SURMOUNT
TM
PIN Diode
Features
•
•
•
•
•
•
•
Surface Mount Device
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Power Handling (Efficient Heatsinking)
MA4SPS502
V1
Absolute Maximum Ratings
1
@ TA = +25 °C (unless otherwise
specified)
Parameter
Reverse Voltage
Forward Current
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power (RF & DC)
Mounting Temperature
Absolute Maximum
l -275 V l
600 mA
-65 °C to +150 °C
-65 °C to +125 °C
+175 °C
2W
+235 °C for 10 seconds
Description and Applications
This device is a silicon-glass PIN diode chip
fabricated with M/A-COM’s patented HMIC
TM
process. This device features two silicon pedestals
embedded in a low loss glass. The diode is formed
on the top of one pedestal and connections to the
backside of the device are facilitated by making the
pedestal sidewalls conductive. Selective backside
metalization is applied producing a surface mount
device. The topside is fully encapsulated with silicon
nitride and has an additional polymer layer for
scratch protection. These protective coatings
prevent damage to the junction and the anode
air-bridge during handling and assembly.
These packageless devices are suitable for usage in
moderate incident power (10 W C.W.) or higher
incident peak power (500 W) series, shunt, or
series-shunt switches. Small parasitic inductance,
0.35 nH, and excellent RC time constant, 0.22 pS,
make the devices ideal for wireless TR switch and
accessory switch circuits, where higher P
1dB
and IP
3
values are required.
These diodes can also be used in
π,
T, tapered
resistance, and switched-pad attenuator control
circuits for 50Ω or 75Ω systems.
1. Operation of this device above any one of these parameters
may cause permanent damage.
Case Style ODS-1270
1,2
(Topview)
Dimensions
Dim
A
B
C
D
E
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Inches
Min.
0.058
0.026
0.004
0.020
0.013
Max.
0.062
0.030
0.006
0.022
0.015
Millimeters
Min.
1.47
0.66
0.10
0.51
0.33
Max.
1.57
0.76
0.15
0.56
0.38
1. Backside metal: 0.1 micron thk. gold.
2. Shaded areas indicate bond pads.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT
TM
PIN Diode
Electrical Specifications @ + 25 °C
Symbol
C
T
C
T
R
S
R
S
V
F
V
R
I
R
I
R
R
θJL
T
L
Test Conditions
-40 Volts, 1 MHz
-40 Volts, 1 GHz
100 mA, 100 MHz
20 mA, 100 MHz
10 mA
10
µA
-200 V
-40 V
Steady state
+10 mA / -6 mA measured at 90% voltage
Units
pF
pF
Ω
Ω
V
V
µA
nA
°C/W
µs
8
50
2.8
l -200 l
Min.
Typ.
0.140
0.090
1.4
2.4
0.87
l -275 l
MA4SPS502
V1
Max.
0.200
2.2
3.2
1.00
l -10 l
Handling Procedures
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for
individual components. Bulk handling should insure
that abrasion and mechanical shock are minimized.
circuit trace near the mounting pad while applying 60
to 100 grams of force perpendicular to the top
surface of the die.
Since the HMIC™ glass is transparent, the edges of
the mounting pads closest to each other can be
visually inspected through the die after attach is
completed.
Bonding Techniques
Attachment to a circuit board is made simple through
the use of surface mount technology. Mounting pads
are conveniently located on the bottom surface of
these diodes and are removed from the active junc-
tion locations. These devices are well suited for
solder attachment onto hard and soft substrates.
The use of 80/20 Au/Sn and 60/40 Sn/Pb solder is
recommended, with an equal temperature profile
across the contacts. Conductive epoxy paste for
attachment may also be used.
When soldering these devices to a hard substrate,
hot gas die bonding is preferred. We recommend
utilizing a vacuum tip and a force of 60 to 100 grams
applied normal to the top surface of the device.
When soldering to soft substrates, it is
recommended to use a lead-tin interface at the
circuit board mounting pads. Position the die so that
its mounting pads are aligned with the circuit board’s
mounting pads and reflow the solder by heating the
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Functional Schematic
1
Ls
Rp
Cp
Rvia
Rvia
-
1. Rs = 2 * Rvia + Rp
+
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT
TM
PIN Diode
Typical Performance Curves @ +25 °C
MA4SPS502
V1
Typical Total Resistance R
S
vs. Forward
Current and Frequency
4.0
3.5
3.0
R
S
(ohms)
2.5
2.0
1.5
1.0
0.5
0.0
0.00E+00
2.00E+08
4.00E+08 6.00E+08 8.00E+08 1.00E+09
FREQUENCY (Hz)
100mA
5.00E-14
2.00E-13
Typical Total Capacitance C
P
vs. Reverse
Voltage and Frequency
0V
10mA
20mA
C
P
(F)
1.50E-13
500mA
1.00E-13
-40V
-5V
0.00E+00
0.0E+00
2.0E+08
4.0E+08
6.0E+08
8.0E+08
1.0E+09
FREQUENCY (Hz)
C
P
vs. V
r
@ 100 MHz and 1 GHz
2.0E-13
100MHz
1.5E-13
1.0E+06
R
P
vs. V
r
@ 100 MHz and 1 GHz
100MHz
1.0E-13
1GHz
5.0E-14
R
P
(ohms)
1.0E+05
C
P
(F)
1.0E+04
1GHz
0.0E+00
0
5
10
15
20
25
30
35
40
1.0E+03
0
10
20
30
40
V
r
(V)
V
r
(V)
R
S
vs. I
F
@ 100 MHz and 1 GHz
10
L
S
vs. Frequency @ 10 mA
1.0E-08
R
S
(ohms)
1GHz
Ls (H)
1.0E-09
100MHz
1
0.001
0.010
0.100
1.0E-10
5.00E+08
7.00E+08
9.00E+08
1.10E+09
1.30E+09
1.50E+09
1.70E+09
If (A)
FREQUENCY (Hz)
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
3
SURMOUNT
TM
PIN Diode
MA4SPS502 SPICE Model
MA4SPS502
V1
PinDiodeModel
NLPINM1
Is=1.0E-14 A
Vi=0.0 V
Un=900 cm^2/V-sec
Wi=40 um
Rr=20 K Ohm
Cmin=0.12
pF
Tau=2.8 usec
Rs=0.1 Ohm
Cj0=0.18 pF
Vj=0.7 V
M=0.5
Fc=0.5
Imax=2.5E+7 A/m^2
Kf=0.0
Af=1.0
wBv=200 V
wPmax=2.0 W
Ffe=1.0
MA4SPS502 Schematic
Ls
Cp
Rp
Rvia
Rvia
_
Notes :
Rs = 2 * Rvia + Rp
+
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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