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74LCX573MSA_NL

产品描述Bus Driver, LVC/LCX/Z Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 5.30 MM, LEAD FREE, MO-150, SSOP-20
产品类别逻辑    逻辑   
文件大小652KB,共14页
制造商Fairchild
官网地址http://www.fairchildsemi.com/
下载文档 详细参数 选型对比 全文预览

74LCX573MSA_NL概述

Bus Driver, LVC/LCX/Z Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 5.30 MM, LEAD FREE, MO-150, SSOP-20

74LCX573MSA_NL规格参数

参数名称属性值
厂商名称Fairchild
零件包装代码SSOP
包装说明SSOP,
针数20
Reach Compliance Codeunknown
其他特性BROADSIDE VERSION OF 373
系列LVC/LCX/Z
JESD-30 代码R-PDSO-G20
JESD-609代码e3
长度7.2 mm
逻辑集成电路类型BUS DRIVER
位数8
功能数量1
端口数量2
端子数量20
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码SSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, SHRINK PITCH
传播延迟(tpd)10.5 ns
认证状态Not Qualified
座面最大高度2.05 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
宽度5.3 mm
Base Number Matches1

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74LCX573 — Low Voltage Octal Latch with 5V Tolerant Inputs and Outputs
February 2008
74LCX573
Low Voltage Octal Latch with 5V Tolerant
Inputs and Outputs
Features
5V tolerant inputs and outputs
2.3V–3.6V V
CC
specifications provided
7.0 ns t
PD
max. (V
CC
= 3.3V), 10µA I
CC
max.
Power down high impedance inputs and outputs
Supports live insertion/withdrawal
(1)
±24mA output drive (V
CC
= 3.0V)
Implements patented noise/EMI reduction circuitry
Latch-up performance exceeds JEDEC 78 conditions
ESD performance
General Description
The LCX573 is a high-speed octal latch with buffered
common Latch Enable (LE) and buffered common Out-
put Enable (OE) input.
The LCX573 is functionally identical to the LCX373 but
has inputs and outputs on opposite sides.
The LCX573 is designed for low voltage applications
with capability of interfacing to a 5V signal environment.
The LCX573 is fabricated with an advanced CMOS
tech- nology to achieve high speed operation while
maintaining CMOS low power dissipation.
– Human body model
>
2000V
– Machine model
>
200V
Leadless DQFN package
Note:
1. To ensure the high impedance state during power up
or down, OE should be tied to V
CC
through a pull-up
resistor: the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
Ordering Information
Order
Number
74LCX573WM
74LCX573SJ
74LCX573BQX
(2)
74LCX573MSA
74LCX573MTC
Package
Number
M20B
M20D
MLP20B
MSA20
MTC20
Package Description
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©2006 Fairchild Semiconductor Corporation
74LCX573 Rev. 1.6.0
www.fairchildsemi.com

74LCX573MSA_NL相似产品对比

74LCX573MSA_NL 74LCX573MTC_NL 74LCX573WM_NL 74LCX573WMX_NL
描述 Bus Driver, LVC/LCX/Z Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 5.30 MM, LEAD FREE, MO-150, SSOP-20 Bus Driver, LVC/LCX/Z Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 4.40 MM, LEAD FREE, MO-153AC, TSSOP-20 Bus Driver, LVC/LCX/Z Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 0.300 INCH, LEAD FREE, MS-013, SOIC-20 Bus Driver, LVC/LCX/Z Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 0.300 INCH, LEAD FREE, MS-013, SOIC-20
厂商名称 Fairchild Fairchild Fairchild Fairchild
零件包装代码 SSOP TSSOP SOIC SOIC
包装说明 SSOP, TSSOP, SOP, SOP,
针数 20 20 20 20
Reach Compliance Code unknown unknown unknown unknown
其他特性 BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 373
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
JESD-609代码 e3 e3 e3 e3
长度 7.2 mm 6.5 mm 12.801 mm 12.801 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 8 8 8 8
功能数量 1 1 1 1
端口数量 2 2 2 2
端子数量 20 20 20 20
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SSOP TSSOP SOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE
传播延迟(tpd) 10.5 ns 10.5 ns 10.5 ns 10.5 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.05 mm 1.2 mm 2.642 mm 2.642 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2 V 2 V 2 V 2 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL
宽度 5.3 mm 4.4 mm 7.493 mm 7.493 mm
Base Number Matches 1 1 1 1
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