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89HPES16T4ZHBC

产品描述CABGA-484, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小951KB,共32页
制造商IDT (Integrated Device Technology)
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89HPES16T4ZHBC概述

CABGA-484, Tray

89HPES16T4ZHBC规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码CABGA
包装说明CABGA-484
针数484
制造商包装代码BC484
Reach Compliance Codenot_compliant
ECCN代码EAR99
其他特性ALSO REQUIRES 3.3V SUPPLY
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B484
JESD-609代码e0
长度23 mm
湿度敏感等级3
端子数量484
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA484,22X22,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
电源3.3 V
认证状态Not Qualified
座面最大高度1.86 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度23 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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下载PDF文档
16-Lane 4-Port PCI
Express® Switch
®
89HPES16T4
Data Sheet
Device Overview
The 89HPES16T4 is a member of the IDT PRECISE™ family of PCI
Express® switching solutions. The PES16T4 is a 16-lane, 4-port periph-
eral chip that performs PCI Express packet switching with a feature set
optimized for high performance applications such as servers, storage,
and communications/networking. It provides connectivity and switching
functions between a PCI Express upstream port and up to three down-
stream ports and supports switching between downstream ports.
Features
High Performance PCI Express Switch
– Sixteen 2.5 Gbps PCI Express lanes
– Four switch ports
– Upstream port configurable up to x8
– Downstream ports configurable up to x4
– Low-latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates sixteen 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Supports ECRC and Advanced Error Reporting
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC and
server motherboards
Block Diagram
4-Port Switch Core / 16 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 1)
(Port 6)
(Port 7)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 31
March 25, 2008
DSC 6923

89HPES16T4ZHBC相似产品对比

89HPES16T4ZHBC 89HPES16T4ZHBCG
描述 CABGA-484, Tray CABGA-484, Tray
Brand Name Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅
是否Rohs认证 不符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 CABGA CABGA
包装说明 CABGA-484 BGA, BGA484,22X22,40
针数 484 484
制造商包装代码 BC484 BCG484
Reach Compliance Code not_compliant compliant
ECCN代码 EAR99 EAR99
其他特性 ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
总线兼容性 PCI PCI
最大时钟频率 125 MHz 125 MHz
JESD-30 代码 S-PBGA-B484 S-PBGA-B484
JESD-609代码 e0 e1
长度 23 mm 23 mm
湿度敏感等级 3 3
端子数量 484 484
最高工作温度 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA
封装等效代码 BGA484,22X22,40 BGA484,22X22,40
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 225 260
电源 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified
座面最大高度 1.86 mm 1.86 mm
最大供电电压 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V
标称供电电压 1 V 1 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL
端子节距 1 mm 1 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 20 30
宽度 23 mm 23 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1

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