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MA4SPS42

产品描述MA4SPS42
文件大小210KB,共7页
制造商MACOM
官网地址http://www.macom.com
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MA4SPS42概述

MA4SPS42

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SURMOUNT
TM
PIN Diodes
MA4SPS421, MA4SPS422
Features
Surface Mount 100 µm I-Region Length Device
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
Higher Average and Peak Power Handling
MA4SPS420 Series
V2
Absolute Maximum Ratings
1
@ TA = +25 °C
(unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Absolute Maximum
250 mA
l -200 V l
-55 °C to +125 °C
-55 °C to +150 °C
+175 °C
1.8 W
+235 °C for 10 seconds
Description and Applications
This device is a Silicon-Glass PIN diode chip fabricated
with M/A-COM’s patented HMIC
TM
process. This
device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed
on the top of one pedestal and connections to the
backside of the device are facilitated by making the
pedestal sidewalls electrically conductive. Selective
backside metallization is applied producing a surface
mount device. This Vertical Topology provides for
Exceptional Heat Transfer. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
These packageless devices are suitable for usage in
Moderate Incident Power ( 10 W C.W. ) or Higher
Incident Peak Power ( 500 W ) Series, Shunt, or
Series-Shunt Switches. Smaller Parasitic
Inductance, 0.1to 0.2 nH, and Excellent RC
Constant ( 0.45 pS ), make the devices ideal for
Higher Frequency Switch Elements compared to
their Plastic Device Counterparts.
Storage Temperature
Junction Temperature
Dissipated Power (RF & DC)
Mounting Temperature
1. Operation of this device above any one of these parameters
may cause permanent damage.
Case Style ODS-1294
(MA4SPS421)
Case Style ODS-1295
(MA4SPS422)
B
A
C
A
C
Dimensions
Dim
A
B
C
D
E
F
G
Min.
0.040
0.021
0.004
0.013
0.011
0.013
0.019
Inches
Max.
0.042
0.023
0.008
0.015
0.013
0.015
0.021
Millimeters
Min.
1.025
0.525
0.102
0.325
0.275
0.325
0.475
Max.
1.075
0.575
0.203
0.375
0.325
0.375
0.525
1. Backside metal: 0.1 microns thick.
2. Shaded Areas Indicate Backside Ohmic Gold Contacts.
3. Both Devices have Same Outline Dimensions ( A to G ).
D
E
F
G
G
D
E
F
Bottom Side Contacts are Circuit Side
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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