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IDT74FST6800PGG

产品描述Bus Driver, CBT/FST/QS/5C/B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24, TSSOP-24
产品类别逻辑    逻辑   
文件大小66KB,共5页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

IDT74FST6800PGG概述

Bus Driver, CBT/FST/QS/5C/B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24, TSSOP-24

IDT74FST6800PGG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码TSSOP
包装说明TSSOP,
针数24
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性TTL COMPATIBLE BUS SWITCH
系列CBT/FST/QS/5C/B
JESD-30 代码R-PDSO-G24
JESD-609代码e3
长度7.8 mm
逻辑集成电路类型BUS DRIVER
湿度敏感等级1
位数10
功能数量1
端口数量2
端子数量24
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
传播延迟(tpd)0.25 ns
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)5.25 V
最小供电电压 (Vsup)4.75 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度4.4 mm
Base Number Matches1

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IDT74FST6800
10-BIT BUS SWITCH WITH PRECHARGED OUTPUTS
INDUSTRIAL TEMPERATURE RANGE
10-BIT BUS SWITCH
WITH PRECHARGED
OUTPUTS
FEATURES:
Bus switches provide zero delay paths
Low switch on-resistance: 7Ω
Ω
TTL-compatible input and output levels
ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
• Available in QSOP and TSSOP packages
IDT74FST6800
DESCRIPTION:
The FST6800 belongs to IDT's family of Bus switches. Bus switch devices
perform the function of connecting or isolating two ports without providing
any inherent current sink or source capability. Thus they generate little or
no noise of their own while providing a low resistance path for an external
driver. These devices connect input and output ports through an n-channel
FET. When the gate-to-source junction of this FET is adequately forward-
biased the device conducts and the resistance between input and output
ports is small. Without adequate bias on the gate-to-source junction of the
FET, the FET is turned off, therefore with no V
CC
applied, the device has
hot insertion capability.
The low on-resistance and simplicity of the connection between input and
output ports reduces the delay in this path to close to zero.
The FST6800 provides a 10-Bit TTL-compatible interface. The
ON
pin
serves as the enable pin. When
ON
is high, A and B ports are isolated and
B outputs are precharged to the BIASV voltage, through the equivalent of
a 10KΩ resistor.
FUNCTIONAL BLOCK DIAGRAM
BIASV
PIN CONFIGURATION
ON
A
1
A
2
A
3
A
4
A
5
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
QSOP/ TSSOP
TOP VIEW
V
CC
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
B
10
BIASV
A
1
B
1
A
6
A
7
A
8
A
10
B
10
A
9
A
10
GND
ON
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
© 2006 Integrated Device Technology, Inc.
MARCH 2006
DSC-5519/4

IDT74FST6800PGG相似产品对比

IDT74FST6800PGG IDT74FST6800QG IDT74FST6800PGG8 IDT74FST6800QG8
描述 Bus Driver, CBT/FST/QS/5C/B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24, TSSOP-24 Bus Driver, CBT/FST/QS/5C/B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24, GREEN, QSOP-24 Bus Driver, CBT/FST/QS/5C/B Series, 1-Func, 10-Bit, True Output, PDSO24, TSSOP-24 Bus Driver, CBT/FST/QS/5C/B Series, 1-Func, 10-Bit, True Output, CMOS, PDSO24, QSOP-24
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 TSSOP SOIC TSSOP SOIC
包装说明 TSSOP, SSOP, TSSOP, SSOP,
针数 24 24 24 24
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
其他特性 TTL COMPATIBLE BUS SWITCH TTL COMPATIBLE BUS SWITCH TTL COMPATIBLE BUS SWITCH TTL COMPATIBLE BUS SWITCH
系列 CBT/FST/QS/5C/B CBT/FST/QS/5C/B CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 代码 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24
JESD-609代码 e3 e3 e3 e3
长度 7.8 mm 8.6868 mm 7.8 mm 8.6868 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 10 10 10 10
功能数量 1 1 1 1
端口数量 2 2 2 2
端子数量 24 24 24 24
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SSOP TSSOP SSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260 260
传播延迟(tpd) 0.25 ns 0.25 ns 0.25 ns 0.25 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.7272 mm 1.2 mm 1.7272 mm
最大供电电压 (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V
最小供电电压 (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Matte Tin (Sn) - annealed MATTE TIN Matte Tin (Sn) - annealed MATTE TIN
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.635 mm 0.65 mm 0.635 mm
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30
宽度 4.4 mm 3.937 mm 4.4 mm 3.937 mm
Base Number Matches 1 1 1 1
技术 CMOS CMOS - CMOS

 
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