SURMOUNT
TM
PIN Diode
Features
•
•
•
•
•
•
•
Surface Mount Device
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Power Handling (Efficient Heatsinking)
MA4SPS402
V2
Case Style ODS-1253
(Topview to Backside Contacts View)
Description and Applications
This device is a Silicon-Glass PIN diode chip
fabricated with M/A-COM’s patented HMIC
TM
process. This device features two silicon pedestals
embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and
connections to the backside of the device are
facilitated by making the pedestal sidewalls
electrically conductive. Selective backside
metallization is applied producing a surface mount
device. This Vertical Conic Section Topology
provides for Exceptional Heat Transfer. The topside
is fully encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection.
These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
These packageless devices are suitable for usage in
Moderate Incident Power ( 5 W C.W. ) or Higher
Incident Peak Power ( 50 W ) Series, Shunt, or
Series-Shunt Switches. Smaller Parasitic
Inductance, 0.45 nH, and Excellent RC Constant,
0.23 pS, make the devices ideal for Higher
Frequency Switch Elements compared to their
Plastic Device Counterparts.
HSP109
1. Backside metal: 0.1 micron thk. gold.
2. Shaded areas indicate backside bonding pads.
Dimensions
Dim
A
B
C
D
E
Inches
Min.
0.0465
0.0173
0.004
0.0150
0.0140
Max.
0.0505
0.0213
0.006
0.0170
0.0160
Millimeters
Min.
1.181
0.439
0.102
0.381
0.356
Max.
1.283
0.541
0.203
0.432
0.406
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT
TM
PIN Diode
Electrical Specifications @ + 25 °C
Symbol
C
T
C
T
R
S
V
F
V
R
I
R
R
θJL
T
L
Test Conditions
-40 V, 1 MHz
1
-40 V, 1 GHz
1,3
10 mA, 1 GHz
2,3
1.0 mA
-10
µA
-70 V
I
H
=1A, I
L
=10 mA
4
+10 mA / -6 mA
( 50% - 90% V )
Units
pF
pF
Ω
V
V
µA
°C/W
ns
l -70 l
Min.
Typ.
0.055
0.045
5.0
0.90
l –100 l
l -0.1 l
150
200
MA4SPS402
V2
Max.
0.06
5.8
1.00
l -10 l
400
Notes
1. Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar.
2. Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance)
3. Rs and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package with conductive
silver epoxy.
4. Steady-state R
θ
JL measured with die mounted in an ODS-186 package with conductive silver epoxy.
Absolute Maximum Ratings
1
@ TA = +25 °C (unless otherwise
specified)
Parameter
Reverse Voltage
Forward Current
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power (RF & DC)
Mounting Temperature
Absolute Maximum
l -100 V l
250 mA
-55 °C to +125 °C
-55 °C to +150 °C
+175 °C
1000 m W
+235 °C for 10 seconds
1. Operation of this device above any one of these parameters
may cause permanent damage.
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT
TM
PIN Diode
Handling Procedures
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for
individual components. Bulk handling should insure
that abrasion and mechanical shock are minimized.
MA4SPS402
V2
When soldering these devices to a hard substrate,
hot gas die bonding is preferred. We recommend
utilizing a vacuum tip and a force of 60 to 100 grams
applied normal to the top surface of the device.
When soldering to soft substrates, it is
recommended to use a lead-tin interface at the
circuit board mounting pads. Position the die so that
its mounting pads are aligned with the circuit board’s
mounting pads and reflow the solder by heating the
circuit trace near the mounting pad while applying 60
to 100 grams of force perpendicular to the top
surface of the die.
Since the HMIC™ glass is transparent, the edges of
the mounting pads closest to each other can be
visually inspected through the die after attach is
completed.
Bonding Techniques
Attachment to a circuit board is made simple through
the use of surface mount technology. Mounting pads
are conveniently located on the bottom surface of
these diodes and are removed from the active junc-
tion locations. These devices are well suited for
solder attachment onto hard and soft substrates.
The use of 80/20 Au/Sn and 60/40 Sn/Pb solder is
recommended, with an equal temperature profile
across the contacts. Conductive epoxy paste for
attachment may also be used.
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT
TM
PIN Diode
Typical Performance Curves @ +25 °C
R
S
vs. Forward Current and Frequency
20
500uA
15
MA4SPS402
V2
R
s
(Ohms)
1mA
10
2mA
5
10mA
50mA
0
0
100
200
300
400
500
600
700
800
900
1000
Frequency (MHz)
MA4SPS402 Rs vs I at 100 MHZ and 1,000 MHz
1000.0
100 MHz
100.0
Rs_100 MHz
Rs_1,000 MHz
1 GHz
Rs ( Ohms )
10.0
1.0
0.1
0.01
0.10
1.00
I ( mA )
10.00
100.00
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
3
SURMOUNT
TM
PIN Diode
Typical Performance Curves @ +25 °C
C
T
vs. Reverse Voltage and Frequency
MA4SPS402
V2
0.070
0V
0.060
-5V
0.050
-40V
C
p
(pF)
0.040
0.030
0.020
0.010
0.000
0
100
200
300
400
500
600
700
800
900
1000
Frequency (MHz)
M A4SPS402 Ct vs V at 100 MHz and 1,000 MHz
0.060
0.056
0.052
Ct ( pF )
Ct @ 100 MHz
0.048
0.044
Ct @ 1000 MHz
0.040
0.00
10.00
20.00
30.00
40.00
Reverse Voltage ( V )
5
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
3
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