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89HPES6T6G2ZAAR

产品描述PCI Bus Controller, 19 X 19 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-324
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小745KB,共28页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

89HPES6T6G2ZAAR概述

PCI Bus Controller, 19 X 19 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-324

89HPES6T6G2ZAAR规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明19 X 19 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-324
针数324
Reach Compliance Codecompliant
ECCN代码3A001.A.3
地址总线宽度
最大时钟频率100 MHz
驱动器接口标准IEEE 1149.1
外部数据总线宽度
JESD-30 代码S-XBGA-B324
JESD-609代码e3
长度19 mm
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料UNSPECIFIED
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度3.42 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

文档预览

下载PDF文档
6-Lane 6-Port
Gen2 PCI Express® Switch
®
89HPES6T6G2
Data Sheet
Advance Information*
Device Overview
The 89HPES6T6G2, a 6-lane 6-port Gen2 PCI Express® switch, is a
member of IDT’s PRECISE™ family of PCI Express switching solutions.
The PES6T6G2 is a peripheral chip that performs PCI Express Base
switching with a feature set optimized for servers, storage, communica-
tions, and consumer applications. It provides connectivity and switching
functions between a PCI Express upstream port and five downstream
ports or peer-to-peer switching between downstream ports.
Features
High Performance PCI Express Switch
– Six Gen2 PCI Express lanes supporting 5 Gbps and
2.5 Gbps operation
• One x1 upstream port
• Five x1 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 256 bytes
– Supports one virtual channel and eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates six 5 Gbps / 2.5 Gbps embedded SerDes, 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
6-Port Switch Core / 6 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
(Port 0)
(Port 1)
Figure 1 Internal Block Diagram
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 28
©
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
December 4, 2007
DSC 6930
Advance Information

89HPES6T6G2ZAAR相似产品对比

89HPES6T6G2ZAAR 89HPES6T6G2ZAAL
描述 PCI Bus Controller, 19 X 19 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-324 PCI Bus Controller, 19 X 19 MM, 1 MM PITCH, BGA-324
是否无铅 不含铅 含铅
是否Rohs认证 符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA
包装说明 19 X 19 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-324 19 X 19 MM, 1 MM PITCH, BGA-324
针数 324 324
Reach Compliance Code compliant not_compliant
ECCN代码 3A001.A.3 3A001.A.3
最大时钟频率 100 MHz 100 MHz
驱动器接口标准 IEEE 1149.1 IEEE 1149.1
JESD-30 代码 S-XBGA-B324 S-XBGA-B324
JESD-609代码 e3 e0
长度 19 mm 19 mm
端子数量 324 324
最高工作温度 70 °C 70 °C
封装主体材料 UNSPECIFIED UNSPECIFIED
封装代码 BGA BGA
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 260 225
认证状态 Not Qualified Not Qualified
座面最大高度 3.42 mm 3.42 mm
最大供电电压 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V
标称供电电压 1 V 1 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 Matte Tin (Sn) TIN LEAD
端子形式 BALL BALL
端子节距 1 mm 1 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30
宽度 19 mm 19 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1
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