running, application core running from flash and fetching data from flash, MAXQ30 runnning in tight loop, MAXQ30 timer
operating in timer mode, all LCD segments enabled but no load on LCD pins, all ADC channels operating, RTC watchdog
operating, CE running, V
DD
= V
AVDD
= 3.3V.
Note 3:
Application core operating at 27MHz, metering core operating at 36MHz, instruction cache on, AES operating in 128 bit
mode, one DMA channel actively copying data from application core code RAM to application core system RAM, all timers
active and running (timer 0/1, timer 1/2, timer 2/4, timer 3/8, timer 4/16, timer 5/32, timer 6/64), random number generator
running, application core running from flash and fetching data from flash, MAXQ30 running in tight loop, MAXQ30 timer
operating in timer mode, all LCD segments enabled but no load on LCD pins, all ADC channels operating, RTC watchdog
operating, CE running, V
DD
= V
AVDD
= 3.3V.
Note 4:
V
DD
= V
AVDD
= 3.3V, ADC off, application core off, compute engine off, all peripherals off, computed at user core frequen-
cies of 108MHz and 13.5MHz.
Note 5:
f
APPLICATION_CORE
= 108MHz; f
DSP_CORE
= f
CE
= 36MHz; all peripherals and security engines disabled, all GPIO pins
configured for output and not externally connected. V
DD
= V
AVDD
= 3.3V.
Note 6:
Application core halted, metering core running at 36MHz reading data from RAM, LCD off, CE off, ADC off, peripherals off,
V
DD
= V
AVDD
= 0V, V
BAT
= V
RTC
= 3.3V.
Note 7:
All core regulators off, LCD operating without load, V
BAT
= 3.3V, V
RTC
= 0.0V.
Note 8:
Computed using a 64k point Fast Fourier Transform, Blackman-Harris window, 65Hz input frequency.
Note 9:
V
DD
must be greater than 1.8V to support flash write/erase operations.
www.maximintegrated.com
Maxim Integrated
│
4
MAX71617/MAX71637
Energy Measurement SoCs
Typical Application Circuit (WYE Connected Load, Current Transformer Sensors)
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
